H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
01/1993
01/07/1993	WO1992013363A3 Light emitting diode bars and arrays and method of making same
01/07/1993	EP0521735A1 Semiconductor memory control device and method of mounting same in high density
01/07/1993	DE4122297A1 Electronic or optical appts. esp. semiconductor appts. - having junctions in the form of metallised bonding pads
01/05/1993	US5177594 Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance
01/05/1993	US5177502 Arrangement for detachably fastening modules to a module carrier
01/05/1993	CA1312387C Hybrid printed circuit board
12/1992
12/30/1992	CN2126465U Luminous wire
12/22/1992	US5173759 Array of light emitting devices or photo detectors with marker regions
12/15/1992	US5172310 Low impedance bus for power electronics
12/15/1992	US5172303 Electronic component assembly
12/15/1992	US5172215 Overcurrent-limiting type semiconductor device
12/10/1992	WO1992017903A3 Three-dimensional multichip module systems and methods of fabrication
12/09/1992	EP0517369A2 Process of manufacturing opto-electronic hybrid modules
12/09/1992	EP0517152A2 Electronic switching device
12/09/1992	EP0516875A1 Module for electronic package
12/09/1992	EP0516866A1 Modular multilayer interwiring structure
12/08/1992	US5170453 Optical module
12/08/1992	US5170337 Low-inductance package for multiple paralleled devices operating at high frequency
12/08/1992	US5170226 Fabrication of quantum devices in compound semiconductor layers and resulting structures
12/08/1992	US5169678 Rendering at specific laser frequency by mixing ultraviolet wavelength absorpted azo dyes with thermoplastic resins
12/08/1992	US5169677 Method for forming lens at end portion of optical apparatus, optical signal transmission apparatus, and optical information processing apparatus
12/02/1992	EP0516185A2 Wafer-scale semiconductor integrated circuit device
12/02/1992	EP0516149A1 Electronic device
12/02/1992	EP0516096A2 Semiconductor device unit having holder and method of mounting semiconductor devices using holder
12/01/1992	US5168425 Mounting arrangements for high voltage/high power semiconductors
12/01/1992	US5168347 Integrated circuit chip package having signal input/output connections located at edges of the substrate
11/1992
11/25/1992	EP0514873A1 Heater type hybrid integrated circuit
11/25/1992	EP0514615A1 Electronic power device realized by a series of elementary semi-conductor components connected in parallel and related manufacturing process
11/24/1992	US5166863 Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling
11/24/1992	US5166760 Semiconductor Schottky barrier device with pn junctions
11/24/1992	US5166564 Rotating rectifier assembly
11/19/1992	EP0514100A2 Fabrication of semiconductor devices in compound semiconductor layers
11/19/1992	EP0513908A2 Opto-electronic coupler
11/19/1992	EP0513521A2 Planarized thin film surface covered wire bonded semiconductor package
11/19/1992	EP0513410A1 Semiconductor power module and method of making such a module
11/17/1992	US5165067 Semiconductor chip packages
11/17/1992	US5164877 Semiconductor device
11/17/1992	US5164624 Modular power semiconductor assembly for an alternator-fed DC power source
11/17/1992	US5164328 Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip
11/12/1992	DE4215467A1 Integration of two semiconductor chips inside standard outline package - uses solder bumps on both dice which are bonded face-to-face in lead-on-chip configuration to lead frame
11/10/1992	US5162971 High-density circuit module and process for producing same
11/10/1992	US5162696 Flexible incasements for LED display panels
11/10/1992	CA1309848C Rectifier and control module for an alternator
11/04/1992	EP0511578A2 A modular construction, power circuit arrangement being highly compact and efficient in terms of heat dissipation
11/04/1992	EP0511218A1 Fabricating eletronic circuitry unit containing stacked ic layers having lead rerouting.
11/03/1992	US5161093 Electronics
11/03/1992	US5161090 Apparatus for controlling the temperature
11/03/1992	US5161000 High-frequency thick-film semiconductor circuit
11/03/1992	US5160999 Acceleration resistant packaging for integrated circuits and method of producing them
11/03/1992	US5160987 Three-dimensional semiconductor structures formed from planar layers
10/1992
10/29/1992	WO1992019013A1 Power semiconductor packaging
10/29/1992	DE4213391A1 Monolithische tandem-solarzelle Monolithic tandem solar cell
10/28/1992	EP0510860A2 Molded optical packaging arrangement
10/28/1992	EP0510267A1 Imaging array devices and staring array imaging systems
10/27/1992	US5159532 Electronic control unit with multiple hybrid circuit assemblies integrated on a single common ceramic carrier
10/27/1992	US5159433 Hybrid integrated circuit device having a particular casing structure
10/24/1992	CA2066819A1 Monolithic tandem solar cell
10/21/1992	EP0509065A1 Ultra high density integrated circuit packages, method and apparatus
10/20/1992	US5157589 Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG 's
10/20/1992	US5157588 Semiconductor package and manufacture thereof
10/20/1992	US5157578 Hybrid printed circuit board
10/20/1992	US5157255 Compact, thermally efficient focal plane array and testing and repair thereof
10/20/1992	US5156999 Packaging method for semiconductor laser/detector devices
10/20/1992	CA1309157C Subassemblies for optoelectronic hybrid integrated circuits
10/15/1992	DE4210643A1 Cooling appts. with conductive medium for semiconductor devices - has thermally highly conductive insulators between coolant and devices and externally insulated container
10/14/1992	EP0508179A2 Circuit device
10/13/1992	US5155067 Testing and rejecting inferior packages
10/06/1992	US5153814 Mounting system for electrical function units, particularly for data technology
10/06/1992	US5153710 Integrated circuit package with laminated backup cell
10/06/1992	US5153709 Improved reliability without entailing the dangers of closed-circuit failure, corrosion and formation of dew
10/06/1992	US5153449 Heatsink bus for electronic switch
10/01/1992	WO1992017045A1 Multi-level/multi-layered hybrid package
09/1992
09/30/1992	EP0506526A1 Hybrid module and its process for manufacture
09/30/1992	EP0506225A2 Integrated circuit chip package
09/30/1992	EP0506146A2 Method of producing sheets of crystalline material
09/30/1992	EP0506122A2 Power module
09/30/1992	EP0505859A1 Electronic package for high density applications
09/30/1992	EP0505842A1 Arrangement with a support, a semi-conductor laser and leads
09/29/1992	US5151559 Planarized thin film surface covered wire bonded semiconductor package
09/29/1992	CA2064319A1 Device including a carrier member, a semiconductor laser and leads
09/28/1992	WO1992017903A2 Three-dimensional multichip module systems and methods of fabrication
09/28/1992	WO1992017901A1 Multichip integrated circuit module and method of fabrication
09/28/1992	CA2106873A1 Three-dimensional multichip module systems and methods of fabrication
09/28/1992	CA2106872A1 Multichip integrated circuit module and method of fabrication
09/23/1992	CN2116962U Luminant diode installed on surphase
09/22/1992	US5150196 Hermetic sealing of wafer scale integrated wafer
09/22/1992	US5150016 LED light source with easily adjustable luminous energy
09/16/1992	EP0503455A2 Electronic assembly group and method of manufacturing electronic assembly groups
09/16/1992	EP0503201A2 Semiconductor device having an interconnecting circuit board and method for manufacturing same
09/15/1992	US5148265 Semiconductor chip assemblies with fan-in leads
09/08/1992	US5146308 Semiconductor package utilizing edge connected semiconductor dice
09/08/1992	US5146303 Compact, thermally efficient focal plane array and testing and repair thereof
09/08/1992	US5144746 Method of assembling compact silicon module for high density integrated circuits
09/03/1992	DE4105152A1 Electronic circuit mounted onto heat sink for efficient cooling - has elements interconnected by bridging strips and uses common base of electrical insulating material
09/02/1992	EP0501474A2 Electronic circuit package
09/01/1992	US5144532 Circuit board assembly
08/1992
08/26/1992	EP0499707A1 Gate turn-off semiconductor power component
08/20/1992	WO1992014264A1 Arrangement of heat-generating structural components in a liquid-cooled device
08/20/1992	DE4103486A1 Anordnung zur kuehlung waermeerzeugender bauelemente Arrangement for cooling devices waermeerzeugender
08/18/1992	US5140407 Semiconductor integrated circuit devices

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