| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/04/1991 | US5021099 Solar cell interconnection and packaging using tape carrier |
| 05/30/1991 | WO1991007777A1 High density multichip package |
| 05/30/1991 | WO1991007775A1 Hybrid circuit structure and methods of fabrication |
| 05/29/1991 | EP0428695A1 Improved three-dimensional circuit component assembly and method corresponding thereto |
| 05/28/1991 | US5019946 High density interconnect with high volumetric efficiency |
| 05/28/1991 | US5019943 High density chip stack having a zigzag-shaped face which accommodates connections between chips |
| 05/28/1991 | US5019893 Single package, multiple, electrically isolated power semiconductor devices |
| 05/28/1991 | US5019177 Monolithic tandem solar cell |
| 05/16/1991 | DE4031051A1 Nodule with semiconductor switch(es) and energising circuit - has metal support body with two assembly surfaces, potentially mutually separated |
| 05/15/1991 | EP0427151A2 Gull-wing zig-zag inline-lead package having end-of-package anchoring pins |
| 05/15/1991 | EP0427143A2 Semiconductor power module |
| 05/15/1991 | EP0427052A1 Method of manufacturing hybrid circuits with an array of equal electronic elements |
| 05/15/1991 | CN1051461A Interchangeable component and its mfg. method for diode with precise forward characteristics |
| 05/14/1991 | US5016138 Three dimensional integrated circuit package |
| 05/14/1991 | US5016089 Substrate for hybrid IC, hybrid IC using the substrate and its applications |
| 05/14/1991 | US5016088 Unit of semiconductor elements |
| 05/08/1991 | EP0425841A1 Assembly of electronic power components |
| 05/08/1991 | DE3936613A1 Hybrid circuit housing reclosable many times without loss of height - has support shoulder on housing tray periphery wall |
| 05/07/1991 | US5013687 Integrated Circuit Assembly |
| 05/02/1991 | EP0424969A2 Method for forming lens at end portion of optical apparatus, optical signal transmission apparatus, and optical information processing apparatus |
| 05/02/1991 | EP0424858A2 Semiconductor device and soldering method employable in manufacturing the same |
| 05/02/1991 | EP0424647A2 Power semiconductor component having carrier plates |
| 05/02/1991 | DE3935792A1 Encapsulated electronic circuit on substrate - has ceramic green sheet foil, forming wall(s) encapsulating housing |
| 04/30/1991 | US5012145 Rotating rectifier assembly for brushless generator |
| 04/30/1991 | US5011246 Housing for an opto-electronic device |
| 04/24/1991 | EP0424062A2 Process for assembling smaller scanning or printing arrays together to form a longer array |
| 04/24/1991 | EP0344259A4 Method and means of fabricating a semiconductor device package |
| 04/23/1991 | US5010447 Divided capacitor mounting pads |
| 04/23/1991 | US5009243 Solar harness |
| 04/18/1991 | WO1991005370A1 Hybrid module electronics package |
| 04/17/1991 | EP0422906A1 Electrodes on a mounting substrate and a liquid crystal display apparatus including same |
| 04/17/1991 | EP0422554A1 Cascade assembly of transistors in parallel realised in hybrid circuit technology |
| 04/16/1991 | US5008776 Zero power IC module |
| 04/10/1991 | EP0183722B1 High density ic module assembly |
| 04/09/1991 | US5006963 Selectable chip carrier |
| 04/09/1991 | US5006925 Three dimensional microelectric packaging |
| 04/09/1991 | US5006924 Heat sink for utilization with high density integrated circuit substrates |
| 04/09/1991 | US5006923 Stackable multilayer substrate for mounting integrated circuits |
| 04/09/1991 | US5006921 Power semiconductor switching apparatus with heat sinks |
| 04/09/1991 | US5006741 A brushless self-excited cooled dynamo |
| 04/09/1991 | CA1282658C Solar module |
| 04/03/1991 | EP0419836A2 3-D integrated circuit assembly employing discrete chips |
| 04/03/1991 | EP0419651A1 Rotating rectifier assembly |
| 04/03/1991 | CN2074504U Colour strip luminotron of semiconductor |
| 04/02/1991 | US5005113 Hybrid circuit module having bridge circuit and rectifying circuit disposed on a same substrate |
| 04/02/1991 | US5004317 Wire bond connection system with cancellation of mutual coupling |
| 04/02/1991 | CA1282467C Method for packaging a microwave tube modulator |
| 03/28/1991 | DE3931238A1 Multi-chip module - with chips carried in book page fashion by specified plastic coating |
| 03/26/1991 | US5003429 Electronic assembly with enhanced heat sinking |
| 03/26/1991 | US5003357 Semiconductor light emitting device |
| 03/26/1991 | US5003209 Reduced length rotating rectifier assembly |
| 03/21/1991 | WO1991003836A1 Rectifier for three-phase current generators in vehicles |
| 03/21/1991 | WO1991003413A1 Package for an integrated circuit structure |
| 03/21/1991 | WO1990015478A3 Improved three-dimensional circuit component assembly and method corresponding thereto |
| 03/20/1991 | EP0417992A2 A stackable multilayer substrate for mounting integrated circuits |
| 03/20/1991 | EP0417887A2 IC card |
| 03/20/1991 | EP0417787A2 Multimold semiconductor device and the manufacturing method therefor |
| 03/20/1991 | EP0417747A2 Module-type semiconductor device of high power capacity |
| 03/19/1991 | US5001376 Rotating rectifier assembly |
| 03/13/1991 | EP0416726A2 Plastic encapsulated package for integrated circuit die |
| 03/12/1991 | US4999484 Multi-chip type image sensor |
| 03/12/1991 | US4999077 Method of fabricating full width scanning or imaging arrays from subunits |
| 03/12/1991 | US4998665 Multilayer bonded structure with projections of high melting and low melting conductive materials |
| 03/07/1991 | WO1991003087A1 Arrangement of a valve stack for high voltage direct current in a valve hall |
| 03/07/1991 | DE3929477A1 LED module for operation as motor vehicle light source - has several LED chips mechanically combined and electrically in series |
| 03/07/1991 | DE3929427A1 Gleichrichtereinrichtung fuer drehstromgeneratoren von fahrzeugen Rectifier means for rotating electric generators of vehicles |
| 03/06/1991 | EP0415795A2 Method of fabricating full width scanning or imaging arrays from subunits |
| 03/06/1991 | EP0415343A2 Integrated circuit device and method for manufacturing the same |
| 03/06/1991 | EP0415106A2 Lead frames for semiconductor device |
| 02/27/1991 | EP0414204A2 Multilayer interconnection substrate and semiconductor integrated circuit device using the same |
| 02/27/1991 | EP0204767B1 Method for fabricating modules comprising stacked circuit-carrying layers |
| 02/26/1991 | US4996630 Hybrid module electronics package |
| 02/26/1991 | US4996629 Circuit board with self-supporting connection between sides |
| 02/26/1991 | US4996588 Device for interconnection and protection of a bare microwave component chip |
| 02/26/1991 | US4996587 Integrated semiconductor chip package |
| 02/26/1991 | US4996585 Electronic package |
| 02/26/1991 | US4996583 Stack type semiconductor package |
| 02/26/1991 | US4996577 Photovoltaic isolator and process of manufacture thereof |
| 02/21/1991 | DE3924823A1 Semiconductor module with several semiconductors on basic substrate - has cover substrate for all semiconductors with conductive track configuration with terminal face(s) |
| 02/20/1991 | EP0413542A2 Direct mount semiconductor package |
| 02/20/1991 | EP0413451A2 Packaging semiconductor chips |
| 02/19/1991 | US4994902 Semiconductor devices and electronic system incorporating them |
| 02/19/1991 | US4994890 Rectifier structure with individual links |
| 02/12/1991 | US4992925 Converter with intermediate d.c. circuit |
| 02/12/1991 | US4992908 Integrated circuit module |
| 02/12/1991 | US4992850 Memory array |
| 02/12/1991 | US4992849 Directly bonded board multiple integrated circuit module |
| 02/07/1991 | WO1990016079A3 Low impedance packaging |
| 02/06/1991 | CN1011563B Circuit arrangement having plurality of electrical elements to be cooled |
| 02/05/1991 | US4991000 Vertically interconnected integrated circuit chip system |
| 02/05/1991 | US4990971 Light emiting diode network |
| 02/05/1991 | US4990462 Using flotation liquid |
| 01/30/1991 | EP0410631A2 Article comprising a stacked array of electronic subassemblies |
| 01/29/1991 | US4989067 Hybrid interconnection structure |
| 01/24/1991 | WO1991000683A2 Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting |
| 01/23/1991 | EP0409290A2 Wafer scale package system and header and method of manufacture thereof |
| 01/23/1991 | EP0409196A2 Plastic molded type semiconductor device |
| 01/22/1991 | US4987477 Solid state imaging device |
| 01/22/1991 | US4987328 Rotating rectifier in brazed assembly |
| 01/15/1991 | US4985753 Semiconductor package |