| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 05/25/1994 | EP0598563A2 Semiconductor conversion device |
| 05/25/1994 | EP0598522A1 Memory module |
| 05/25/1994 | EP0577779A4 Multichip integrated circuit module and method of fabrication |
| 05/25/1994 | EP0577754A4 Three-dimensional multichip module systems and methods of fabrication |
| 05/24/1994 | US5315486 Hermetically packaged HDI electronic system |
| 05/24/1994 | US5315482 Semiconductor apparatus of module installing type |
| 05/19/1994 | DE4238137A1 Hybrid semiconductor structure mfg. system - with semiconductor chips incorporating semiconductor components attached to semiconductor carrier substrate |
| 05/18/1994 | EP0597254A1 Device with power semiconductor components |
| 05/18/1994 | EP0597144A1 Hybrid power electronic device |
| 05/17/1994 | US5313416 Semiconductor memory control device and method of mounting same in high density |
| 05/17/1994 | US5313366 Direct chip attach module (DCAM) |
| 05/17/1994 | US5313097 High density memory module |
| 05/17/1994 | US5313096 IC chip package having chip attached to and wire bonded within an overlying substrate |
| 05/17/1994 | US5313095 Multiple-chip semiconductor device and a method of manufacturing the same |
| 05/17/1994 | US5312674 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| 05/11/1994 | WO1994010600A1 Single crystal silicon tiles for display panels |
| 05/11/1994 | EP0596075A1 Non-conductive end layer for integrated stack of ic chips |
| 05/11/1994 | DE4337675A1 Semiconductor chip package with stepped connecting element surfaces - has wire bonds from chip to upper steps of elements with encapsulation completely enveloping chip on lower steps |
| 05/10/1994 | US5311407 Printed circuit based for mounted semiconductors and other electronic components |
| 05/10/1994 | US5311404 Electrical interconnection substrate with both wire bond and solder contacts |
| 05/10/1994 | US5311401 Stacked chip assembly and manufacturing method therefor |
| 05/10/1994 | US5311400 Low profile header assembly for an encapsulated instrument |
| 05/10/1994 | US5311043 Bidirectional semiconductor switch with hybrid construction |
| 05/04/1994 | EP0595021A1 Improved lead frame package for electronic devices |
| 05/04/1994 | CN2164115Y Luminescent diode indicator |
| 05/04/1994 | CN1086373A Power module |
| 05/03/1994 | US5309318 Thermally enhanced semiconductor chip package |
| 05/03/1994 | US5309020 Packaged semiconductor device assembly including two interconnected packaged semiconductor devices mounted on a common substrate |
| 05/03/1994 | US5309017 Assembly lead frame with common lead arrangement for semiconductor devices |
| 05/03/1994 | US5309011 Wafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed therein |
| 05/03/1994 | US5308980 Thermal mismatch accommodated infrared detector hybrid array |
| 04/27/1994 | EP0594395A2 Semiconductor power module |
| 04/27/1994 | EP0593966A1 Three dimensional high performance interconnection package |
| 04/27/1994 | EP0593666A1 Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting |
| 04/27/1994 | EP0593637A1 Low impedance bus for power electronics |
| 04/27/1994 | CN2163446Y Semiconductor luminotron assemblage |
| 04/27/1994 | CN1086046A Light source and technique for mounting light emitting diodes |
| 04/27/1994 | CN1085854A High power AC traction inverter cooling |
| 04/26/1994 | US5307503 Shielded circuit module with terminal pins arrayed on four sides for connection to a computer board |
| 04/26/1994 | US5307240 Chiplid, multichip semiconductor package design concept |
| 04/26/1994 | US5306948 Semiconductor device and semiconductor module having auxiliary high power supplying terminals |
| 04/26/1994 | US5306866 Module for electronic package |
| 04/26/1994 | US5306670 Multi-chip integrated circuit module and method for fabrication thereof |
| 04/26/1994 | US5306669 Providing bonding mask and electrodes with different sputter-ing rates, performing sputter process to pre-clean electrodes, connecting wires to electrodes of electronic circuit component |
| 04/20/1994 | EP0593330A1 3D-interconnection method for electronic component housings and resulting 3D component |
| 04/19/1994 | US5305186 Power carrier with selective thermal performance |
| 04/19/1994 | US5304823 An equipment protection semiconductor integrated circuit |
| 04/19/1994 | US5304518 Hybrid package, glass ceramic substrate for the hybrid package, and composition for the glass ceramic substrate |
| 04/19/1994 | US5303862 Using a patterned adhesive |
| 04/14/1994 | WO1994008357A1 Power semiconductor integrated circuit package |
| 04/13/1994 | EP0592111A2 Multichip module integrated circuit device having maximum input/output capability |
| 04/13/1994 | EP0592022A1 A direct chip attach module (DCAM) |
| 04/13/1994 | EP0592002A2 Microwave integrated circuit |
| 04/13/1994 | EP0591631A1 Power semiconductor device |
| 04/13/1994 | EP0591500A1 Process for a production of a multispectral photovoltaic component with stacked cells |
| 04/13/1994 | EP0591499A1 Multispectral photovoltaic component |
| 04/12/1994 | US5303121 Multi-chip module board |
| 04/12/1994 | US5303120 Method of manufacturing inversion type IC's and IC module using same |
| 04/12/1994 | US5302856 Semiconductor rectifying device and full-wave rectifier fabricated using the same |
| 04/12/1994 | US5302778 Semiconductor insulation for optical devices |
| 04/06/1994 | EP0590915A1 Chip on board assembly |
| 04/06/1994 | EP0590502A2 Inverter apparatus for electric rolling stock |
| 04/05/1994 | US5300810 Electronic circuit and method with thermal management |
| 04/05/1994 | US5300788 Light emitting diode bars and arrays and method of making same |
| 03/31/1994 | WO1994007267A1 Methods and apparatus for producing integrated circuit devices |
| 03/31/1994 | WO1994007264A1 A thin multichip module |
| 03/30/1994 | CN2160156Y Soft semiconductor colour lighting belt |
| 03/29/1994 | US5299093 Electrical packaging structure and liquid crystal display device having the same |
| 03/29/1994 | US5299092 Plastic sealed type semiconductor apparatus |
| 03/23/1994 | EP0588406A1 Method of manufacturing a block-shaped support body for a semiconductor component |
| 03/23/1994 | EP0588094A1 Semiconductor device with reduced internal inductance |
| 03/23/1994 | EP0588040A2 Light source and technique for mounting light emitting diodes |
| 03/22/1994 | US5297260 Processor having a plurality of CPUS with one CPU being normally connected to common bus |
| 03/22/1994 | US5297006 Three-dimensional multi-chip module |
| 03/22/1994 | US5296916 Mask alignment system for components with extremely sensitive surfaces |
| 03/22/1994 | US5296739 Circuit arrangement with a cooling member |
| 03/22/1994 | US5296735 Power semiconductor module with multiple shielding layers |
| 03/21/1994 | EP0571609A4 Integrated circuit module with devices interconnected by electromagnetic waves. |
| 03/17/1994 | DE4242565C1 Verfahren zur Justage von Halbleiterscheiben zueinander Method for the adjustment of semiconductor wafers to each other |
| 03/16/1994 | EP0587144A2 Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus |
| 03/16/1994 | EP0586888A2 Three-dimensional multichip module |
| 03/16/1994 | EP0586793A2 Half-bridge configuration |
| 03/15/1994 | US5295082 Efficient method for multichip module interconnect |
| 03/15/1994 | US5295045 Plastic-molded-type semiconductor device and producing method therefor |
| 03/15/1994 | US5295044 Semiconductor device |
| 03/10/1994 | DE4330070A1 Semiconductor module for power transistor, IGBT, GTO etc. - has thickness of main support plate over 2.5 times max. thickness of inner support plates |
| 03/09/1994 | EP0586243A1 Method and apparatus for assembling multichip modules |
| 03/09/1994 | EP0586069A2 Memory module and packing method |
| 03/09/1994 | EP0585578A1 Semiconductor device with reduced floating inductance and method of fabricating same |
| 03/08/1994 | US5293302 Electronic part assembly |
| 03/08/1994 | US5293262 Liquid crystal display device having heat-insulating members and driving circuit boards attached to rear edges of light box |
| 03/03/1994 | WO1994005040A1 Power semiconductor packaging |
| 03/03/1994 | WO1994005039A1 Semiconductor wafer for lamination applications |
| 03/03/1994 | WO1994005038A1 Metal electronic package incorporating a multi-chip module |
| 03/03/1994 | CA2142866A1 Metal electronic package incorporating a multi-chip module |
| 03/02/1994 | EP0585186A2 Semiconductor insulation for optical devices |
| 03/02/1994 | EP0584669A1 High density electronics package having stacked circuit boards |
| 03/02/1994 | EP0584668A1 Semi-conductor power module |
| 03/02/1994 | EP0584349A1 Process and device for three-dimensional interconnection of housings for electronic components |
| 03/01/1994 | US5291372 Integral heat sink-terminal member structure of hybrid integrated circuit assembly and method of fabricating hybrid integrated circuit assembly using such structure |