Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
08/1996
08/13/1996US5546274 Three-dimensional compact array of electronic circuitry
08/13/1996US5545924 Three dimensional package for monolithic microwave/millimeterwave integrated circuits
08/13/1996US5545913 Assembly for mounting semiconductor chips in a full-width-array image scanner
08/13/1996US5545291 Transferring shaped block with fluid
08/13/1996US5544412 Method for coupling a power lead to a bond pad in an electronic module
08/08/1996WO1996024162A1 Chip housing and process for producing it
08/08/1996DE19542883A1 Electronic chip package with conductive tracks on inside of cover
08/07/1996EP0725438A2 Capacitor built-in type substrate
08/06/1996US5544038 Synchronous rectifier package for high-efficiency operation
08/06/1996US5544017 Multichip module substrate
08/06/1996US5543791 Non-volatile parallel-to-serial converter system utilizing thin-film floating-gate, amorphous transistors
08/06/1996US5543664 Ultra high density integrated circuit package
08/06/1996US5543663 Semiconductor device and BGA package
08/06/1996US5543660 Stackable vertical thin package/plastic molded lead-on-chip memory cube
08/06/1996US5543659 Package for power semiconductor device with snubber circuit
08/06/1996US5543658 Method of manufacturing resin-sealed semiconductor device, lead frame used in this method for mounting plurality of semiconductor elements, and resin-sealed semiconductor device
08/06/1996US5543640 Logical three dimensional interconnections between integrated circuit chips using a two dimensional multi-chip module
08/01/1996WO1996023396A1 Stackable modules and multimodular assemblies
07/1996
07/30/1996US5541812 Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame
07/30/1996US5541453 Power semiconductor module
07/30/1996US5541448 Electronic circuit card
07/25/1996WO1996022669A2 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
07/25/1996WO1996022622A1 Silicon segment programming method and apparatus
07/25/1996WO1996022620A1 Conductive epoxy flip-chip
07/25/1996DE19516487C1 Vertical integration process for microelectronic system
07/24/1996EP0723245A2 Semi-finished product with electronic module
07/24/1996EP0723244A2 Record carrier with an electronic module
07/24/1996CN2231820Y Homophase antiparallel silicon rectifying combined element
07/24/1996CN1127429A Semiconductor device structure
07/23/1996US5539604 For sensitive electronic circuitry
07/23/1996US5539550 For generating light
07/23/1996US5539324 Universal wafer carrier for wafer level die burn-in
07/23/1996US5539250 Plastic-molded-type semiconductor device
07/23/1996US5539220 Pressure contact semiconductor device in a flat package
07/23/1996CA2045945C Structure and method for the fabrication of lpmcm semiconductor packages
07/18/1996WO1996022008A1 Low-emi electronic apparatus, low-emi circuit board, and method of manufacturing the low-emi circuit board
07/18/1996DE19601372A1 Semiconductor module for power semiconductor
07/17/1996EP0721662A1 Three-dimensional processor using transferred thin film circuits
07/16/1996US5536972 Power module
07/11/1996WO1996021245A1 Electrical circuit suspension system
07/09/1996US5534465 Method for making multichip circuits using active semiconductor substrates
07/09/1996US5534442 Process of providing uniform photoresist thickness on an opto-electronic device
07/09/1996US5533664 Method of manufacturing a semiconductor device
07/03/1996EP0720232A1 Multi-chip module
07/02/1996US5532910 Hybrid integrated circuit and process for producing same
07/02/1996US5532906 Wiring substrate
07/02/1996US5532667 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer
07/02/1996US5532655 Method and apparatus for AC/DC signal multiplexing
07/02/1996US5532519 Cube wireability enhancement with chip-to-chip alignment and thickness control
07/02/1996US5532518 Electrical connect and method of fabrication for semiconductor cube technology
07/02/1996US5532512 Direct stacked and flip chip power semiconductor device structures
07/02/1996US5531022 Method of forming a three dimensional high performance interconnection package
06/1996
06/27/1996DE4444680A1 Multilayer substrate esp. for power semiconductor component
06/26/1996EP0718886A1 Semiconductor power module
06/26/1996EP0431106B1 Packaged electronic circuit with a chip on a gridded area of conductive pads
06/25/1996US5530658 System and method for packing heat producing devices in an array to prevent local overheating
06/25/1996US5530286 Semiconductor device
06/25/1996US5529950 Method for manufacturing a cubically integrated circuit arrangement
06/20/1996WO1996019032A1 Rectifier assembly for automotive alternator
06/19/1996EP0717443A1 Integrated circuit device
06/18/1996US5528474 Led array vehicle lamp
06/18/1996US5528457 Method and structure for balancing encapsulation stresses in a hybrid circuit assembly
06/18/1996US5528456 Package with improved heat transfer structure for semiconductor device
06/18/1996US5528397 Single crystal silicon transistors for display panels
06/18/1996US5528073 Bus bar having reduced parasitic inductances and equal current path lengths
06/13/1996WO1996018210A1 Arrays of optoelectronic devices and method of making same
06/12/1996EP0716450A1 Semiconductor housing comprising a plurality of chips
06/12/1996EP0716449A2 Method for direct attachment of an on-chip bypass capacitor in an integrated circuit
06/12/1996EP0716445A2 Semiconductor device
06/11/1996US5526236 Lighting device used in an exit sign
06/11/1996US5526234 Packaging electrical components
06/11/1996US5526230 3D interconnection process for electronic component packages and resulting 3D components
06/06/1996WO1996017505A1 Method, flip-chip module, and communicator for providing three-dimensional package
06/06/1996WO1996017504A1 Ceramic package and method for forming the same
06/06/1996WO1996017378A1 Electrical contact structures from flexible wire
06/05/1996EP0714555A1 High-voltage breakover diode
06/05/1996DE4445566A1 Optical integrated circuit prodn. process
06/05/1996CN1123975A Infrared rays receiver
06/04/1996US5523619 Integrated circuit structure
06/04/1996US5523608 Solid state imaging device having a solid state image sensor and its peripheral IC mounted on one package
05/1996
05/30/1996WO1996016440A1 Interconnection elements for microelectronic components
05/29/1996EP0714131A1 Inductive signal transfer device between the chip layers of a vertical integrated circuit
05/29/1996EP0714130A1 Capacitive signal transfer device between the chip layers of a vertical integrated circuit
05/29/1996EP0714124A2 Method for bonding a first substrate to a second substrate and application of the method to the fabrication of a three dimensional circuit device
05/29/1996EP0713609A1 Stack of ic chips as substitute for single ic chip
05/28/1996US5521786 Semiconductor module and IC package used for the semiconductor module
05/28/1996US5521437 Semiconductor power module having an improved composite board and method of fabricating the same
05/28/1996US5521434 Semiconductor chip and electronic module with integrated surface interconnects/components
05/28/1996US5521433 IC card including a substrate having improved strength and heat radiation properties
05/28/1996US5521104 Applying protective coating to dielectrics and metal connectors before dry etching
05/23/1996WO1996015577A1 Laminated bus assembly and coupling apparatus for a high power electrical swtiching converter
05/23/1996WO1996015551A1 Mounting electronic components to a circuit board
05/23/1996WO1996015459A1 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
05/23/1996WO1996015458A1 Probe card assembly and kit, and methods of using same
05/22/1996EP0713252A2 Circuit elements mounting
05/22/1996EP0713251A2 Semiconductor conversion device
05/22/1996EP0712534A1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits
05/21/1996US5519596 Moldable nesting frame for light emitting diode array
05/21/1996US5519253 Coaxial switch module
05/21/1996US5519252 Power semiconductor device employing pin block connection arrangement for facilitated and economized manufacture
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