Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/1991
10/22/1991US5060048 Semiconductor component having at least one power mosfet
10/22/1991US5059786 Multi-color coincident infrared detector
10/22/1991US5059557 Method of electrically connecting integrated circuits by edge-insertion in grooved support members
10/22/1991US5059373 Method of manufacturing continuous strip of electronic devices
10/15/1991US5057991 Structure of bridge rectifier
10/15/1991US5057970 Electronic power component circuit
10/15/1991US5057907 Method and structure for forming vertical semiconductor interconnection
10/15/1991US5057906 Plastic molded type semiconductor device
10/15/1991US5057648 High voltage hybrid package
10/15/1991US5057457 Sealed by inner resin, enclosed by outer resin containing wax
10/15/1991US5057376 Heat dissipation of semiconductors; noncracking
10/10/1991DE4107526A1 Light emitting diode with AC current limiter - has current limiting transistors serially coupled to each of anti-parallel LEDs
10/09/1991EP0450950A2 A flexible high density interconnect structure and flexibly interconnected system
10/09/1991EP0450948A2 High density interconnect structure with top mounted components
10/09/1991EP0450832A1 A thyristor stack
10/09/1991EP0450306A1 High-speed diode and method for producing the same
10/08/1991US5055990 Snubber circuit for power conversion semiconductor elements and assembly thereof
10/01/1991US5053920 Integrated power conversion
10/01/1991US5053856 Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices
10/01/1991US5053853 Modular electronic packaging system
10/01/1991US5053852 Molded hybrid IC package and lead frame therefore
10/01/1991US5053358 Method of manufacturing hermetically sealed compression bonded circuit assemblies
09/1991
09/24/1991US5051865 Multi-layer semiconductor device
09/18/1991EP0308465A4 Detector buffer board
09/17/1991US5049982 Article comprising a stacked array of electronic subassemblies
09/17/1991US5049979 Combined flat capacitor and tab integrated circuit chip and method
09/17/1991US5049978 Conductively enclosed hybrid integrated circuit assembly using a silicon substrate
09/17/1991US5049977 Plastic molded type semiconductor device
09/17/1991US5049972 Method of manufacturing semiconductor integrated circuit device
09/11/1991EP0445726A1 Lead frame having at least two islands and resin molded semiconductor device using it
09/11/1991CN2084660U Double colour light emitting diode
09/10/1991US5047835 Lightwave packaging for pairs of optical devices
09/10/1991US5047368 Forming arrangement of conductor paths and integrated circuits on ceramic substrate, filling spaces with sintered nonconducting glass paste, planar, antiaccess material, observation impeding inclusions
09/04/1991EP0183850B1 High-tension thyristor converter
09/03/1991US5045924 Mounting structure of semiconductor converter
09/03/1991US5045922 Installation structure of integrated circuit devices
09/03/1991US5045914 Plastic pad array electronic AC device
09/03/1991US5045685 Analog to digital conversion on multiple channel IC chips
09/03/1991US5045142 Stand-off structure for flipped chip butting
08/1991
08/27/1991US5043859 Half bridge device package, packaged devices and circuits
08/27/1991US5043797 Cooling header connection for a thyristor stack
08/27/1991US5043794 Integrated circuit package and compact assemblies thereof
08/27/1991US5043716 Electronic display with lens matrix
08/27/1991US5043614 Poly-phase
08/27/1991US5043533 Chip package capacitor cover
08/27/1991US5043296 Method of manufacturing LED rows using a temporary rigid auxiliary carrier
08/21/1991EP0442789A1 Remote control system, particularly to lock/unlock car doors
08/20/1991US5041903 Vertical semiconductor interconnection method and structure
08/20/1991US5041695 Heat generating electrical circuit
08/20/1991US5040994 Connector structure for hybrid integrated circuit
08/14/1991EP0441713A1 Remote control system, particularly to lock/unlock car doors
08/14/1991EP0441572A2 Power semiconductor device with heat dissipating property
08/13/1991US5040052 Electronic
08/13/1991US5040050 Hybrid circuit comprising a cascade connection of parallel-transistor stages
08/13/1991CA1287695C Protective carrier for semiconductor packages
08/07/1991EP0440395A1 Alternator rectifier bridge assembly
08/07/1991EP0439919A1 Circuit packaging
08/06/1991US5038201 Wafer scale integrated circuit apparatus
08/06/1991US5038198 Modular semiconductor power device
08/06/1991US5038197 Hermetically sealed die package with floating source
08/06/1991US5038194 Semiconductor device
08/06/1991US5037105 Decorative or display device
08/06/1991CA1287413C Cavity-up-cavity-down multichip integrated circuit package
07/1991
07/31/1991EP0438905A2 IC package having replaceable backup battery
07/31/1991EP0438705A2 Integrated circuit driver inhibit control method for test
07/30/1991US5036024 Method of treating a hardened semiconductor resin encapsulated layer with ultraviolet radiation
07/25/1991WO1991011824A1 Three-dimensional electronic unit and method of construction
07/25/1991CA2049979A1 Three-dimensional electronic unit and method of fabricating same
07/24/1991EP0437960A1 Rotating rectifier assembly
07/24/1991EP0437931A2 Packaging for a pair of optical devices
07/23/1991US5034803 Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies
07/23/1991CA1286796C Double wafer moated signal processor
07/16/1991US5032896 3-D integrated circuit assembly employing discrete chips
07/10/1991EP0436320A2 Laser ablatable polymer dielectrics and methods
07/10/1991EP0436074A1 Wire bond connection system
07/09/1991US5031072 Baseboard for orthogonal chip mount
07/09/1991US5029984 Liquid crystal display device
07/03/1991EP0435586A2 Heat transfer apparatus for an integrated circuit device
07/03/1991EP0435530A2 Hermetic high density interconnected electronic system or other body
07/02/1991US5029322 Power MOSFET with current-monitoring
07/02/1991US5028986 Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
07/02/1991US5028111 Method of fixing cylindrical optical part and electric part
07/02/1991US5027505 Method of producing electronic components
06/1991
06/26/1991EP0434543A2 High-density memory array packaging
06/26/1991EP0434264A2 Package for power semiconductor components
06/26/1991EP0433742A2 Photo module
06/25/1991US5027255 High performance, high current miniaturized low voltage power supply
06/25/1991US5027191 Cavity-down chip carrier with pad grid array
06/25/1991US5027082 Solid state RF power amplifier having improved efficiency and reduced distortion
06/18/1991US5025307 Modular semiconductor device
06/18/1991US5025306 Assembly of semiconductor chips
06/13/1991DE3940892A1 Electrical rectifier array with semiconductor rectifiers - uses symmetrical sus bar arrangement to evenly divide current to individual rectifiers
06/12/1991EP0431586A2 High-power semiconductor device
06/12/1991EP0431420A2 High current rectifier
06/12/1991EP0431106A1 Packaged electronic circuit with a chip on a gridded area of conductive pads.
06/12/1991EP0385979A4 High-density electronic modules, process and product
06/11/1991US5023685 Electromagnetic
06/05/1991EP0430458A2 Semiconductor chip packages
06/05/1991EP0429759A1 Three dimensional microelectronic packaging
06/04/1991US5021926 Construction of bridge rectifiers
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