Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
01/1996
01/18/1996WO1996001498A1 Integrated circuit device
01/18/1996WO1996001497A1 Method of manufacturing three-dimensional circuits
01/17/1996CN2217843Y Multi-wick LED indicating lamp
01/17/1996CN1115169A Fastening base board
01/16/1996US5485021 Semiconductor device with optical waveguides to achieve signal transmission using optical means
01/16/1996US5484959 High density lead-on-package fabrication method and apparatus
01/10/1996EP0691655A1 Module card
01/04/1996WO1996000494A1 Vertical interconnect process for silicon segments
01/02/1996US5481184 Movement actuator/sensor systems
01/02/1996US5481134 Stacked high density interconnected integrated circuit system
01/02/1996US5481133 Three-dimensional multichip package
01/02/1996US5480840 Multi-chip module with multiple compartments
01/02/1996US5480727 Molded lead for power module
12/1995
12/28/1995WO1995035589A1 High impact digital crash data recorder
12/27/1995EP0689243A2 Semiconductor device assembly
12/27/1995EP0689242A1 Encased integral molded plastic multi-chip module substrate and fabrication process
12/26/1995US5479318 Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends
12/26/1995US5479113 User-configurable logic circuits comprising antifuses and multiplexer-based logic modules
12/26/1995US5479043 Multispectral photovoltaic component
12/26/1995US5478781 Polyimide-insulated cube package of stacked semiconductor device chips
12/20/1995EP0688053A1 Low inductance power semiconductor module
12/20/1995EP0340241B1 High density electronic package comprising stacked sub-modules
12/19/1995US5477082 Bi-planar multi-chip module
12/19/1995US5477067 Semiconductor IC device having a RAM interposed between different logic sections and by-pass signal lines extending over the RAM for mutually connecting the logic sections
12/19/1995US5477065 Lateral thin film thyristor with bevel
12/19/1995US5477009 Resealable multichip module and method therefore
12/19/1995US5476211 Method of manufacturing electrical contacts, using a sacrificial member
12/19/1995US5475920 Method of assembling ultra high density integrated circuit packages
12/12/1995US5475514 Transferred single crystal arrayed devices including a light shield for projection displays
12/12/1995US5475417 LED array printhead and method of adjusting light luminance of same
12/12/1995US5475341 Sub-nanoscale electronic systems and devices
12/12/1995US5475262 Functional substrates for packaging semiconductor chips
12/12/1995US5475241 Light source and technique for mounting light emitting diodes
12/07/1995DE19518753A1 Semiconductor device having high reliability
12/06/1995EP0685884A1 Pressure equalizer for an integrated circuit chip interconnected to circuitry on a thin film membrane
12/06/1995EP0685878A2 Semiconductor package and method of forming the same
12/05/1995US5473514 Semiconductor device having an interconnecting circuit board
12/05/1995US5473513 Photosensitive array wherein chips are not thermally matched to the substrate
12/05/1995US5473208 For a rotary electromotive machine
12/05/1995US5473196 Semiconductor memory component comprising stacked memory modules
12/05/1995US5473193 Package for parallel subelement semiconductor devices
12/05/1995US5473191 Hybrid integrated circuit device with apertured cover
12/05/1995US5473188 Semiconductor device of the LOC structure type having a flexible wiring pattern
12/05/1995CA2039417C Molded hybrid ic package and lead frame therefore
11/1995
11/30/1995DE4418617A1 Micro-wiring module with circuit board
11/30/1995DE4418426A1 Semiconductor power modules for motor control inverter
11/29/1995EP0684648A2 Method for producing semiconductor device
11/29/1995EP0683968A1 Module comprising ic memory stack dedicated to and structurally combined with an ic microprocessor
11/29/1995EP0656150A4 Metal electronic package incorporating a multi-chip module.
11/28/1995US5471369 Semiconductor device having a plurality of semiconductor chips
11/28/1995US5471368 Module having vertical peripheral edge connection
11/28/1995US5471366 Multi-chip module having an improved heat dissipation efficiency
11/28/1995US5471089 Semiconductor power module
11/28/1995US5471088 Semiconductor package and method for manufacturing the same
11/28/1995US5470345 For the outer packaging of an implantable medical device
11/23/1995WO1995031827A1 High-voltage breakover diode
11/22/1995EP0683519A2 A hybrid IC
11/22/1995EP0683450A2 Card type semiconductor device and method of manufacturing it
11/22/1995CN1112305A Alternator for vehicle
11/22/1995CN1112304A Alternator for vehicle
11/21/1995US5469131 Hybrid integrated circuit device
11/21/1995US5469103 Diode circuit for high speed switching transistor
11/21/1995US5469020 Flexible large screen display having multiple light emitting elements sandwiched between crossed electrodes
11/21/1995US5468992 Electronic circuit package including plural bare chips mounted on a single wiring substrate
11/21/1995US5468976 Semi conductor rectifying module
11/15/1995EP0682366A2 Mounting of integrated circuit devices
11/15/1995EP0682365A1 Three-dimensional interconnection of electronic component housings using printed circuits
11/14/1995US5466969 Intelligent power device module
11/14/1995US5466634 Electronic modules with interconnected surface metallization layers and fabrication methods therefore
11/14/1995US5465481 Method for fabricating a semiconductor package
11/09/1995WO1995030243A1 Tape application platform and processes therefor
11/09/1995CA2178646A1 Tape application platform and processes therefor
11/08/1995EP0681330A2 Electronic module for removing heat from a semiconductor die and method of making
11/07/1995US5465007 Semiconductor device
11/02/1995WO1995029506A1 Semiconductor integrated circuit device, and method and apparatus for manufacturing it
11/02/1995EP0680147A2 Semiconductor power module and power conversion device
10/1995
10/31/1995US5463252 Solid state circuit breaker
10/31/1995US5463251 Power semiconductor package having improved durability
10/31/1995US5463249 Electronic circuit system unit with wiring substrate
10/31/1995US5463246 Large scale high density semiconductor apparatus
10/31/1995US5463245 Semiconductor integrated circuit device having sealing means
10/31/1995US5463229 For adapted mounting one or more LSI chips for emitting/receiving light
10/31/1995US5461774 Apparatus and method of elastically bowing a base plate
10/26/1995WO1995028744A1 Wafer scale optoelectronic package
10/25/1995EP0592661B1 High power ac traction inverter cooling
10/25/1995CN1110833A Power semiconductor module and circuit arrangement comprising at least two power semiconductor switcmiconduc
10/25/1995CN1030159C Indication module of luminescence diode
10/18/1995EP0677916A2 Power converter assembly with liquid- or air-cooled power semiconductors and DC circuit
10/17/1995US5459655 Neutral-point clamped inverter device using semiconductor modules
10/17/1995US5459356 Power semiconductor module having a plurality of semiconductor arrangements
10/17/1995US5458694 Multispectral photovoltaic component comprising a stack of cells, and method of manufacture
10/17/1995US5457879 Method of shaping inter-substrate plug and receptacles interconnects
10/17/1995US5457878 Method for mounting integrated circuit chips on a mini-board
10/11/1995EP0676805A1 Surface mountable integrated circuit package with low-profile detachable module
10/10/1995US5457605 Electronic device having coplanar heatsink and electrical contacts
10/10/1995US5457604 Semiconductor module device having a desired electrical circuit constituted by combination of seminconductor devices formed on circuit boards
10/10/1995US5457331 A doped multilayer semiconductor responsive to electromagnetic radiation
10/10/1995US5457071 Stackable vertical thin package/plastic molded lead-on-chip memory cube
10/05/1995WO1995026569A1 Fabricating a semiconductor with an insulative coating
10/05/1995WO1995026568A1 Semiconductor component designed for vertical integration, and method of manufacturing the component
1 ... 372 373 374 375 376 377 378 379 380 381 382 383 384 385 386 387 388 389 390 391 392 ... 409