| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/15/1997 | US5621225 Light emitting diode display package |
| 04/14/1997 | CA2187582A1 Edge terminals for electronic circuit modules |
| 04/10/1997 | WO1997008737A3 Circuit arrangement including a hybrid circuit |
| 04/09/1997 | EP0767494A2 Method of fabricating power semiconductor device and lead frame |
| 04/09/1997 | EP0766909A1 Vertical interconnect process for silicon segments |
| 04/09/1997 | EP0527033B1 Semiconductor module |
| 04/09/1997 | CN1147153A Method and apparatus for fabricating self-assembling microstructures |
| 04/08/1997 | US5619067 Semiconductor device package side-by-side stacking and mounting system |
| 04/08/1997 | US5618752 Method of fabrication of surface mountable integrated circuits |
| 04/03/1997 | WO1997012397A1 Microelectronic assemblies including z-axis conductive films |
| 04/03/1997 | DE19639247A1 High capacity logic device for interconnecting and packaging multiple IC chips |
| 04/03/1997 | CA2205810A1 Microelectronic assemblies including z-axis conductive films |
| 04/02/1997 | EP0766410A2 Ultra high frequency radio communication apparatus |
| 04/02/1997 | EP0766311A2 Semiconductor Chip-on-Chip assembly |
| 04/02/1997 | EP0765534A1 High impact digital crash data recorder |
| 04/02/1997 | CN1146637A Large power semiconductor module with pin |
| 04/01/1997 | US5617293 Bridge module |
| 04/01/1997 | US5617131 Image device having a spacer with image arrays disposed in holes thereof |
| 04/01/1997 | US5616962 Semiconductor integrated circuit devices having particular terminal geometry |
| 04/01/1997 | US5616956 Circuit substrate including insulating layer of aluminum nitride and electrically conductive layer of conductive component, aluminum nitride and other components, and semiconductor device containing same |
| 04/01/1997 | US5616955 Power transistor module wiring structure |
| 04/01/1997 | US5616886 Wirebondless module package |
| 03/27/1997 | WO1997011492A1 Semiconductor device and its manufacture |
| 03/27/1997 | WO1997011486A1 Connecting multiple microelectronic elements with lead deformation |
| 03/27/1997 | DE19535129A1 Integrated power switch circuit for inductive load |
| 03/26/1997 | EP0764984A2 Protection housing for semiconductor chips bonded to a circuit substrate by means of bonding wires |
| 03/26/1997 | EP0764916A1 Integrated solid state light emitting and detecting array and apparatus employing said array |
| 03/26/1997 | CN1146089A Alternator including adaptors for rectifier bridge diodes, in particular for motor vehicle, and adaptor for such alternator |
| 03/26/1997 | CN1146073A Structure and production of silicone semiconductor diode and chip and their insulator |
| 03/25/1997 | US5615089 BGA semiconductor device including a plurality of semiconductor chips located on upper and lower surfaces of a first substrate |
| 03/25/1997 | US5614766 Semiconductor device with stacked alternate-facing chips |
| 03/25/1997 | US5614761 Electronic circuit package including plural semiconductor chips formed on a wiring substrate |
| 03/25/1997 | US5614443 Method of producing a frame made of connected semiconductor die mounting substrates |
| 03/25/1997 | US5614441 Process of folding a strip leadframe to superpose two leadframes in a plural semiconductor die encapsulated package |
| 03/25/1997 | US5614277 Monolithic electronic modules--fabrication and structures |
| 03/25/1997 | US5613295 Semiconductor device having an interconnecting circuit board and method for manufacturing same |
| 03/20/1997 | WO1996038858A3 Method and probe card for testing semiconductor devices |
| 03/18/1997 | US5613033 Laminated module for stacking integrated circuits |
| 03/18/1997 | US5612575 Method of connecting the output pads on an integrated circuit chip, and multichip module thus obtained |
| 03/18/1997 | US5612570 Chip stack and method of making same |
| 03/18/1997 | US5612569 Semiconductor device |
| 03/18/1997 | US5612549 Integrated electro-optical package |
| 03/18/1997 | US5612513 Article and method of manufacturing an enclosed electrical circuit using an encapsulant |
| 03/18/1997 | US5611876 Method of making a multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses |
| 03/13/1997 | DE19533298A1 Electronic module with power components |
| 03/12/1997 | EP0762503A2 Photoelectric converter |
| 03/12/1997 | EP0762496A2 Semiconductor power module |
| 03/12/1997 | EP0762495A2 Thermal interface for a heat sink of a plurality of integrated circuits mounted on a substrate |
| 03/12/1997 | EP0762494A1 Silicon semiconductor diode, its circuit module and structure with an insulation body and preparation method thereof |
| 03/12/1997 | EP0585578B1 Semiconductor device with reduced floating inductance and method of fabricating same |
| 03/12/1997 | EP0511218B1 Fabricating eletronic circuitry unit containing stacked ic layers having lead rerouting |
| 03/11/1997 | US5610800 Substrate mounting of circuit components with a low profile |
| 03/11/1997 | US5610799 Power module device |
| 03/11/1997 | US5610747 High density, three-dimensional, intercoupled circuit structure |
| 03/11/1997 | US5610439 Press-contact type semiconductor devices |
| 03/11/1997 | US5610409 Optical FET with diode adjacent gate |
| 03/11/1997 | US5609772 Cube maskless lead open process using chemical mechanical polish/lead-tip expose process |
| 03/06/1997 | WO1997008737A2 Circuit arrangement including a hybrid circuit |
| 03/06/1997 | WO1997001824A3 Stackable data carrier capable of being operated by a data bus |
| 03/06/1997 | DE19633542A1 Leistungsmodul Power module |
| 03/06/1997 | DE19618978A1 Power semiconductor module with armoured casing |
| 03/05/1997 | EP0557318B1 Method of manufacturing semiconductor elements, in particular diodes |
| 03/04/1997 | US5608753 Semiconductor devices incorporating p-type and n-type impurity induced layer disordered material |
| 03/04/1997 | US5608595 Semiconductor power module and power conversion device |
| 03/04/1997 | US5608553 Back light for a liquid crystal display |
| 03/04/1997 | US5608265 Encapsulated semiconductor device package having holes for electrically conductive material |
| 03/04/1997 | US5608264 Surface mountable integrated circuit with conductive vias |
| 03/04/1997 | US5608262 Packaging multi-chip modules without wire-bond interconnection |
| 03/04/1997 | US5608237 Bidirectional semiconductor switch |
| 03/04/1997 | US5607569 Method of fabricating ceramic package body for holding semiconductor devices |
| 02/27/1997 | WO1997007649A1 Method of hermetically encapsulating a crystal oscillator using a thermoplastic shell |
| 02/26/1997 | EP0759637A2 Semiconductor package and mounting method |
| 02/25/1997 | US5606572 Integration of laser with photodiode for feedback control |
| 02/25/1997 | US5606487 Electronic device for offsetting adverse effects of a plurality of chips which repetitively produce large pulses of heat |
| 02/25/1997 | US5605592 Method of manufacturing a bus communication system for stacked high density integrated circuit packages |
| 02/25/1997 | US5604978 Method for cooling of chips using a plurality of materials |
| 02/19/1997 | EP0758487A1 Tape application platform and processes therefor |
| 02/19/1997 | CN1143263A Method for producing single chip electronic device by way of piling IC chip plane array |
| 02/18/1997 | US5604674 Driving circuit module |
| 02/18/1997 | US5604673 Low temperature co-fired ceramic substrates for power converters |
| 02/18/1997 | US5604383 Stabilized power supply device using a flip chip as an active component |
| 02/18/1997 | US5604377 Semiconductor chip high density packaging |
| 02/12/1997 | EP0758145A2 Method of manufacturing circuit module |
| 02/12/1997 | EP0757846A1 Electronic component comprising a thin-film structure with passive elements |
| 02/12/1997 | CN1142687A Power Semiconductor module |
| 02/11/1997 | US5602420 Stacked high mounting density semiconductor devices |
| 02/11/1997 | US5601740 Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires |
| 02/06/1997 | WO1997004518A1 Power semiconductor module |
| 02/06/1997 | CA2227047A1 Power semiconductor module |
| 02/05/1997 | EP0757423A1 Alternator comprising parts for adapting rectifying diodes, especially for car alternators, and adaptor parts for this alternator |
| 02/04/1997 | US5600541 Vertical IC chip stack with discrete chip carriers formed from dielectric tape |
| 02/04/1997 | US5600265 Programmable interconnect architecture |
| 02/04/1997 | US5600181 Hermetically sealed high density multi-chip package |
| 02/04/1997 | US5600130 Two-dimensional optoelectronic array module |
| 01/30/1997 | WO1997003460A1 Bare chip mounted board, method of manufacturing the board, and method of forming electrode of bare chip |
| 01/30/1997 | DE19532653C1 Schaltungsanordnung mit einer Hybridschaltung Circuit arrangement with a hybrid circuit |
| 01/29/1997 | EP0756294A1 Mount for supporting a high frequency transformer over a component on a substrate in a hybrid module and method of assembling the hybrid module |
| 01/28/1997 | US5598038 Resin encapsulated semiconductor device |
| 01/28/1997 | US5598035 Integrated circuit package with external storage capacitor for improved signal quality for sensitive integrated circuit elements |
| 01/28/1997 | US5598033 Micro BGA stacking scheme |