| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/07/1993 | EP0550198A1 A semiconductor integrated circuit comprising a protective device |
| 07/01/1993 | DE4143168A1 Therapeutic system with different light sources for variable light treatment - has radiation unit movable relative to control unit connected together and radiation unit provided with several light sources |
| 06/30/1993 | EP0548882A1 Hybrid optical/electrical circuit module |
| 06/29/1993 | US5223741 Package for an integrated circuit structure |
| 06/29/1993 | US5223672 Hermetically sealed aluminum package for hybrid microcircuits |
| 06/29/1993 | US5223454 Method of manufacturing semiconductor integrated circuit device |
| 06/24/1993 | WO1993012638A1 Extended architecture for field programmable gate array |
| 06/24/1993 | WO1993012585A1 Integrated circuit module with devices interconnected by electromagnetic waves |
| 06/23/1993 | EP0547877A2 Semiconductor power module |
| 06/23/1993 | EP0547807A2 Packaged electronic system |
| 06/22/1993 | US5222014 Three-dimensional multi-chip pad array carrier |
| 06/22/1993 | US5221851 Controlled-turn-off high-power semiconductor component |
| 06/16/1993 | EP0546731A1 Internal wiring structure of a semiconductor device |
| 06/15/1993 | US5220571 Semiconductor laser device |
| 06/15/1993 | US5220491 High packing density module board and electronic device having such module board |
| 06/15/1993 | US5220198 Solid state imaging apparatus in which a solid state imaging device chip and substrate are face-bonded with each other |
| 06/15/1993 | CA1319205C2 Modular integrated circuit device |
| 06/15/1993 | CA1319204C2 Universal integrated circuit module |
| 06/15/1993 | CA1319203C2 Method of building a variety of complex integrated circuits from standardizable components |
| 06/15/1993 | CA1319202C2 Method of testing integrated circuit device |
| 06/09/1993 | EP0357612B1 Electrical switching and control apparatus |
| 06/09/1993 | CN1021174C Semiconductor module |
| 06/08/1993 | US5218357 Miniature modular microwave end-to-end receiver |
| 06/08/1993 | US5218233 Led lamp having particular lead arrangement |
| 06/08/1993 | US5218231 Mold-type semiconductor device |
| 05/26/1993 | EP0404789B1 Assembly process for producing led rows |
| 05/25/1993 | US5214246 Grooved package for hybrid components |
| 05/19/1993 | EP0542532A2 Package structure of a semiconductor device having a built-in capacitor |
| 05/18/1993 | US5212627 Electronic module housing and assembly with integral heatsink |
| 05/18/1993 | US5212406 High density packaging of solid state devices |
| 05/06/1993 | DE4136355A1 Three=dimensional assembly of electronic components and sensors, e.g. for accelerometer mfr. - interconnecting substrates with solder joints, conductive adhesive or wire bonds to edges of polyhedron |
| 05/05/1993 | EP0540247A2 Formulation of multichip modules |
| 05/04/1993 | US5208729 Multi-chip module |
| 04/29/1993 | WO1993008601A1 Mounting arrangements for high voltage/high power semiconductors |
| 04/29/1993 | CA2096245A1 Mounting arrangements for high voltage/high power semiconductors |
| 04/28/1993 | CN2131206Y Non-magnetic low-temp large power tube |
| 04/27/1993 | US5206793 Diode with electrodes and case assembled without soldering or crimping, and rectifier bridge made with such diodes |
| 04/27/1993 | US5206749 Liquid crystal display having essentially single crystal transistors pixels and driving circuits |
| 04/21/1993 | EP0538003A1 Method of manufacturing inversion type ICs and IC module using same |
| 04/15/1993 | WO1993007659A1 Direct integrated circuit interconnection system |
| 04/15/1993 | DE4133829A1 Hybrid component with electronic circuit on rectangular substrate - having row of glued terminal legs on each plate side |
| 04/14/1993 | EP0536739A2 Electrical packaging structure and liquid crystal display device having the same |
| 04/14/1993 | EP0279814B1 Thermally insulative and electrically conductive interconnect and process for making same |
| 04/14/1993 | CN2129978Y Feed semiconductor luminescent belt |
| 04/13/1993 | US5202754 Three-dimensional multichip packages and methods of fabrication |
| 04/13/1993 | US5202578 Module-type semiconductor device of high power capacity |
| 04/07/1993 | EP0535479A1 Multichip integrated circuit packages and systems |
| 04/07/1993 | CN2129472Y Combined signal indicating lamp |
| 04/06/1993 | US5200847 Liquid crystal display device having driving circuit forming on a heat-resistant sub-substrate |
| 04/06/1993 | US5200810 High density interconnect structure with top mounted components |
| 04/06/1993 | US5200640 Hermetic package having covers and a base providing for direct electrical connection |
| 04/06/1993 | US5200612 Photodetector carrier for improving the high speed of a photodetector and method for producing same |
| 04/06/1993 | US5199165 Heat pipe-electrical interconnect integration method for chip modules |
| 04/06/1993 | US5199164 Stacking upper and lower members to minimize size, forming heat sinks for improved heat emission |
| 03/30/1993 | US5198963 Multiple integrated circuit module which simplifies handling and testing |
| 03/30/1993 | US5198888 Semiconductor stacked device |
| 03/30/1993 | US5198684 Semiconductor integrated circuit device with optical transmit-receive means |
| 03/30/1993 | US5198479 Light transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewith |
| 03/24/1993 | EP0533158A2 Power conversion device and semiconductor module suitable for use in the device |
| 03/24/1993 | EP0533087A1 Container for optical pulse-emitting/receiving devices |
| 03/23/1993 | US5196920 Semiconductor integrated circuit device for limiting capacitive coupling between adjacent circuit blocks |
| 03/23/1993 | US5196918 Integrated circuit device and method for manufacturing the same |
| 03/23/1993 | US5195237 Flying leads for integrated circuits |
| 03/18/1993 | WO1993005631A1 Power electronics substrate and process for making it |
| 03/17/1993 | EP0531984A1 Electronic circuit for semi-conductor power components |
| 03/17/1993 | EP0531724A1 Stepped electronic device package |
| 03/17/1993 | EP0531723A1 Three-dimensional multichip packaging method |
| 03/16/1993 | CA1314614C Quantum-well radiation detector |
| 03/11/1993 | DE4129835A1 Leistungselektroniksubstrat und verfahren zu dessen herstellung Power electronics substrate and method for its production |
| 03/10/1993 | EP0531186A1 Signalling light with electroluminescent elements, especially for motor vehicles |
| 03/10/1993 | EP0531185A1 Supporting structure, especially for signalling lights of motor vehicles, and its manufacturing process |
| 03/10/1993 | EP0531184A1 Optical collimating element with its supporting structure, especially for signalling lights of motor vehicles |
| 03/10/1993 | EP0356509B1 Very high-acceleration tolerant circuit card packaging structure |
| 03/10/1993 | EP0333803B1 Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds |
| 03/03/1993 | CA2075272A1 Electroluminescent element-based signal light, namely for automotive vehicles |
| 03/02/1993 | US5191404 High density memory array packaging |
| 03/02/1993 | US5191324 Remote control system for locking/unlocking the doors of motor vehicles with aspherical toroidal lens containing multiple photodetectors |
| 03/02/1993 | US5191224 Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein |
| 02/24/1993 | EP0528684A2 Thin type semiconductor device |
| 02/24/1993 | EP0528367A1 Three-dimensional multi-chip module |
| 02/17/1993 | EP0527583A2 Method and apparatus for interconnecting devices using TAB in board technology |
| 02/16/1993 | USRE34179 Temperature controlled hybrid assembly |
| 02/10/1993 | EP0527044A1 Memory package |
| 02/10/1993 | EP0527033A2 Semiconductor module |
| 02/10/1993 | EP0511218A4 Fabricating eletronic circuitry unit containing stacked ic layers having lead rerouting |
| 02/10/1993 | CN1068880A Long service life energy-saving signal lamp for screen |
| 02/09/1993 | US5185292 Process for forming extremely thin edge-connectable integrated circuit structure |
| 02/03/1993 | EP0526063A1 Integrated circuit package with laminated backup cell and interconnect media therefor |
| 02/03/1993 | EP0525651A1 Package structure for one or more IC chips |
| 02/02/1993 | US5184284 Method and apparatus for implementing engineering changes for integrated circuit module |
| 01/26/1993 | US5182632 High density multichip package with interconnect structure and heatsink |
| 01/26/1993 | US5182628 Semiconductor device having particular solder interconnection arrangement |
| 01/25/1993 | CA2074575A1 Packaging structure for one or more ic chips |
| 01/21/1993 | WO1993001648A1 Low impedance bus for power electronics |
| 01/21/1993 | DE4222785A1 Improvement of high frequency operation of discrete MOSFET - by removal of an external parasitic capacitance between drain and gate, by mounting the external gate contact above the source contact |
| 01/21/1993 | CA2113172A1 Low impedance bus for power electronics |
| 01/20/1993 | EP0472587A4 Housing for an opto-electronic device |
| 01/13/1993 | EP0522518A2 Stacked chip assembly and manufacturing method therefor |
| 01/10/1993 | CA2073363A1 Stacked chip assembly and manufacturing method therefor |
| 01/07/1993 | WO1993000703A1 Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting |