Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
01/1997
01/23/1997WO1997002596A1 Electronic component and method of production thereof
01/22/1997EP0755083A2 Housing for LED with a socket corrector and shunt resistance and method of fabrication
01/22/1997EP0755075A2 A tape carrier package
01/21/1997US5596227 Ball grid array type semiconductor device
01/21/1997US5596226 Semiconductor chip having a chip metal layer and a transfer metal and corresponding electronic module
01/16/1997WO1997001824A2 Stackable data carrier capable of being operated by a data bus
01/15/1997EP0753204A1 Method of froming semiconductor component designed for vertical integration and use for testing purposes
01/15/1997EP0753180A1 Method of manufacturing a chip card, and chip card thus produced
01/14/1997US5594424 Indicating displays for motor vehicles
01/14/1997US5594330 Movement actuator/sensor systems
01/14/1997US5594275 J-leaded semiconductor package having a plurality of stacked ball grid array packages
01/14/1997US5594260 Photoelectric converter with photoelectric conversion devices mounted separately from wiring boards
01/14/1997US5593927 Method for packaging semiconductor dice
01/14/1997US5592735 Method of making a multi-chip module having an improved heat dissipation efficiency
01/08/1997EP0752750A2 Thyristor module
01/08/1997EP0752720A2 Lead for semiconductor device
01/07/1997US5592364 High density integrated circuit module with complex electrical interconnect rails
01/07/1997US5592018 Membrane dielectric isolation IC fabrication
01/07/1997US5592007 Membrane dielectric isolation transistor fabrication
01/07/1997CA2101140C High density electronics package having stacked circuit boards
01/03/1997WO1997000598A1 Connection substrate
01/02/1997EP0751570A2 Combined electronic logic power module
01/02/1997EP0751568A2 Light-emitting device assembly and method of fabricating same
12/1996
12/31/1996US5589711 Semiconductor package
12/31/1996US5589709 Lead frame capacitor and capacitively-coupled isolator circuit using same
12/31/1996US5589692 Sub-nanoscale electronic systems and devices
12/31/1996US5588994 Method of producing sheets of crystalline material and devices made therefrom
12/31/1996US5588205 Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
12/27/1996WO1996042107A1 Semiconductor device, wiring board for mounting semiconductor and method of production of semiconductor device
12/27/1996EP0750452A1 Electronic power switch for motor vehicles
12/27/1996EP0750345A2 Power semiconductor module
12/27/1996EP0750344A2 Semiconductor power module with connection pins
12/27/1996EP0705530B1 Converter module
12/24/1996US5587882 Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
12/24/1996US5587341 Process for manufacturing a stacked integrated circuit package
12/24/1996US5586389 Method for producing multi-board electronic device
12/24/1996US5586388 Method for producing multi-board electronic device
12/19/1996WO1996041378A1 Semiconductor die carrier having double-sided die attach plate
12/19/1996WO1996041376A1 Mesh planes for multilayer module
12/19/1996WO1996041372A1 Method and apparatus for fabricating self-assembling microstructures
12/19/1996WO1996041204A1 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
12/17/1996US5586009 Bus communication system for stacked high density integrated circuit packages
12/17/1996US5586006 Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together
12/17/1996US5585675 Semiconductor die packaging tub having angularly offset pad-to-pad via structure configured to allow three-dimensional stacking and electrical interconnections among multiple identical tubs
12/17/1996US5585672 Semiconductor module with an improved heat sink/insulation plate arrangement
12/11/1996EP0747955A2 Hybrid circuit and method of fabrication
12/11/1996EP0747949A2 Wirebondless module package and method of fabrication
12/11/1996EP0747948A2 Method and apparatus for fabricating self-assembling microstructures
12/10/1996US5583748 Semiconductor module having multiple circuit boards
12/10/1996US5583375 Semiconductor device with lead structure within the planar area of the device
12/10/1996US5583350 Full color light emitting diode display assembly
12/10/1996US5583349 Full color light emitting diode display
12/10/1996US5583335 Method of making an eye tracking system having an active matrix display
12/08/1996CA2177219A1 Method and apparatus for fabricating self-assembling microstructures
12/05/1996WO1996038858A2 Method and probe card for testing semiconductor devices
12/04/1996EP0746023A2 Multichip press-contact type semiconductor device
12/04/1996EP0746022A1 Hybrid multi-chip module and method of fabricating
12/04/1996EP0745274A1 Process for producing a three-dimensional circuit
12/04/1996CN1137329A Method for fabricating self-assembling microstructures
12/03/1996US5581498 For use in an electronic host system
12/03/1996US5581121 Warp-resistant ultra-thin integrated circuit package
12/03/1996US5581094 Photodetector, a photodector array comprising photodetectors, an object detector comprising the photodetecter array and an object detecting procedure
12/03/1996US5580687 Contact stepper printed lithography method
11/1996
11/28/1996WO1996037931A1 Spring element electrical contact and methods
11/28/1996WO1996037917A1 Semiconductor assembly
11/28/1996WO1996037334A1 Method and apparatus for shaping spring elements
11/28/1996WO1996037333A1 Ribbon-like core interconnection elements
11/28/1996WO1996037332A1 Fabricating interconnects and tips using sacrificial substrates
11/28/1996WO1996037331A1 Wire bonding, severing, and ball forming
11/28/1996WO1996030944A3 Support module
11/28/1996DE19519538A1 Power semiconductor circuit with multiple paired power semiconductor devices
11/28/1996CA2221931A1 Semiconductor assembly
11/27/1996EP0744084A1 Semiconductor storage component with a plurality of storage chips in a shared casing
11/26/1996US5579217 Laminated bus assembly and coupling apparatus for a high power electrical switching converter
11/26/1996US5579208 Semiconductor device having a plurality of semiconductor chips
11/26/1996US5579207 Three-dimensional integrated circuit stacking
11/26/1996US5578869 For an electronic package
11/26/1996US5578866 Method of manufacturing a block-shaped support body for a semiconductor component
11/26/1996US5578162 Integrated composite semiconductor devices and method for manufacture thereof
11/21/1996WO1996036496A1 Semiconductor device
11/21/1996DE19543540C1 Vertically integrated semiconductor component
11/20/1996EP0743743A2 Circuit arrangement for a power supply flyback converter
11/20/1996EP0683968A4 Module comprising ic memory stack dedicated to and structurally combined with an ic microprocessor.
11/20/1996CN1136221A Shell of semiconductor pressure contactor
11/19/1996US5577064 Integration of laser with photodiode for feedback control
11/19/1996US5576934 Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board
11/19/1996US5576869 Liquid crystal display apparatus including an electrode wiring having pads of molybdenum formed on portions of input and output wiring
11/19/1996US5576575 Semiconductor conversion device
11/14/1996DE19531496C1 Power semiconductor module with high packing density, esp. current resetter
11/14/1996DE19516548A1 Abdeckkappe für elektronisches Bauelement Cap for electronic component
11/13/1996EP0741594A1 Photo-thermal therapeutic device and method
11/12/1996US5574402 Monolithic integrated circuit device having microwave power amplifier including a matching circuit using distributed lines
11/12/1996US5574312 Low-inductance power semiconductor module
11/07/1996WO1996035233A1 Cover for an electronic component
11/07/1996DE19523793C1 Stacking memory card connected to bus system
11/07/1996DE19523010A1 ASIC circuitry with power transistor and its energising circuit
11/07/1996DE19515189A1 Chip-Abdeckung Chip cover
11/07/1996DE19515188A1 Chip-Abdeckung Chip cover
11/06/1996CN1135268A Contact structure for interconnections, interposer, semiconductor assembly and method
11/05/1996US5572457 Module board including conductor tracks having disconnectable connecting elements
1 ... 368 369 370 371 372 373 374 375 376 377 378 379 380 381 382 383 384 385 386 387 388 ... 409