| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/21/1996 | US5517754 Fabrication processes for monolithic electronic modules |
| 05/15/1996 | EP0712161A1 Semiconductor assembly for a free space bidirectional optical transmission system |
| 05/14/1996 | US5517057 Electronic modules with interconnected surface metallization layers |
| 05/09/1996 | WO1996013865A1 Three-colour sensor |
| 05/09/1996 | WO1996013793A1 Method of making radio frequency identification tags |
| 05/09/1996 | DE4439202A1 Rectifier for three=phase alternator of motor vehicle |
| 05/08/1996 | EP0710985A1 X-ray image sensor |
| 05/08/1996 | EP0710983A2 Bridge module |
| 05/07/1996 | US5514907 Apparatus for stacking semiconductor chips |
| 05/02/1996 | WO1996013062A1 Apparatus and method of manufacturing stacked wafer array |
| 05/01/1996 | EP0438705B1 Integrated circuit driver inhibit control method for test |
| 04/30/1996 | US5513072 Power module using IMS as heat spreader |
| 04/30/1996 | US5512790 Triaxial double switch module |
| 04/30/1996 | US5512783 Semiconductor chip packages |
| 04/30/1996 | US5512782 Semiconductor device for DC/AC converter |
| 04/25/1996 | WO1996012296A1 Semiconductor device and its manufacture |
| 04/24/1996 | EP0708485A1 Semiconductor chip and electronic module with integrated surface interconnects/components and fabrication methods therefor |
| 04/24/1996 | EP0708484A1 Three-dimensional integrated circuit stacking |
| 04/23/1996 | US5510956 Electronic part unit or assembly having a plurality of electronic parts enclosed within a metal enclosure member mounted on a wiring layer |
| 04/23/1996 | US5510730 Reconfigurable programmable interconnect architecture |
| 04/23/1996 | US5510273 Process of mounting semiconductor chips in a full-width-array image |
| 04/18/1996 | DE19514908C1 Large scale solar panels for building and vehicles |
| 04/17/1996 | CN1120737A Semiconductor module with low inductance power |
| 04/16/1996 | US5508565 Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package |
| 04/16/1996 | US5508563 Semiconductor assembly having laminated semiconductor devices |
| 04/16/1996 | US5508559 Power circuit package |
| 04/10/1996 | EP0706221A2 Semiconductor device comprising a plurality of semiconductor elements |
| 04/10/1996 | EP0706220A1 Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging |
| 04/10/1996 | EP0706219A1 Method and apparatus for a stress relieved electronic module |
| 04/10/1996 | EP0706218A2 Method to eliminate errors in a rectifying circuit device |
| 04/10/1996 | EP0706217A2 IC contacts having improved electromigration characteristics and fabrication methods therefor |
| 04/10/1996 | EP0705529A1 Method and apparatus for non-conductively interconnecting integrated circuits |
| 04/09/1996 | US5506753 Method and apparatus for a stress relieved electronic module |
| 04/09/1996 | US5506452 Power semiconductor component with pressure contact |
| 04/09/1996 | US5506447 Hybrid integrated circuit |
| 04/09/1996 | US5505789 Line-focus photovoltaic module using solid optical secondaries for improved radiation resistance |
| 04/04/1996 | WO1996010265A1 Chip packaging technique |
| 04/03/1996 | EP0704897A2 Semiconductor device |
| 04/03/1996 | CN1119788A Method and apparatus for a stress relieved electronic module |
| 04/02/1996 | US5504372 Adhesively sealed metal electronic package incorporating a multi-chip module |
| 03/27/1996 | EP0703619A1 Method for fabricating a three dimensional integrated circuit for a higher system gain achievement |
| 03/27/1996 | EP0703618A1 Method for fabricating a three dimensional integrated circuit |
| 03/27/1996 | CN1119345A Semiconductor device and method for fabricating the same |
| 03/27/1996 | CN1119343A Method for producing semiconductor device |
| 03/26/1996 | US5502667 Integrated multichip memory module structure |
| 03/26/1996 | US5502621 Mirrored pin assignment for two sided multi-chip layout |
| 03/26/1996 | US5502333 Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit |
| 03/26/1996 | US5502316 Wafer bonding of light emitting diode layers |
| 03/26/1996 | US5502289 Circuit assembly |
| 03/26/1996 | US5502278 Encased electronic circuit with chip on a grid zone of conductive contacts |
| 03/26/1996 | US5501003 Method of assembling electronic packages for surface mount applications |
| 03/21/1996 | DE19534382A1 Monolithic IC with microwave power amplifier for mobile communications equipment |
| 03/20/1996 | EP0702511A2 Packaging electrical components |
| 03/20/1996 | EP0702509A2 Packaging electrical components |
| 03/20/1996 | EP0702409A1 Stack of series-connected photosensitive thyristors |
| 03/20/1996 | EP0702406A2 Press-contact type semiconductor devices |
| 03/19/1996 | US5500787 Electrodes on a mounting substrate and a liquid crystal display apparatus including same |
| 03/19/1996 | US5500540 Wafer scale optoelectronic package |
| 03/13/1996 | EP0701284A1 A semiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the same |
| 03/12/1996 | US5499164 High impact digital crash data recorder |
| 03/12/1996 | US5499160 High density integrated circuit module with snap-on rail assemblies |
| 03/12/1996 | US5499124 Polysilicon transistors formed on an insulation layer which is adjacent to a liquid crystal material |
| 03/12/1996 | US5498907 Interconnection arrangement for power semiconductor switching devices |
| 03/12/1996 | US5498903 Surface mountable integrated circuit package with integrated battery mount |
| 03/12/1996 | US5498902 Semiconductor device and its manufacturing method |
| 03/07/1996 | WO1996007206A1 Semiconductor rectifier module |
| 03/06/1996 | EP0700088A2 Semiconductor device and comprising two semiconductor substrates |
| 03/05/1996 | US5497291 Power semiconductor device including terminal plates located between two substrates that functions as electrical connectors and mechanical supports |
| 03/05/1996 | US5497033 Embedded substrate for integrated circuit modules |
| 03/05/1996 | US5497027 Multi-chip module packaging system |
| 03/05/1996 | US5495889 Cooling device for power electronic components |
| 02/29/1996 | WO1996006459A1 Component stacking in multi-chip semiconductor packages |
| 02/28/1996 | EP0698294A1 Logical three-dimensional interconnections between integrated circuit chips using a two-dimensional multi-chip module package |
| 02/28/1996 | EP0698289A1 Contact structure for vertical chip connections |
| 02/28/1996 | EP0698288A1 Process for producing vertically connected semiconductor components |
| 02/27/1996 | US5495398 Circuit assembly |
| 02/27/1996 | US5495397 Three dimensional package and architecture for high performance computer |
| 02/27/1996 | US5495394 Three dimensional die packaging in multi-chip modules |
| 02/27/1996 | CA2056781C Multichip module |
| 02/21/1996 | EP0697732A2 Driving circuit module |
| 02/20/1996 | US5493476 Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends |
| 02/20/1996 | US5492586 Method for fabricating encased molded multi-chip module substrate |
| 02/15/1996 | WO1996004683A1 Method of manufacturing a three-dimensional circuit |
| 02/15/1996 | DE4427516A1 3-Dimensional IC mfg. process |
| 02/14/1996 | EP0696818A2 Semiconductor element with insulating package |
| 02/13/1996 | US5491612 Three-dimensional modular assembly of integrated circuits |
| 02/13/1996 | US5491349 Multi-color light emitting device |
| 02/07/1996 | EP0695494A1 Electronic module comprising a stack of ic chips |
| 02/07/1996 | CN1116372A Single-phase high voltage rectification equipment |
| 02/06/1996 | US5490041 Semiconductor integrated circuit module and a semiconductor integrated circuit device stacking the same |
| 02/06/1996 | US5489554 Method of making a 3-dimensional circuit assembly having electrical contacts that extend through the IC layer |
| 02/06/1996 | CA2033258C Alternator rectifier bridge and method of assembly |
| 02/06/1996 | CA2017743C Ultra-tall indium or alloy bump array for ir detector hybrids and micro-electronics |
| 02/01/1996 | WO1996003020A1 Integrally bumped electronic package components |
| 01/31/1996 | EP0694968A2 Multi-chip module semiconductor device |
| 01/30/1996 | US5488542 MCM manufactured by using thin film multilevel interconnection technique |
| 01/30/1996 | US5488256 Semiconductor device with interconnect substrates |
| 01/30/1996 | CA2066002C Fabrication of quantum devices in compound semiconductor layers and resulting structures |
| 01/27/1996 | CA2154719A1 Multi-chip module semiconductor device |
| 01/25/1996 | DE19526511A1 PCB mounting applications of an encapsulated semiconductor package |