| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/25/1997 | EP0780899A2 Semiconductor assembly |
| 06/25/1997 | EP0780898A1 Semiconductor device comprising semiconductor power elements |
| 06/25/1997 | EP0780893A2 Semiconductor device and method of manufacturing the same |
| 06/25/1997 | CN1152797A Elements with resin shell capsulation and making method |
| 06/24/1997 | US5642276 High frequency surface mount transformer-diode power module |
| 06/24/1997 | US5642262 High-density programmable logic device in a multi-chip module package with improved interconnect scheme |
| 06/24/1997 | US5640762 Method and apparatus for manufacturing known good semiconductor die |
| 06/24/1997 | US5640760 Method for the 3D interconnection of packages of electronic components using printed circuit boards |
| 06/24/1997 | US5640746 Sealing the cavity by filling with adhesives, curing |
| 06/19/1997 | WO1997017721A3 Method for making a circuit structure having a flip-mounted matrix of devices |
| 06/19/1997 | WO1997016866A3 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices |
| 06/17/1997 | US5640049 Metal interconnect structures for use with integrated circuit devices to form integrated circuit structures |
| 06/17/1997 | US5639990 Solid printed substrate and electronic circuit package using the same |
| 06/17/1997 | US5639683 Structure and method for intergrating microwave components on a substrate |
| 06/12/1997 | WO1997021246A1 Heterolithic microwave integrated impedance matching circuitry and method of manufacture |
| 06/12/1997 | DE19645971A1 Gehäusungssystem, für Feldeffekttransistoren Gehäusungssystem, for field-effect transistors |
| 06/10/1997 | US5637918 Semiconductor stack |
| 06/10/1997 | US5637912 Three-dimensional monolithic electronic module having stacked planar arrays of integrated circuit chips |
| 06/10/1997 | US5637907 Three dimensional semiconductor circuit structure with optical interconnection |
| 06/10/1997 | US5637885 Method for producing a microsystem and forming a microsystem laser therefrom |
| 06/10/1997 | US5637536 Connecting leads to pads, stacking the wafers, embedding stacks by seelctively removable material, forming conncetions on the faces of the stack for interconnecting the leads, removing selectively removable material |
| 06/05/1997 | WO1997017720A3 Circuit structure having a flip-mounted matrix of devices |
| 06/05/1997 | DE19641875A1 HF circuit for high frequency semiconductor chip |
| 06/04/1997 | EP0777280A2 Passivation of organic devices |
| 06/04/1997 | EP0777277A1 Ionizing radiation detector |
| 06/04/1997 | EP0777276A2 Integrated electro-optical package |
| 06/04/1997 | EP0777275A2 Semiconductor module with heat sink |
| 06/04/1997 | EP0777274A1 A high density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate |
| 06/04/1997 | EP0777273A2 Semiconductor device |
| 06/04/1997 | EP0777272A2 Semiconductor device |
| 06/03/1997 | US5635846 Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer |
| 06/03/1997 | US5635760 Surface mount semiconductor device |
| 06/03/1997 | US5635757 Power semiconductor module and circuit arrangement comprising at least two power semiconductor switch modules |
| 06/03/1997 | US5635756 Semiconductor device, lead frame therefor and memory card to provide a thin structure |
| 06/03/1997 | US5635754 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| 06/03/1997 | US5635427 Method for assembling a pressure contact semiconductor device in a flat package |
| 06/03/1997 | US5635115 Filling circuit board cavities containing functionl element with molten sealing resin, curing |
| 05/29/1997 | WO1997019462A2 Vertically integrated semiconductor component and method of producing the same |
| 05/28/1997 | EP0776043A2 Semiconductor power module system |
| 05/28/1997 | EP0776042A2 Power semiconductor module with a plurality of submodules |
| 05/28/1997 | EP0776041A2 Semiconductor power module |
| 05/28/1997 | CN2255128Y Long effect type low temp. and power-saving bulb |
| 05/27/1997 | US5634194 High density, three-dimensional, intercoupled circuit structure |
| 05/27/1997 | US5633785 Integrated circuit component package with integral passive component |
| 05/27/1997 | US5633783 Multi-chip ceramic module for mounting electric parts on both substrate and cap connected through interconnecting pins |
| 05/27/1997 | US5633532 Semiconductor device interconnection |
| 05/27/1997 | US5633530 Multichip module having a multi-level configuration |
| 05/27/1997 | US5633209 Method of forming a circuit membrane with a polysilicon film |
| 05/27/1997 | US5632551 LED vehicle lamp assembly |
| 05/22/1997 | WO1997018589A1 A dual-band multi-level microbridge detector |
| 05/22/1997 | DE19648308A1 Funkkommunikationsmodul Radiocommunication module |
| 05/21/1997 | EP0774782A2 Semiconductor power module |
| 05/21/1997 | EP0774165A1 Method of manufacturing a three-dimensional circuit |
| 05/21/1997 | EP0629315B1 Integrated solid state light emitting and detecting array and apparatus employing said array |
| 05/20/1997 | US5631806 Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints |
| 05/20/1997 | US5631502 Multi-chip module |
| 05/20/1997 | US5631497 Film carrier tape and laminated multi-chip semiconductor device incorporating the same |
| 05/20/1997 | US5631193 High density lead-on-package fabrication method |
| 05/15/1997 | WO1997017755A1 Push-pull power amplifier |
| 05/15/1997 | WO1997017721A2 Method for making a circuit structure having a flip-mounted matrix of devices |
| 05/15/1997 | WO1997017720A2 Circuit structure having a flip-mounted matrix of devices |
| 05/15/1997 | DE19612516A1 Semiconductor power module, e.g. IGBT, using multiple chips mounted on common substrate |
| 05/14/1997 | EP0773587A2 Method of making a semiconductor power module |
| 05/14/1997 | EP0773584A2 Device having resin package and method of producing the same |
| 05/14/1997 | CN1149930A Electronic component comprising thin-film structure with passive elements |
| 05/13/1997 | US5629838 Apparatus for non-conductively interconnecting integrated circuits using half capacitors |
| 05/13/1997 | US5629835 Metal ball grid array package with improved thermal conductivity |
| 05/13/1997 | US5629563 Component stacking in multi-chip semiconductor packages |
| 05/13/1997 | US5629240 Method for direct attachment of an on-chip bypass capacitor in an integrated circuit |
| 05/09/1997 | WO1997016866A2 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices |
| 05/07/1997 | EP0772288A2 Semiconductor power module and compound power module |
| 05/07/1997 | EP0772240A2 Full color light emitting diode display |
| 05/07/1997 | EP0772236A2 Full color light emitting diode display assembly |
| 05/07/1997 | EP0772235A2 Semiconductor device comprising a circuit substrate and a case |
| 05/07/1997 | EP0771519A1 Integrally bumped electronic package components |
| 05/07/1997 | EP0631691A4 Ic chip package and method of making same. |
| 05/07/1997 | CN1149202A Power semiconductor module |
| 05/06/1997 | US5627377 Single carrier-type solid-state radiation detector device |
| 05/06/1997 | US5627364 Linear array image sensor with thin-film light emission element light source |
| 05/06/1997 | US5627106 Trench method for three dimensional chip connecting during IC fabrication |
| 05/06/1997 | US5626279 Gallium is selectively deposited on surface of electroconductive substrate; forming intermetallic |
| 05/02/1997 | EP0713609A4 Stack of ic chips as substitute for single ic chip |
| 05/01/1997 | WO1997016053A1 Electroluminescent layer system |
| 05/01/1997 | WO1997015801A1 Liquid cooled heat sink for cooling electronic components |
| 05/01/1997 | CA2235620A1 Liquid cooled heat sink for cooling electronic components |
| 04/30/1997 | DE19625240A1 Semiconductor intelligent power module device for e.g. IGBT |
| 04/29/1997 | US5625536 Semiconductor device |
| 04/29/1997 | US5625221 Semiconductor assembly for a three-dimensional integrated circuit package |
| 04/29/1997 | US5625199 Article comprising complementary circuit with inorganic n-channel and organic p-channel thin film transistors |
| 04/24/1997 | DE19603746A1 Elektrolumineszierendes Schichtsystem The electroluminescent layer system |
| 04/24/1997 | DE19538642A1 Cooling and assembly device for series of semiconductor components |
| 04/23/1997 | EP0769209A1 Method of manufacturing three-dimensional circuits |
| 04/23/1997 | CN1148270A Semiconductor package and mounting method |
| 04/22/1997 | US5623394 Apparatus for cooling of chips using a plurality of customized thermally conductive materials |
| 04/22/1997 | US5623231 Push-pull power amplifier |
| 04/22/1997 | US5623181 Multi-layer type light emitting device |
| 04/16/1997 | EP0695494A4 Electronic module comprising a stack of ic chips |
| 04/16/1997 | CN1034621C Alternator for vehicle |
| 04/15/1997 | US5621245 Apparatus for optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon |
| 04/15/1997 | US5621243 Semiconductor device having thermal stress resistance structure |