| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/01/1994 | US5291065 Semiconductor device and method of fabricating semiconductor device |
| 03/01/1994 | US5291061 Multi-chip stacked devices |
| 03/01/1994 | US5291039 LED head having heat radiating mount |
| 03/01/1994 | US5290971 Printed circuit board provided with a higher density of terminals for hybrid integrated circuit and method of fabricating the same |
| 02/22/1994 | US5289345 Opto-electronic device housing having self-healing elastomeric board mount with support pylons |
| 02/22/1994 | US5289337 Heatspreader for cavity down multi-chip module with flip chip |
| 02/22/1994 | US5289082 LED lamp |
| 02/17/1994 | WO1994003927A1 Arrangement for the preassembled construction of pressure-contactable disc-cell semiconductors |
| 02/17/1994 | WO1994003924A1 Chip module |
| 02/17/1994 | WO1993018428A3 Head-mounted display system |
| 02/17/1994 | DE4226727A1 Anordnung für einen vormontierten Aufbau von druckkontaktierbaren Scheibenzellenhalbleitern Arrangement for a pre-assembled structure of druckkontaktierbaren disc cells semiconductors |
| 02/17/1994 | CA2141458A1 Chip module |
| 02/16/1994 | EP0583201A1 Three-dimensional multichip module |
| 02/16/1994 | EP0582704A1 Power semiconductor valve device for outdoor location. |
| 02/15/1994 | US5285571 Method for extending an electrical conductor over an edge of an HDI substrate |
| 02/10/1994 | DE4325735A1 Water-cooled semiconductor regulator clamped stack for locomotive |
| 02/10/1994 | DE4322034A1 Packaging system for vehicle hybrid IC accelerometer |
| 02/09/1994 | EP0582315A1 Functional substrates for packaging semiconductor chips |
| 02/09/1994 | EP0582262A1 Contacting and packaging of integrated circuit modules |
| 02/09/1994 | EP0582213A1 Pressure assembly with semi-conductor cells and cooling boxes |
| 02/09/1994 | CN1081788A Cooling apparatus for electronic elements |
| 02/08/1994 | US5285107 Hybrid integrated circuit device |
| 02/08/1994 | US5285076 Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold |
| 02/08/1994 | US5285012 Low noise integrated circuit package |
| 02/03/1994 | WO1994003038A1 Packaging electrical components |
| 02/03/1994 | DE4238555A1 Integrated module including power semiconductor switches with control circuit - has control circuits for power transistor circuit integrated in single module including cooling vanes |
| 02/03/1994 | DE4225154A1 Chip-Modul Chip module |
| 02/02/1994 | EP0581206A2 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| 02/02/1994 | EP0581152A2 Multichip module and its manufacturing method |
| 02/01/1994 | US5283468 Electric circuit apparatus |
| 02/01/1994 | US5283463 High power self commutating semiconductor switch |
| 02/01/1994 | US5283425 Light emitting element array substrate with reflecting means |
| 02/01/1994 | US5283107 Modular multilayer interwiring structure |
| 02/01/1994 | US5282922 Applying layer of material resistant to fluorine ion etching over silicon substrate surface |
| 01/27/1994 | DE4224674A1 Diode rectifier circuit - has n-pulse bridge circuit formed by diodes having metal-semiconductor junctions |
| 01/26/1994 | EP0579924A1 Intra-module spare routing for high density electronic packages |
| 01/26/1994 | CN1081297A Component module |
| 01/25/1994 | US5281852 Semiconductor device including stacked die |
| 01/25/1994 | US5281543 Fabrication method for quantum devices in compound semiconductor layers |
| 01/25/1994 | US5281151 Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module |
| 01/20/1994 | WO1994001987A1 Component module |
| 01/20/1994 | WO1994001889A1 Fitting unit for multilayer hybrid circuit with power components |
| 01/20/1994 | WO1994001887A1 High density memory and method of forming the same |
| 01/20/1994 | DE4223522A1 Electronic control device circuit module - has power components attached in two rows in two respective arms of U=shaped cooling element |
| 01/19/1994 | EP0578991A1 Bidirectional semiconductor switch |
| 01/18/1994 | US5280194 Electrical apparatus with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device |
| 01/18/1994 | US5280193 Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate |
| 01/18/1994 | US5280191 Lightwave packaging for pairs of optical devices having thermal dissipation means |
| 01/18/1994 | US5279029 Ultra high density integrated circuit packages method |
| 01/13/1994 | DE4222474A1 Montageeinheit für Mehrlagenhybrid mit Leistungsbauelementen Mounting unit for multilayer hybrid with power devices |
| 01/12/1994 | EP0578108A1 Semiconductor power module |
| 01/12/1994 | EP0577779A1 Multichip integrated circuit module and method of fabrication |
| 01/12/1994 | EP0577754A1 Three-dimensional multichip module systems and methods of fabrication |
| 01/11/1994 | US5278728 Diode mounting |
| 01/11/1994 | US5278443 Composite semiconductor device with Schottky and pn junctions |
| 01/11/1994 | US5278432 Apparatus for providing radiant energy |
| 01/05/1994 | EP0577264A1 A semiconductor device comprising a plurality of semiconductor chips |
| 01/05/1994 | EP0577197A1 Optoelectronic device and method of manufacturing same |
| 01/05/1994 | EP0577099A2 Cooling apparatus for electronic elements |
| 01/04/1994 | US5276586 Bonding structure of thermal conductive members for a multi-chip module |
| 01/04/1994 | US5276289 Electronic circuit device and method of producing the same |
| 01/04/1994 | CA2024784C Stackable multilayer substrate for mounting integrated circuits |
| 12/29/1993 | EP0576182A1 A semiconductor device |
| 12/29/1993 | EP0576023A1 Diode mounting |
| 12/29/1993 | EP0575892A1 Semiconducteur power module |
| 12/29/1993 | EP0575806A2 Package for integrated circuit chips |
| 12/28/1993 | US5274541 Parallel circuit module including a diode and an IGBT |
| 12/28/1993 | US5273940 Encapsulating around the semiconductor chips having contact pads with a gold bump mated to the substrate and removing some exposed chip material |
| 12/28/1993 | US5273622 Longitudinally moving from station to station |
| 12/23/1993 | WO1993026142A1 Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board |
| 12/22/1993 | EP0575051A1 Stacked multi-chip modules and method of manufacturing |
| 12/22/1993 | EP0574861A1 System for continuous fabrication of micro-structures and thin film semiconductor devices on elongate substrates |
| 12/21/1993 | US5272113 Method for minimizing stress between semiconductor chips having a coefficient of thermal expansion different from that of a mounting substrate |
| 12/16/1993 | DE4317570A1 Semiconductor device formed on SOI substrate - has several integrated circuit elements formed in respective semiconductor areas separated from one another by insulating channels, bridged by connecting conductors |
| 12/16/1993 | CA2097404A1 System for continuous fabrication of micro-structures and thin film semiconductor devices on elongate substrates |
| 12/15/1993 | EP0574022A2 Movement actuator/sensor systems |
| 12/15/1993 | EP0573838A2 Multi-chip-module |
| 12/14/1993 | US5270571 Three-dimensional package for semiconductor devices |
| 12/14/1993 | US5270485 High density, three-dimensional, intercoupled circuit structure |
| 12/14/1993 | US5270261 Three dimensional multichip package methods of fabrication |
| 12/14/1993 | US5269882 Method and apparatus for fabrication of thin film semiconductor devices using non-planar, exposure beam lithography |
| 12/09/1993 | WO1993024956A1 Process for the manufacture of a solid-state device including at least one chip, and corresponding device |
| 12/08/1993 | CN1079338A Display assembly of light-emitting diodes |
| 12/07/1993 | US5268815 High density, high performance memory circuit package |
| 12/07/1993 | US5267867 Package for multiple removable integrated circuits |
| 12/01/1993 | EP0571756A2 High density, three-dimensional, intercoupled circuit structure |
| 12/01/1993 | EP0571749A1 Stacking semiconductor multi-chip module and method for making the same |
| 12/01/1993 | EP0571609A1 Integrated circuit module with devices interconnected by electromagnetic waves |
| 11/30/1993 | US5266946 Remote control system, in particular for locking and unlocking the doors of motor vehicles with two axially offset light emitters |
| 11/30/1993 | US5266834 Semiconductor device and an electronic device with the semiconductor devices mounted thereon |
| 11/30/1993 | US5266833 Integrated circuit bus structure |
| 11/30/1993 | US5266817 Package structure of multi-chip light emitting diode |
| 11/30/1993 | US5265792 Light source and technique for mounting light emitting diodes |
| 11/25/1993 | WO1993023982A1 Stacked devices for multichip modules |
| 11/25/1993 | WO1993023873A1 Non-conductive end layer for integrated stack of ic chips |
| 11/24/1993 | EP0570392A1 Arrangement of heat-generating structural components in a liquid-cooled device |
| 11/23/1993 | US5264699 Infrared detector hybrid array with improved thermal cycle reliability and method for making same |
| 11/23/1993 | US5264392 Fabrication technique for silicon-based optical subassemblies |
| 11/23/1993 | US5263244 Method of making a flexible printed circuit sensor assembly for detecting optical pulses |
| 11/18/1993 | EP0569949A2 Surface mount components and semifinished products thereof |