Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/1995
10/05/1995WO1995026538A1 Method of manufacturing a chip card, and chip card thus produced
10/05/1995DE4410732A1 Verfahren zur Herstellung einer Chipkarte sowie Chipkarte A method of manufacturing a smart card as well as smart card
10/05/1995DE19507573A1 Conductor structure for semiconductor housing
10/04/1995EP0675674A1 Film circuit metal system for use with bumped IC packages
10/04/1995EP0675541A1 Integrated electro-optical package
10/04/1995EP0675540A1 Integrated electro-optical package
10/04/1995EP0675539A2 Ball grid package with integrated passive circuit elements
10/04/1995EP0662245A4 A thin multichip module.
10/03/1995US5455740 Bus communication system for stacked high density integrated circuit packages
10/03/1995US5455459 Reconstructable interconnect structure for electronic circuits
10/03/1995US5455455 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
10/03/1995US5455445 Multi-level semiconductor structures having environmentally isolated elements
10/03/1995US5455385 Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses
10/03/1995US5455384 High frequency module and method of producing the same
10/03/1995US5455187 Method of making a semiconductor device with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device
10/03/1995US5454160 Apparatus and method for stacking integrated circuit devices
09/1995
09/28/1995WO1995026124A1 Integrated circuit lamination process
09/28/1995WO1995026051A1 Integration of laser with photodiode for feedback control
09/28/1995DE19509441A1 Hybrid integrated circuit
09/26/1995US5453638 Bonding and encapsulated three dimensional hybrid integrated circuit modules
09/26/1995US5453405 Method of making light emitting diode bars and arrays
09/21/1995WO1995025348A1 Logical three-dimensional interconnections between integrated circuit chips using a two-dimensional multi-chip module package
09/21/1995WO1995025341A1 3d stack of ic chips having leads reached by vias through passivation covering access plane
09/21/1995DE4407810A1 Switching arrangement allowing larger packing density
09/20/1995EP0673065A1 Cooling device for electronic components
09/20/1995EP0673060A1 Jig and manufacturing method for a semiconductor device
09/20/1995CN1108825A Semiconductor stack
09/19/1995US5452228 In an electronic apparatus
09/19/1995US5452182 Flexible high density interconnect structure and flexibly interconnected system
09/19/1995US5451823 Vehicular thermoconductive lead frame rectifier assembly
09/19/1995US5451814 Multi-chip module integrated circuit
09/19/1995US5451774 High density, three-dimensional, intercoupled optical sensor circuit
09/19/1995CA2035724C Power semiconductor device with heat dissipating property
09/13/1995EP0671803A1 Alternator for vehicle
09/13/1995EP0671802A1 Alternator for vehicle
09/12/1995US5449955 Copper barrier layer between nickel and gold
09/06/1995EP0670603A1 Semiconductor device comprising at least one IGBT and a diode
09/05/1995US5448106 Thin semiconductor integrated circuit device assembly
09/05/1995CA2046253C Integrated circuit package and compact assemblies thereof
08/1995
08/31/1995DE19506759A1 Halbleitervorrichtung, zugehöriges Herstellungsverfahren, Verfahren zum Testen von Halbleiterelementen, Testsubstrat für das Verfahren sowie Verfahren zur Herstellung des Testsubstrats A semiconductor device manufacturing method thereof, method for testing semiconductor devices, the test substrate for the process and method of manufacturing the test substrate
08/30/1995EP0669653A1 Power semiconductor module and circuit arrangement with at least two semiconductor modules
08/29/1995US5446620 Ultra high density integrated circuit packages
08/29/1995US5446318 Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement
08/29/1995US5446317 Single in-line package for surface mounting
08/29/1995US5446314 Low profile metal-ceramic-metal packaging
08/29/1995US5446313 Thin type semiconductor device and module structure using the device
08/29/1995US5446309 Semiconductor device including a first chip having an active element and a second chip having a passive element
08/29/1995US5445994 Method for forming custom planar metal bonding pad connectors for semiconductor dice
08/29/1995US5445311 Electrical interconnection substrate with both wire bond and solder contacts, and fabrication method
08/24/1995WO1995022840A1 Process for producing a three-dimensional circuit
08/24/1995DE4427515C1 Production of three=dimensional solid state circuit
08/23/1995EP0668616A2 Insulated gate semiconductor device and manufacturing method thereof
08/22/1995US5444600 Lead frame capacitor and capacitively-coupled isolator circuit using the same
08/22/1995US5444304 Semiconductor device having a radiating part
08/22/1995US5444297 Noise resistant semiconductor power module
08/22/1995US5444296 Ball grid array packages for high speed applications
08/22/1995US5444295 Linear dual switch module
08/22/1995US5444009 Fabricating a semiconductor with an insulative coating
08/16/1995EP0667641A1 Linear dual switch module
08/15/1995US5442229 Metal lead-film carrier assembly having a plurality of film carriers, and film carrier-semiconductor chip assembly and semiconductor device containing such metal lead-film carrier assembly
08/15/1995US5441898 Fabricating a semiconductor with an insulative coating
08/10/1995WO1995021459A1 Semiconductor storage component with a plurality of storage chips in a shared casing
08/10/1995DE4403996A1 Rectifier for three=phase generator
08/09/1995EP0666595A1 Method of manufacture of a cubic integrated circuit structure
08/08/1995US5440453 Extended architecture for FPGA
08/08/1995US5440452 Surface mount components and semifinished products thereof
08/08/1995US5440171 Semiconductor device with reinforcement
08/03/1995WO1995017765A3 Liquid cooled heat sink for cooling electronic components
08/02/1995EP0665599A1 Lighting device by infrared radiation
08/02/1995EP0665591A1 Method for forming a power circuit package
08/02/1995EP0663102A4 Power semiconductor integrated circuit package.
08/02/1995CN1106164A Semiconductor device and a manufacturing method therefor
08/01/1995US5438479 High density, heat-dissipating circuit assembly with accessible components
08/01/1995US5438241 Single crystal silicon arrayed devices for display panels
08/01/1995US5438224 Integrated circuit package having a face-to-face IC chip arrangement
08/01/1995US5438021 Method of manufacturing a multiple-chip semiconductor device with different leadframes
07/1995
07/27/1995WO1995019812A1 Photo-thermal therapeutic device and method
07/25/1995US5435734 Direct integrated circuit interconnector system
07/20/1995DE4401178A1 Thyristor module for HV or current switching
07/19/1995EP0663102A1 Power semiconductor integrated circuit package
07/18/1995US5434745 Stacked silicon die carrier assembly
07/18/1995US5434453 Semiconductor integrated circuit device and computer system using the same
07/18/1995US5434450 PGA package type semiconductor device having leads to be supplied with power source potential
07/18/1995US5432999 Integrated circuit lamination process
07/12/1995EP0662715A1 Package for parallel subelement semiconductor devices and method
07/12/1995EP0662245A1 A thin multichip module
07/12/1995CN1105120A Cooling apparatusm and assembling method thereof
07/11/1995US5432729 Electronic module comprising a stack of IC chips each interacting with an IC chip secured to the stack
07/11/1995US5432708 Multichip module integrated circuit device having maximum input/output capability
07/11/1995US5432681 Density improvement for planar hybrid wafer scale integration
07/11/1995US5432679 Pressure equalizer for an integrated circuit chip interconnected to circuitry on a thin film membrane
07/11/1995US5432677 Multi-chip integrated circuit module
07/11/1995US5432358 Integrated electro-optical package
07/07/1995CA2139453A1 Package for parallel subelement semiconductor devices and method
07/05/1995EP0661748A1 Semiconductor device
07/05/1995EP0661747A1 Semiconductor package
07/05/1995EP0660967A1 Methods and apparatus for producing integrated circuit devices
07/04/1995US5430326 Semiconductor device for mounting on a printed wiring board
07/04/1995US5428885 Method of making a multilayer hybrid circuit
06/1995
06/29/1995WO1995017765A2 Liquid cooled heat sink for cooling electronic components
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