Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
01/1991
01/15/1991US4985752 Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements
01/15/1991US4984358 Method of assembling stacks of integrated circuit dies
01/10/1991WO1991000619A1 Flying leads for integrated circuits
01/09/1991EP0407156A2 Circuit module
01/08/1991US4984065 Hybrid resin-sealed semiconductor device
01/08/1991US4984064 Semiconductor device
01/08/1991US4984057 Semiconductor element string structure
01/08/1991US4984051 Semiconductor device having directly connected source terminal
01/08/1991US4983533 High-density electronic modules - process and product
01/08/1991US4983251 Method of manufacturing semiconductor devices
01/08/1991CA1278878C Cooling method and apparatus for an integrated circuit casing
01/02/1991EP0406056A1 Case for hybrid components containing a groove
01/02/1991EP0405865A2 Method of connecting opposed pairs of contacts of detector and readout microchips in a hybrid detector array assembly
01/02/1991EP0404789A1 Assembly process for producing led rows.
01/02/1991CN2068725U High-voltage field-effect power-transistor solid unit
01/02/1991CN1048284A Photoelectric mixed integrated semiconductor optical bistable device
01/01/1991US4982265 Semiconductor integrated circuit device and method of manufacturing the same
01/01/1991US4982264 High density integrated circuit package
12/1990
12/27/1990WO1990016079A2 Low impedance packaging
12/27/1990EP0311674B1 Cavity-up-cavity-down multichip integrated circuit package
12/25/1990US4980002 Positioning uncured adhesive between chips; curing
12/19/1990EP0403343A1 Hybrid circuit functioning under high voltage
12/19/1990EP0402793A2 Hybrid integrated circuit device
12/19/1990EP0236493B1 Microelectronic package
12/18/1990US4979017 Semiconductor element string structure
12/18/1990US4978379 Flame hydrolysis with oxyhydrogen flame; spray depositing glass particles; sintering
12/16/1990CA2018847A1 Hybrid circuit working under high voltage
12/13/1990WO1990015439A1 Packaged electronic circuit with a chip on a gridded area of conductive pads
12/11/1990US4976802 Process for assembling smaller scanning or printing arrays together to form a longer array
12/06/1990DE3917768A1 Bonded semiconductor diode and thyristor device prodn. - by vapour coating and pressure bonding in vacuum chamber
12/04/1990US4975825 Stacked power converter
12/04/1990US4975814 Wide-area lamp
12/04/1990US4975761 High performance plastic encapsulated package for integrated circuit die
12/04/1990CA1277380C Anisotropic elastomeric interconnecting system
11/1990
11/29/1990WO1990014607A1 Housing for an opto-electronic device
11/29/1990DE4016532A1 Integrated circuit unit with metal substrate - is produced as encapsulated module with plug connections at either end
11/28/1990EP0399447A2 Plastic molded type semiconductor device
11/28/1990EP0399265A2 Substrate used for fabrication of thick film circuit
11/27/1990US4974057 Semiconductor device package with circuit board and resin
11/22/1990EP0398628A2 Semiconductor memory device
11/22/1990EP0398597A2 Improved hybrid package arrangement
11/22/1990EP0398108A1 Plastic housing and semiconductor power module having this housing
11/22/1990EP0397747A1 Three-dimensional circuit component assembly and method corresponding thereto
11/21/1990CN2066203U Quadratic form image element diode character display unit
11/20/1990WO1990015478A2 Improved three-dimensional circuit component assembly and method corresponding thereto
11/20/1990US4972094 Lighting devices with quantum electric/light power converters
11/20/1990CA2033081A1 Three-dimensional circuit component assembly and method corresponding thereto
11/19/1990CA2016386A1 Housing for an opto-electronic device
11/14/1990EP0397391A2 Chip package capacitor cover
11/14/1990EP0397161A2 Methods for device transplantation
11/14/1990EP0396641A1 Acceleration-resistant packaging for integrated circuits and process for manufacturing it.
11/14/1990EP0313555B1 Diode stack with high dielectric strength
11/13/1990US4970576 Power semiconductor module and method for producing the module
11/13/1990US4970575 Thermal expansion coefficient
11/07/1990EP0396266A1 Display device
11/01/1990WO1990013144A1 Rotating rectifier assembly
10/1990
10/30/1990US4967262 Gull-wing zig-zag inline lead package having end-of-package anchoring pins
10/30/1990CA1275690C Bridge rectifier
10/24/1990EP0393671A2 Hybrid integrated circuit device
10/24/1990EP0393657A2 Hybrid integrated circuit device
10/23/1990US4965710 Insulated gate bipolar transistor power module
10/23/1990US4965658 System for mounting and cooling power semiconductor devices
10/23/1990US4965653 Semiconductor device and method of mounting the semiconductor device
10/17/1990EP0392242A2 Module assembly with intergrated semiconductor chip and chip carrier
10/16/1990US4963976 Integrated electrical conducting, cooling and clamping assembly for power semiconductors
10/10/1990EP0391832A2 Improvements in the construction of bridge rectifiers
10/04/1990WO1990011613A1 Analog to digital conversion incorporated in z-technology module
10/02/1990US4961107 Electrically isolated heatsink for single-in-line package
09/1990
09/26/1990EP0388953A2 Vehicle generator with rectifying unit
09/25/1990US4959749 Layered electronic assembly having compensation for chips of different thickness and different I/O lead offsets
09/25/1990US4959707 Rotating rectifier assembly
09/25/1990US4959704 Semiconductor integrated circuit device
09/22/1990CA2012737A1 Structure of rectifier in generator for vehicle
09/18/1990US4958258 Modular hybrid microelectronic structures with high density of integration
09/18/1990US4958214 Protective carrier for semiconductor packages
09/18/1990US4957876 Resin sealed semiconductor device and a method for making the same
09/12/1990EP0385979A1 High-density electronic modules, process and product.
09/11/1990US4956746 Stacked wafer electronic package
09/11/1990US4956695 Three-dimensional packaging of focal plane assemblies using ceramic spacers
09/11/1990US4956694 Integrated circuit chip stacking
09/05/1990EP0385048A1 Substrate for hybrid integrated circuit and process for producing the same
09/04/1990US4954877 Chip carrier
09/04/1990US4954876 Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements
09/04/1990US4954875 Semiconductor wafer array with electrically conductive compliant material
09/04/1990US4954458 Method of forming a three dimensional integrated circuit structure
09/04/1990US4954182 Solar cells
08/1990
08/29/1990EP0384482A2 Composite semiconductor device
08/28/1990US4953060 Stackable integrated circuit chip package with improved heat removal
08/28/1990US4953005 Packaging system for stacking integrated circuits
08/28/1990US4952829 Rectifier arrangement
08/22/1990EP0383296A2 Method of producing a semiconductor device package
08/14/1990US4949225 Circuit board for mounting electronic components
08/14/1990US4949220 Hybrid IC with heat sink
08/14/1990US4949163 Semiconductor integrated circuit device particularly for high speed logic operations
08/14/1990US4949156 Semiconductor string connection structure
08/14/1990US4949148 Self-aligning integrated circuit assembly
08/14/1990US4948976 Lead selenium intermetallic
08/14/1990US4948740 Method for the integrated series-interconnection of thick-film solar cells and method for the manufacture of tandem solar cells
08/07/1990US4947234 Semiconductor component with power MOSFET and control circuit
08/02/1990DE4000618A1 Limiting device for cathodic corrosion protection systems - using low internal resistance earthing connecting for buried high voltage conduits with cathodic protection systems
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