| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 02/23/1995 | CA2146868A1 Method for interconnecting semi-conductor pads in three dimensions and component thus obtained |
| 02/22/1995 | EP0639859A2 Vertical chip mount memory package and method |
| 02/21/1995 | US5391922 Semiconductor element module |
| 02/21/1995 | US5391917 For providing processing operations in a computer system |
| 02/21/1995 | US5391916 Resin sealed type semiconductor device |
| 02/21/1995 | US5390670 Flexible printed circuit sensor assembly for detecting optical pulses |
| 02/16/1995 | WO1995005005A1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits |
| 02/15/1995 | EP0638933A1 Interconnection process of stacked semi-conductors chips and devices |
| 02/15/1995 | EP0638931A2 Multi-chip module |
| 02/15/1995 | EP0638928A1 Power semiconductor device with pressure contact |
| 02/14/1995 | US5389158 Low bandgap photovoltaic cell with inherent bypass diode |
| 02/09/1995 | WO1995004448A1 Low impedance interconnection for power devices |
| 02/09/1995 | WO1995004376A1 Lighting device by infrared radiation |
| 02/08/1995 | EP0637841A2 Thin film semiconductor device and fabrication method |
| 02/08/1995 | CN1098588A Multilayered metallic printed board and molded module |
| 02/07/1995 | US5388028 Low impedance interconnection assembly for high frequency switching power semiconductor devices and low inductance modular capacitor |
| 02/07/1995 | US5387816 Hybrid integrated circuit device |
| 02/01/1995 | EP0637080A1 Pressure contact type semiconductor device and assembly method therefor |
| 02/01/1995 | EP0637079A1 Upgradable multi-chip module |
| 01/31/1995 | US5385632 Bonding conductors of first semiconductor device to conductors on second semiconductor device, flowing etch resist to fill spacings, drying, removing |
| 01/25/1995 | EP0635885A1 High density circuit assembly and method of forming the same |
| 01/25/1995 | EP0635141A1 Method of manufacturing a microsystem and of producing a microsystem laser from it |
| 01/24/1995 | US5384683 Intelligent power device module |
| 01/24/1995 | US5383269 Method of making three dimensional integrated circuit interconnect module |
| 01/17/1995 | US5382830 Semiconductor module with multi-plane conductive path |
| 01/17/1995 | US5382811 Optical semiconductor device |
| 01/11/1995 | EP0633609A2 Composite board, and method of fabricating a composite board |
| 01/10/1995 | US5381047 Semiconductor integrated circuit having multiple silicon chips |
| 01/10/1995 | US5381039 Hermetic semiconductor device having jumper leads |
| 01/10/1995 | US5380681 Three-dimensional multichip package and methods of fabricating |
| 01/05/1995 | WO1995001088A1 Converter module |
| 01/05/1995 | WO1995001087A1 Method and apparatus for non-conductively interconnecting integrated circuits |
| 01/05/1995 | WO1995000972A1 Multilayer ltcc tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses |
| 01/05/1995 | DE4422216A1 Multilayer metallic printed circuit board and a cast component |
| 01/04/1995 | EP0632511A2 A light emitting diode aggregate module and a method for manufacturing a light emitting diode aggregate module |
| 01/04/1995 | EP0631692A1 Three dimensional integrated circuit and method of fabricating same |
| 01/04/1995 | EP0631691A1 Ic chip package and method of making same |
| 12/28/1994 | EP0631317A2 Integrated semiconductor devices and method for manufacture thereof |
| 12/28/1994 | EP0631310A1 Polyimide-insulated cube package of stacked semiconductor device chips |
| 12/28/1994 | EP0630521A1 Three dimensional, multi-chip module |
| 12/27/1994 | US5377081 Surface mountable electronic part |
| 12/27/1994 | US5377077 Ultra high density integrated circuit packages method and apparatus |
| 12/27/1994 | US5377031 Single crystal silicon tiles for liquid crystal display panels including light shielding layers |
| 12/27/1994 | US5376825 Integrated circuit package for flexible computer system alternative architectures |
| 12/27/1994 | US5376580 Wafer bonding of light emitting diode layers |
| 12/27/1994 | US5376561 High density electronic circuit modules |
| 12/22/1994 | CA2118994A1 Polyimide-insulated cube package of stacked semiconductor device chips |
| 12/21/1994 | EP0630057A2 A semiconductor device with optical waveguides to achieve signal transmission using optical means |
| 12/21/1994 | EP0630050A1 Low profile header assembly for an encapsulated instrument |
| 12/21/1994 | EP0630049A1 Semi-conductor die assembly |
| 12/21/1994 | EP0630047A1 Method of manufacturing resin-sealed semiconductor device, lead frame used in this method for mounting plurality of semiconductor elements, and resin-sealed semiconductor device |
| 12/21/1994 | EP0629315A1 Integrated solid state light emitting and detecting array and apparatus employing said array. |
| 12/21/1994 | EP0605712A4 Packaging electrical components. |
| 12/20/1994 | US5375042 Semiconductor package employing substrate assembly having a pair of thin film circuits disposed one on each of oppositely facing surfaces of a thick film circuit |
| 12/14/1994 | EP0629000A1 High density and reliability integrated circuit assembly and method of making |
| 12/13/1994 | US5373280 Vehicle signal light |
| 12/13/1994 | US5373189 Three-dimensional multichip module |
| 12/06/1994 | US5371654 Three dimensional high performance interconnection package |
| 12/06/1994 | US5371651 Power semiconductor valve device for outdoor location |
| 12/06/1994 | US5371043 Method for forming a power circuit package |
| 12/06/1994 | US5371029 Process for making a leadless chip resistor capacitor carrier using thick and thin film printing |
| 11/30/1994 | EP0626099A1 High density electronic circuit modules |
| 11/30/1994 | EP0490896B1 Rectifier for three-phase current generators in vehicles |
| 11/30/1994 | CN1095861A Package technique for miniature high voltage Si stack compound block |
| 11/29/1994 | US5369552 Multi-chip module with multiple compartments |
| 11/29/1994 | US5369058 Warp-resistent ultra-thin integrated circuit package fabrication method |
| 11/29/1994 | US5369056 Thinning by removal of casings, supporting and thinning |
| 11/29/1994 | US5367766 Ultra high density integrated circuit packages method |
| 11/29/1994 | US5367765 Method of fabricating integrated circuit chip package |
| 11/24/1994 | WO1994027318A1 Packaging and interconnect system for integrated circuits |
| 11/23/1994 | EP0593637A4 Low impedance bus for power electronics. |
| 11/22/1994 | USRE34794 Gull-wing zig-zag inline lead package having end-of-package anchoring pins |
| 11/22/1994 | US5367208 Reconfigurable programmable interconnect architecture |
| 11/17/1994 | EP0624905A1 Multichip module |
| 11/15/1994 | US5365424 High power laminated bus assembly for an electrical switching converter |
| 11/15/1994 | US5365405 Multi-chip module |
| 11/15/1994 | US5365403 Packaging electrical components |
| 11/15/1994 | US5365400 Heat sinks and semiconductor cooling device using the heat sinks |
| 11/10/1994 | WO1994026083A1 Electronic module comprising a stack of ic chips |
| 11/10/1994 | WO1994025987A1 Semiconductor chip encapsulation method, device produced by this method and its application to three dimensional chip interconnection |
| 11/10/1994 | WO1994025982A1 Contact structure for vertical chip connections |
| 11/10/1994 | WO1994025981A1 Process for producing vertically connected semiconductor components |
| 11/09/1994 | EP0340466B1 Semiconductor device comprising leads |
| 11/08/1994 | US5362989 Electrical isolation for power-saving purposes |
| 11/08/1994 | US5362986 Vertical chip mount memory package with packaging substrate and memory chip pairs |
| 11/08/1994 | US5362976 High frequency semiconductor device having optical guide package structure |
| 11/08/1994 | US5362682 Method of producing sheets of crystalline material and devices made therefrom |
| 11/05/1994 | CA2121960A1 Method and apparatus for providing electrical access to devices in a multi-chip module |
| 11/02/1994 | EP0622847A2 Three dimensional package and architecture for high performance computer |
| 11/02/1994 | EP0622840A2 Apparatus and method for assembling and checking microwave monolithic integrated circuit (MMIC) module |
| 11/02/1994 | EP0622719A1 Protecting device for circuit components and for data in an electrotechnical apparatus |
| 11/01/1994 | US5360942 Multi-chip electronic package module utilizing an adhesive sheet |
| 10/26/1994 | EP0621635A1 Power transistor module |
| 10/25/1994 | US5359496 Hermetic high density interconnected electronic system |
| 10/25/1994 | US5359493 Three dimensional multi-chip module with integral heat sink |
| 10/25/1994 | US5358904 Semiconductor device |
| 10/25/1994 | US5358503 Photo-thermal therapeutic device and method |
| 10/25/1994 | US5357674 Method of manufacturing a printed circuit board |
| 10/25/1994 | US5357673 Semiconductor device encapsulation method |
| 10/18/1994 | US5357122 Three-dimensional optical-electronic integrated circuit device with raised sections |