Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/1993
11/18/1993DE4314860A1 Battery powered direct current generator for pre-heating catalytic converter in motor vehicle - has parallel power MOS transistor modules controlled via reed relay and having common outputs connected in respective input resistors
11/17/1993CN1078374A A flexible printed circuit sensor assembly for detecting optical pulses
11/16/1993US5262351 Process for manufacturing a multilayer integrated circuit interconnection
11/11/1993WO1993022894A1 High power ac traction inverter cooling
11/11/1993WO1993022795A1 Interconnection system for high performance electronic hybrids
11/09/1993US5260602 Hybrid integrated-circuit device having an asymmetrical thermal dissipator
11/04/1993DE4313980A1 Integrated hybrid circuit avoiding electrical disturbances - comprises conductor frame electrically connected to electronic components by silver paste with electroless plated coating on frame
11/03/1993EP0568312A2 Semiconductor device with driver chip and methods of manufacture
11/03/1993EP0567814A1 Printed circuit board for mounting semiconductors and other electronic components
11/03/1993EP0567694A1 Semiconductor integrated circuit device with noise protecting shield
11/02/1993US5258891 Multichip module with multilayer wiring substrate
11/02/1993US5258673 Rectifier device in vehicle AC generator
11/02/1993US5258650 Pressure transducer
11/02/1993US5258646 Package for microwave IC
11/02/1993US5258330 Semiconductor chip assemblies with fan-in leads
11/02/1993US5258325 Method for manufacturing a semiconductor device using a circuit transfer film
10/1993
10/28/1993WO1993021748A1 Membrane dielectric isolation ic fabrication
10/28/1993WO1993021662A1 Multispectral photovoltaic component with stacked cells and process for its production
10/28/1993WO1993021661A1 Multispectral photovoltaic component
10/28/1993WO1993021551A1 Method of manufacturing a microsystem and of producing a microsystem laser from it
10/27/1993EP0566913A1 Thermally enhanced semiconductor chip package
10/26/1993US5256562 Array of thin film transistors on silicon substrate; cutting, tilting to transfer module body
10/21/1993DE4211899A1 Verfahren zur Herstellung eines Mikrosystems und daraus Bildung eines Mikrosystemlasers A process for producing a micro-system, and the formation of a micro laser system
10/20/1993EP0566354A1 A flexible printed circuit sensor assembly for detecting optical pulses
10/20/1993EP0565588A1 Single crystal silicon arrayed devices for display panels
10/19/1993US5255156 Bonding pad interconnection on a multiple chip module having minimum channel width
10/19/1993US5253613 High power AC traction inverter cooling
10/14/1993DE4210834A1 Heat sink for integrated circuit micro-chip thin film package - uses cooling plate with cooling channels open to membrane sealed to underside of plate inside facing IC micro-package
10/13/1993EP0565391A1 Method and device for encapsulation of three-dimensional semi-conductor chips
10/12/1993US5252857 Stacked DCA memory chips
10/06/1993CN1077058A Luminous wire and its making method
10/05/1993US5251099 High density electronics package having stacked circuit boards
10/05/1993US5250845 Totally enclosed hermetic electronic module
10/05/1993US5250843 Multichip integrated circuit modules
10/05/1993US5250821 Electronic power device having plural elementary semiconductor components connected in parallel
09/1993
09/30/1993WO1993019485A1 Ic chip package and method of making same
09/29/1993EP0562546A1 Electronic part assembly
09/29/1993EP0562060A1 Mounting arrangements for high voltage/high power semiconductors
09/28/1993US5249245 Optoelectroinc mount including flexible substrate and method for making same
09/28/1993US5249114 Arrangement of a valve stack for high voltage direct current in a valve hall
09/28/1993US5248346 Semiconductors
09/22/1993EP0313597B1 Hot melt ink supply system
09/21/1993US5247596 Fiber-optics connected optoelectronic device mounted on a substrate and method of manufacturing it
09/21/1993US5247423 Stacking three dimensional leadless multi-chip module and method for making the same
09/16/1993WO1993018555A1 Integrated solid state light emitting and detecting array and apparatus employing said array
09/16/1993WO1993018549A1 Process and device for three-dimensional interconnection of housings for electronic components
09/16/1993WO1993018547A1 Three dimensional, multi-chip module
09/16/1993WO1993018428A2 Head-mounted display system
09/16/1993CA2131465A1 Integrated solid state light emitting and detecting array and apparatus employing said array
09/16/1993CA2130672A1 Head-mounted display system
09/15/1993EP0560605A1 Light-source device
09/15/1993EP0560502A2 Electronic circuit device and manufacturing method thereof
09/15/1993EP0560259A1 Heat sink having good heat dissipating characteristics and process for producing the same
09/15/1993EP0560123A2 Power transistor with multiple finger contacts
09/14/1993US5245510 Hybrid integrated circuit device
09/14/1993US5245215 Multichip packaged semiconductor device and method for manufacturing the same
09/14/1993US5245198 Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold
09/08/1993EP0559366A1 Stackable three-dimensional multiple chip semiconductor device and method for making the same
09/08/1993EP0558984A2 Hybrid ceramic thin-film module structure
09/07/1993US5243497 Chip on board assembly
09/07/1993US5243496 Molded case integrated circuit with a dynamic impedance reducing device
09/07/1993US5243218 Cooling structure for electronics devices
09/07/1993US5243208 Semiconductor integrated circuit device having a gate array with a ram and by-pass signal lines which interconnect a logic section and I/O unit circuit of the gate array
09/02/1993WO1993017488A1 Power semiconductor valve device for outdoor location
09/01/1993EP0558226A2 Balanced circuitry for reducing inductive noise of external chip interconnections
09/01/1993EP0557776A2 Indicator lamp
09/01/1993EP0557318A1 Method of manufacturing semiconductor elements, in particular diodes.
09/01/1993EP0551382A4 Semiconductor chip assemblies, methods of making same and components for same
08/1993
08/31/1993US5241456 Compact high density interconnect structure
08/31/1993US5241454 Mutlilayered flexible circuit package
08/31/1993US5241450 Three dimensional, multi-chip module
08/31/1993US5241215 Method and apparatus for providing novel hybrid circuit assembly carrier bracket
08/24/1993US5239448 For providing function in a computer system
08/24/1993US5239447 Stepped electronic device package
08/24/1993US5239179 Infrared detector devices
08/19/1993WO1993016491A1 High density electronic circuit modules
08/19/1993CA2129123A1 High density electronic circuit modules
08/18/1993EP0555659A2 Multi-chip Module
08/17/1993US5237203 Multilayer overlay interconnect for high-density packaging of circuit elements
08/11/1993EP0385979B1 High-density electronic modules, process and product
08/04/1993EP0553981A2 Low-inductance package for multiple paralleled devices operating at high frequency
08/04/1993EP0284624B1 Method of forming a multichip integrated circuit package
08/03/1993US5233310 Microwave integrated circuit
07/1993
07/30/1993CA2085644A1 Low inductance package for multiple paralleled devices operating at high frequency
07/27/1993US5231304 Framed chip hybrid stacked layer assembly
07/27/1993US5231049 Method of manufacturing a distributed light emitting diode flat-screen display for use in televisions
07/27/1993CA2017340C Hybrid module electronics package
07/21/1993EP0551741A1 Heat pipe-electrical interconnect integration for chip modules
07/21/1993EP0551382A1 Semiconductor chip assemblies, methods of making same and components for same
07/20/1993US5229960 Solid state memory modules and memory devices including such modules
07/20/1993US5229917 VLSI integration into a 3-D WSI dual composite module
07/20/1993US5229647 High density data storage using stacked wafers
07/20/1993US5228666 Fixture for fabricating full width scanning or imaging arrays from subunits
07/20/1993CA2031865C High-density memory array packaging
07/15/1993DE4300574A1 Rectifier circuit for vehicle ac generator - has mesa isolated Zener diode rectifiers mounted inside generator on heat sinks cooled with fan
07/15/1993DE4200384A1 Expansion device for augmenting functions of basic component, e.g. EPROM or SRAM - has cover with cavity on component housing with fasteners, contg. extension modules
07/13/1993US5227664 Semiconductor device having particular mounting arrangement
07/13/1993US5226723 Light emitting diode display
07/08/1993WO1993013558A1 Energy converter
07/08/1993WO1993013557A1 Structure for mounting the semiconductor chips in a three-dimensional manner