Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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11/18/1993 | DE4314860A1 Battery powered direct current generator for pre-heating catalytic converter in motor vehicle - has parallel power MOS transistor modules controlled via reed relay and having common outputs connected in respective input resistors |
11/17/1993 | CN1078374A A flexible printed circuit sensor assembly for detecting optical pulses |
11/16/1993 | US5262351 Process for manufacturing a multilayer integrated circuit interconnection |
11/11/1993 | WO1993022894A1 High power ac traction inverter cooling |
11/11/1993 | WO1993022795A1 Interconnection system for high performance electronic hybrids |
11/09/1993 | US5260602 Hybrid integrated-circuit device having an asymmetrical thermal dissipator |
11/04/1993 | DE4313980A1 Integrated hybrid circuit avoiding electrical disturbances - comprises conductor frame electrically connected to electronic components by silver paste with electroless plated coating on frame |
11/03/1993 | EP0568312A2 Semiconductor device with driver chip and methods of manufacture |
11/03/1993 | EP0567814A1 Printed circuit board for mounting semiconductors and other electronic components |
11/03/1993 | EP0567694A1 Semiconductor integrated circuit device with noise protecting shield |
11/02/1993 | US5258891 Multichip module with multilayer wiring substrate |
11/02/1993 | US5258673 Rectifier device in vehicle AC generator |
11/02/1993 | US5258650 Pressure transducer |
11/02/1993 | US5258646 Package for microwave IC |
11/02/1993 | US5258330 Semiconductor chip assemblies with fan-in leads |
11/02/1993 | US5258325 Method for manufacturing a semiconductor device using a circuit transfer film |
10/28/1993 | WO1993021748A1 Membrane dielectric isolation ic fabrication |
10/28/1993 | WO1993021662A1 Multispectral photovoltaic component with stacked cells and process for its production |
10/28/1993 | WO1993021661A1 Multispectral photovoltaic component |
10/28/1993 | WO1993021551A1 Method of manufacturing a microsystem and of producing a microsystem laser from it |
10/27/1993 | EP0566913A1 Thermally enhanced semiconductor chip package |
10/26/1993 | US5256562 Array of thin film transistors on silicon substrate; cutting, tilting to transfer module body |
10/21/1993 | DE4211899A1 Verfahren zur Herstellung eines Mikrosystems und daraus Bildung eines Mikrosystemlasers A process for producing a micro-system, and the formation of a micro laser system |
10/20/1993 | EP0566354A1 A flexible printed circuit sensor assembly for detecting optical pulses |
10/20/1993 | EP0565588A1 Single crystal silicon arrayed devices for display panels |
10/19/1993 | US5255156 Bonding pad interconnection on a multiple chip module having minimum channel width |
10/19/1993 | US5253613 High power AC traction inverter cooling |
10/14/1993 | DE4210834A1 Heat sink for integrated circuit micro-chip thin film package - uses cooling plate with cooling channels open to membrane sealed to underside of plate inside facing IC micro-package |
10/13/1993 | EP0565391A1 Method and device for encapsulation of three-dimensional semi-conductor chips |
10/12/1993 | US5252857 Stacked DCA memory chips |
10/06/1993 | CN1077058A Luminous wire and its making method |
10/05/1993 | US5251099 High density electronics package having stacked circuit boards |
10/05/1993 | US5250845 Totally enclosed hermetic electronic module |
10/05/1993 | US5250843 Multichip integrated circuit modules |
10/05/1993 | US5250821 Electronic power device having plural elementary semiconductor components connected in parallel |
09/30/1993 | WO1993019485A1 Ic chip package and method of making same |
09/29/1993 | EP0562546A1 Electronic part assembly |
09/29/1993 | EP0562060A1 Mounting arrangements for high voltage/high power semiconductors |
09/28/1993 | US5249245 Optoelectroinc mount including flexible substrate and method for making same |
09/28/1993 | US5249114 Arrangement of a valve stack for high voltage direct current in a valve hall |
09/28/1993 | US5248346 Semiconductors |
09/22/1993 | EP0313597B1 Hot melt ink supply system |
09/21/1993 | US5247596 Fiber-optics connected optoelectronic device mounted on a substrate and method of manufacturing it |
09/21/1993 | US5247423 Stacking three dimensional leadless multi-chip module and method for making the same |
09/16/1993 | WO1993018555A1 Integrated solid state light emitting and detecting array and apparatus employing said array |
09/16/1993 | WO1993018549A1 Process and device for three-dimensional interconnection of housings for electronic components |
09/16/1993 | WO1993018547A1 Three dimensional, multi-chip module |
09/16/1993 | WO1993018428A2 Head-mounted display system |
09/16/1993 | CA2131465A1 Integrated solid state light emitting and detecting array and apparatus employing said array |
09/16/1993 | CA2130672A1 Head-mounted display system |
09/15/1993 | EP0560605A1 Light-source device |
09/15/1993 | EP0560502A2 Electronic circuit device and manufacturing method thereof |
09/15/1993 | EP0560259A1 Heat sink having good heat dissipating characteristics and process for producing the same |
09/15/1993 | EP0560123A2 Power transistor with multiple finger contacts |
09/14/1993 | US5245510 Hybrid integrated circuit device |
09/14/1993 | US5245215 Multichip packaged semiconductor device and method for manufacturing the same |
09/14/1993 | US5245198 Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold |
09/08/1993 | EP0559366A1 Stackable three-dimensional multiple chip semiconductor device and method for making the same |
09/08/1993 | EP0558984A2 Hybrid ceramic thin-film module structure |
09/07/1993 | US5243497 Chip on board assembly |
09/07/1993 | US5243496 Molded case integrated circuit with a dynamic impedance reducing device |
09/07/1993 | US5243218 Cooling structure for electronics devices |
09/07/1993 | US5243208 Semiconductor integrated circuit device having a gate array with a ram and by-pass signal lines which interconnect a logic section and I/O unit circuit of the gate array |
09/02/1993 | WO1993017488A1 Power semiconductor valve device for outdoor location |
09/01/1993 | EP0558226A2 Balanced circuitry for reducing inductive noise of external chip interconnections |
09/01/1993 | EP0557776A2 Indicator lamp |
09/01/1993 | EP0557318A1 Method of manufacturing semiconductor elements, in particular diodes. |
09/01/1993 | EP0551382A4 Semiconductor chip assemblies, methods of making same and components for same |
08/31/1993 | US5241456 Compact high density interconnect structure |
08/31/1993 | US5241454 Mutlilayered flexible circuit package |
08/31/1993 | US5241450 Three dimensional, multi-chip module |
08/31/1993 | US5241215 Method and apparatus for providing novel hybrid circuit assembly carrier bracket |
08/24/1993 | US5239448 For providing function in a computer system |
08/24/1993 | US5239447 Stepped electronic device package |
08/24/1993 | US5239179 Infrared detector devices |
08/19/1993 | WO1993016491A1 High density electronic circuit modules |
08/19/1993 | CA2129123A1 High density electronic circuit modules |
08/18/1993 | EP0555659A2 Multi-chip Module |
08/17/1993 | US5237203 Multilayer overlay interconnect for high-density packaging of circuit elements |
08/11/1993 | EP0385979B1 High-density electronic modules, process and product |
08/04/1993 | EP0553981A2 Low-inductance package for multiple paralleled devices operating at high frequency |
08/04/1993 | EP0284624B1 Method of forming a multichip integrated circuit package |
08/03/1993 | US5233310 Microwave integrated circuit |
07/30/1993 | CA2085644A1 Low inductance package for multiple paralleled devices operating at high frequency |
07/27/1993 | US5231304 Framed chip hybrid stacked layer assembly |
07/27/1993 | US5231049 Method of manufacturing a distributed light emitting diode flat-screen display for use in televisions |
07/27/1993 | CA2017340C Hybrid module electronics package |
07/21/1993 | EP0551741A1 Heat pipe-electrical interconnect integration for chip modules |
07/21/1993 | EP0551382A1 Semiconductor chip assemblies, methods of making same and components for same |
07/20/1993 | US5229960 Solid state memory modules and memory devices including such modules |
07/20/1993 | US5229917 VLSI integration into a 3-D WSI dual composite module |
07/20/1993 | US5229647 High density data storage using stacked wafers |
07/20/1993 | US5228666 Fixture for fabricating full width scanning or imaging arrays from subunits |
07/20/1993 | CA2031865C High-density memory array packaging |
07/15/1993 | DE4300574A1 Rectifier circuit for vehicle ac generator - has mesa isolated Zener diode rectifiers mounted inside generator on heat sinks cooled with fan |
07/15/1993 | DE4200384A1 Expansion device for augmenting functions of basic component, e.g. EPROM or SRAM - has cover with cavity on component housing with fasteners, contg. extension modules |
07/13/1993 | US5227664 Semiconductor device having particular mounting arrangement |
07/13/1993 | US5226723 Light emitting diode display |
07/08/1993 | WO1993013558A1 Energy converter |
07/08/1993 | WO1993013557A1 Structure for mounting the semiconductor chips in a three-dimensional manner |