| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/25/1992 | WO1992005582A1 Semiconductor chip assemblies, methods of making same and components for same |
| 03/25/1992 | EP0476685A2 Thin memory module |
| 03/25/1992 | EP0476136A1 Three-dimensional electronic unit and method of construction |
| 03/24/1992 | US5099393 Electronic package for high density applications |
| 03/24/1992 | CA1297998C Interconnection system for integrated circuit chips |
| 03/18/1992 | EP0475223A2 Method of fabricating integrated circuit chip package |
| 03/18/1992 | CN1059606A Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices |
| 03/17/1992 | US5096852 Method of making plastic encapsulated multichip hybrid integrated circuits |
| 03/17/1992 | US5096505 Panel for solar concentrators and tandem cell units |
| 03/11/1992 | EP0474224A1 Semiconductor device comprising a plurality of semiconductor chips |
| 03/10/1992 | US5095359 Semiconductor package and computer using the package |
| 03/10/1992 | US5094969 Method for making a stackable multilayer substrate for mounting integrated circuits |
| 03/10/1992 | CA2045227A1 High memory density package |
| 03/05/1992 | WO1992003848A2 Stacking of integrated circuits |
| 03/05/1992 | WO1991000683A3 Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting |
| 03/04/1992 | EP0473260A1 Fabrication of semiconductor packages |
| 03/04/1992 | EP0472755A1 Optical module |
| 03/04/1992 | EP0472587A1 Housing for an opto-electronic device |
| 03/03/1992 | US5092036 Filling metal tubes, then etching tubes away |
| 03/03/1992 | CA1296814C Single wafer moated signal processor |
| 03/01/1992 | CA2047767A1 Electronic circuit |
| 02/26/1992 | EP0472451A1 Hybrid integrated circuit interconnection structure and method of fabrication |
| 02/26/1992 | EP0471982A1 Mounting system for electrical function units, especially for data technics |
| 02/26/1992 | EP0471938A1 High circuit density thermal carrier |
| 02/26/1992 | EP0397747A4 Three-dimensional circuit component assembly and method corresponding thereto |
| 02/25/1992 | US5091018 Improve energy efficiency |
| 02/20/1992 | WO1992003035A1 Ultra high density integrated circuit packages, method and apparatus |
| 02/20/1992 | WO1992003031A1 Packaging for hybrid circuits |
| 02/20/1992 | DE4025885A1 Compact high-power thyristor stack for heavy duty machinery - uses cylindrical frame formed from disc-shaped heat sinks |
| 02/19/1992 | CN1015582B Carrier substrate and method for preparing same |
| 02/18/1992 | US5089880 Pressurized interconnection system for semiconductor chips |
| 02/18/1992 | US5089878 Low impedance packaging |
| 02/12/1992 | EP0470899A1 Diode having electrodes and housing assembled without soldering or crimping and rectifier bridge created with such diodes |
| 02/12/1992 | CN2096132U Voltage semiconductor light-emitting device |
| 02/11/1992 | US5087585 Method of stacking semiconductor substrates for fabrication of three-dimensional integrated circuit |
| 02/11/1992 | US5087509 Substrate used for fabrication of thick film circuit |
| 02/11/1992 | CA1295669C Converter system for coupling two high voltage three-phase networks |
| 02/06/1992 | WO1992002040A1 Package for incorporating an integrated circuit and a process for the production of the package |
| 02/04/1992 | US5086018 Method of making a planarized thin film covered wire bonded semiconductor package |
| 01/29/1992 | EP0468341A1 Semiconductor device comprising a plurality of LED chips |
| 01/29/1992 | EP0468139A2 Semiconductor element string structure |
| 01/28/1992 | US5084804 Wide-area lamp |
| 01/28/1992 | CA1295054C Grooved heat pipe cooling apparatus for semiconductors |
| 01/22/1992 | EP0467259A2 Electronic device |
| 01/21/1992 | US5083192 Cluster mount for high intensity leds |
| 01/15/1992 | EP0465814A1 A semiconductor device package and method of its manufacture |
| 01/15/1992 | EP0465812A1 Electronic assembly with enhanced heat sinking |
| 01/15/1992 | EP0465591A1 Analog to digital conversion incorporated in z-technology module |
| 01/14/1992 | US5081063 Method of making edge-connected integrated circuit structure |
| 01/08/1992 | EP0465230A2 Silicon-based optical subassembly |
| 01/08/1992 | EP0465227A2 Composite integrated circuit device |
| 01/08/1992 | EP0465199A1 Multiple lamination high density interconnect process and structure |
| 01/08/1992 | EP0465196A2 Compact high density interconnect structure |
| 01/08/1992 | EP0465195A2 Multiple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing Tg's |
| 01/08/1992 | EP0465143A2 Molded hybrid IC package and lead frame therefore |
| 01/07/1992 | US5079672 Electrical switching and control apparatus |
| 01/07/1992 | US5079189 Method of making RIS or ROS array bars using replaceable subunits |
| 01/07/1992 | CA1294059C Very high-acceleration tolerant circuit card packaging structure |
| 01/02/1992 | EP0463847A2 Terminal arrangement for a die on a printed circuit board |
| 01/02/1992 | EP0463589A2 Semiconductor power module having an integrated control plate and an error protection plate |
| 12/27/1991 | EP0462345A1 Detection element comprising detector bars |
| 12/27/1991 | EP0428695A4 Improved three-dimensional circuit component assembly and method corresponding thereto |
| 12/26/1991 | WO1991020097A1 Tandem photovoltaic solar cell with iii-v diffused junction booster cell |
| 12/24/1991 | US5075765 Low stress multichip module |
| 12/24/1991 | US5075758 Semiconductor device |
| 12/24/1991 | US5075253 Method of coplanar integration of semiconductor IC devices |
| 12/18/1991 | EP0461753A2 Modular electronic packaging system |
| 12/18/1991 | EP0461639A2 Plastic-molded-type semiconductor device |
| 12/18/1991 | EP0461458A1 Method & structure for forming vertical semiconductor interconnection |
| 12/17/1991 | US5073816 Packaging semiconductor chips |
| 12/11/1991 | EP0460802A2 Electronic device package with battery |
| 12/11/1991 | EP0460554A1 Hybrid integrated circuit device |
| 12/11/1991 | CN2090581U Semiconductic neon lamp |
| 12/11/1991 | CN1015073B Mixed photoelectric integrated semi-conductor optical bistable device |
| 12/10/1991 | US5071490 P-i-n junction |
| 12/03/1991 | US5070258 Integrated circuit having metal substrate used to provide electrical indication of operation mode of circuits |
| 11/28/1991 | WO1991018420A1 Panel for solar concentrators and tandem cell units |
| 11/28/1991 | WO1991018419A1 Terrestrial concentrator solar cell module |
| 11/26/1991 | US5068713 Solid state image sensing device |
| 11/26/1991 | US5068712 Semiconductor device |
| 11/26/1991 | US5068706 Semiconductor device with fuse function |
| 11/26/1991 | US5067233 Method of forming an integrated circuit module |
| 11/26/1991 | US5067229 Cutting device for use in manufacturing electronic components |
| 11/21/1991 | EP0457313A1 Assembly group, in particular for data technology |
| 11/19/1991 | US5067005 Semiconductor device |
| 11/19/1991 | US5065484 Rotating rectifier assembly |
| 11/13/1991 | EP0456389A2 A rotatable rectifier assembly |
| 11/13/1991 | EP0456343A1 Cluster mount for high-intensity LED's |
| 11/13/1991 | EP0456038A2 Pluggable electronic circuit package assembly with snap together heat sink housing |
| 11/12/1991 | US5065280 Flex interconnect module |
| 11/12/1991 | US5065124 DC-40 GHz module interface |
| 11/12/1991 | US5064378 Mounting of DRAMs of different sizes and pinouts within limited footprint |
| 11/06/1991 | EP0455409A1 Solid state RF power amplifier having improved efficiency and reduced distortion |
| 11/06/1991 | EP0455322A1 Semiconductor device |
| 11/06/1991 | EP0455233A2 Liquid crystal display device having driving circuit |
| 11/05/1991 | US5063286 Line image sensor with plural elements arranged at a predetermined pitch according to thermal expansion |
| 10/30/1991 | EP0454447A2 Semiconductor device assembly |
| 10/30/1991 | CN2087817U Wired communication management machine for mine explosion protection |
| 10/29/1991 | US5061990 Semiconductor device and the manufacture thereof |
| 10/29/1991 | US5061987 Silicon substrate multichip assembly |