| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/10/1997 | EP0794574A1 Mass memory and method for its fabrication |
| 09/04/1997 | DE19637800C1 Cable amplifier with heat sink partly uncovered by circuit board e.g. for cable television (TV) |
| 09/03/1997 | EP0792519A1 Interconnection elements for microelectronic components |
| 09/03/1997 | EP0792517A1 Electrical contact structures from flexible wire |
| 09/03/1997 | EP0792463A1 Mounting spring elements on semiconductor devices, and wafer-level testing methodology |
| 09/03/1997 | EP0792462A1 Probe card assembly and kit, and methods of using same |
| 09/02/1997 | US5663869 Packaging electrical components |
| 09/02/1997 | US5663858 Method for fault correction in a power converter circuit arrangement |
| 09/02/1997 | US5663105 Semiconductor device package side-by-side stacking and mounting system |
| 09/02/1997 | US5661901 Method for mounting and electrically interconnecting semiconductor dice |
| 08/28/1997 | DE19706983A1 Semiconductor electronics component surface fitting unit for motor vehicle |
| 08/27/1997 | EP0791962A1 Semiconductor rectifier module |
| 08/27/1997 | EP0791961A2 Power semiconductor module |
| 08/27/1997 | EP0791887A2 Flip-chip layout input and verification apparatus and method |
| 08/27/1997 | CN1158006A High density interconnected circuit module with compliant layer as part of stress-reducing molded substrate |
| 08/26/1997 | US5661371 Color filter system for light emitting display panels |
| 08/26/1997 | US5661343 Power hybrid integrated circuit apparatus |
| 08/26/1997 | US5661339 Thin multichip module |
| 08/26/1997 | US5661336 Tape application platform and processes therefor |
| 08/26/1997 | US5661330 Fabrication, testing and repair of multichip semiconductor structures having connect assemblies with fuses |
| 08/26/1997 | US5661267 Detector alignment board |
| 08/26/1997 | US5661091 Method of manufacturing a semiconductor device having PN junctions separated by depressions |
| 08/26/1997 | US5661087 Vertical interconnect process for silicon segments |
| 08/26/1997 | US5661077 Method for fabricating an optical integrated circuit |
| 08/26/1997 | US5660461 Arrays of optoelectronic devices and method of making same |
| 08/21/1997 | WO1997019462A3 Vertically integrated semiconductor component and method of producing the same |
| 08/21/1997 | DE19644325A1 Semiconductor laser module |
| 08/20/1997 | EP0790653A2 IC package and its assembly method |
| 08/19/1997 | US5659212 Rectifier assembly for automotive alternator |
| 08/19/1997 | US5657537 Method for fabricating a stack of two dimensional circuit modules |
| 08/13/1997 | EP0789446A1 Semi-conductor power module |
| 08/13/1997 | EP0789390A2 A method for producing multilayer hybrid circuit |
| 08/13/1997 | EP0788661A1 Three-colour sensor |
| 08/12/1997 | US5657206 Conductive epoxy flip-chip package and method |
| 08/12/1997 | US5657203 Electronic device having a plurality of circuit boards arranged therein |
| 08/12/1997 | US5656863 Resin seal semiconductor package |
| 08/12/1997 | US5656856 Reduced noise semiconductor package stack |
| 08/12/1997 | US5656847 Led lamp arrangement and led matrix display panel |
| 08/12/1997 | US5656553 Method for forming a monolithic electronic module by dicing wafer stacks |
| 08/12/1997 | US5656552 Method of making a thin conformal high-yielding multi-chip module |
| 08/12/1997 | US5656548 Method for forming three dimensional processor using transferred thin film circuits |
| 08/12/1997 | US5655830 Lighting device |
| 08/12/1997 | US5655290 Method for making a three-dimensional multichip module |
| 08/07/1997 | WO1997028565A1 Led matrix |
| 08/07/1997 | DE19603444A1 LED-Vorrichtung LED device |
| 08/06/1997 | EP0788152A2 Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance |
| 08/05/1997 | US5654559 Optical coupling device and method for manufacturing the same |
| 08/05/1997 | US5654221 Method for forming semiconductor chip and electronic module with integrated surface interconnects/components |
| 08/05/1997 | US5654220 Method of making a stacked 3D integrated circuit structure |
| 08/05/1997 | CA2062413C Molded optical packaging arrangement |
| 07/31/1997 | WO1997027593A1 Stacked memory module substrate and system for accessing the substrate |
| 07/31/1997 | DE19603224A1 Power semiconductor mechanical apparatus for e.g. power switch or rectifier |
| 07/30/1997 | EP0786809A1 Electronic circuit package |
| 07/30/1997 | CN1155760A Controlled profile multiple chip modules |
| 07/29/1997 | US5652471 Rectifier arrangement, especially for a three-phase generator for a motor vehicle |
| 07/29/1997 | US5652466 Package for a semiconductor element |
| 07/29/1997 | US5652462 Multilevel semiconductor integrated circuit device |
| 07/24/1997 | WO1997026605A1 Processor-inclusive memory module |
| 07/24/1997 | DE19601629A1 Diode rectifier apparatus for terminal plate of transformer |
| 07/23/1997 | EP0785580A2 LED display packaging with substrate removal and method of fabrication |
| 07/23/1997 | EP0785578A2 Circuit comprising complementary thin film transistors |
| 07/23/1997 | CN1155165A Power semiconductor module system |
| 07/22/1997 | US5650920 Mount for supporting a high frequency transformer in a hybrid module |
| 07/22/1997 | US5650760 Microwave enclosure |
| 07/22/1997 | US5650685 Microcircuit package with integrated acoustic isolator |
| 07/22/1997 | US5650665 Hybrid integrated circuit device including circuit patterns of different conductivity and circuit elements mounted on an insulating substrate |
| 07/22/1997 | US5650635 Photoelectric cells comprising doped semiconductor; heterojunctions |
| 07/22/1997 | US5650357 Process for manufacturing a lead frame capacitor and capacitively-coupled isolator circuit using same |
| 07/17/1997 | WO1997025742A1 Multi-chip integrated circuit package |
| 07/16/1997 | EP0784376A2 Semiconductor device and semiconductor module |
| 07/16/1997 | EP0784342A2 Pressure contact type semiconductor device and assembly method therefor |
| 07/16/1997 | EP0783765A1 Chip packaging technique |
| 07/15/1997 | US5648893 Upgradable multi-chip module |
| 07/15/1997 | US5648890 Upgradable multi-chip module |
| 07/15/1997 | US5648684 Endcap chip with conductive, monolithic L-connect for multichip stack |
| 07/15/1997 | US5648683 Semiconductor device in which a first resin-encapsulated package is mounted on a second resin-encapsulated package |
| 07/15/1997 | US5648681 Semiconductor device having a supporting lead to support a bypass lead portion |
| 07/10/1997 | WO1997024770A1 Surface mount led alphanumeric display |
| 07/10/1997 | WO1997024764A1 Integrated system package |
| 07/10/1997 | WO1997024740A1 High density inter-chip connections by electromagnetic coupling |
| 07/10/1997 | WO1997024706A2 True color flat panel display using an led dot matrix and led dot matrix drive method and apparatus |
| 07/09/1997 | CN1153997A Improved integrated chip package with reduced dimensions |
| 07/08/1997 | US5646838 Bridge rectifier for diode-rectified alternating current generator |
| 07/08/1997 | US5646830 Semiconductor device having an interconnecting circuit board |
| 07/08/1997 | US5646829 Resin sealing type semiconductor device having fixed inner leads |
| 07/08/1997 | US5646828 Thin packaging of multi-chip modules with enhanced thermal/power management |
| 07/08/1997 | US5646827 Electronic device having a plurality of circuit boards arranged therein |
| 07/08/1997 | US5646446 Three-dimensional flexible assembly of integrated circuits |
| 07/08/1997 | US5646445 Semiconductor device having electrodes embedded in an insulating case |
| 07/08/1997 | US5646068 Forming regions on substrate for connection of electrical components to substrate using first metallurgy, form pattern of bumps using second metallurgy on coupon, applying bumps to substrate |
| 07/08/1997 | US5646067 Depositing multilayer barrier and adhesion material |
| 07/03/1997 | DE19549011A1 Power semiconductor module with parallel IGBT chips |
| 07/02/1997 | EP0782191A2 Multi-level stacked integrated-circuit-chip assembly |
| 07/01/1997 | US5644162 Semiconductor chip having chip metal layer and transfer metal layer composed of same metal, and corresponding electronic module |
| 07/01/1997 | US5644161 Ultra-high density warp-resistant memory module |
| 07/01/1997 | US5643804 Forming thin films and passivation layer on substrate, cutting substrate into separate chips, then heat treatament |
| 06/26/1997 | WO1997022996A1 Multi-chip device and method of fabrication employing leads over and under processes |
| 06/26/1997 | WO1997022990A1 Secure semiconductor device |
| 06/26/1997 | DE19634202A1 Semiconductor power module with semiconductor heat convecting heat radiator plate |
| 06/26/1997 | DE19617055C1 High-density multilayer prepreg semiconductor power module |