H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/1997
11/25/1997	US5691248 Methods for precise definition of integrated circuit chip edges
11/25/1997	US5691243 Process for manufacturing composite semiconductor device
11/25/1997	US5691239 Method for fabricating an electrical connect above an integrated circuit
11/20/1997	WO1997043887A1 Heat spreader system and method for cooling heat generating components
11/20/1997	WO1997037374A3 Method of packaging multiple integrated circuit chips in a standard semiconductor device package
11/20/1997	DE19720275A1 Substrate for stacked semiconductor component
11/20/1997	DE19716668A1 Small outline, stacking J-lead package for semiconductor chip encapsulation
11/20/1997	CA2255060A1 Heat spreader system and method for cooling heat generating components
11/19/1997	EP0807976A2 Solid-state imaging apparatus and camera using the same
11/19/1997	EP0807975A1 Power semiconductor device
11/19/1997	EP0807369A1 Stackable modules and multimodular assemblies
11/19/1997	CN2268311Y Power transistor mould block with resistance
11/19/1997	CN1165584A Microelectronic assemblies including z-axis conductive films
11/18/1997	US5689279 Integrated electro-optical package
11/18/1997	US5689136 Semiconductor device and fabrication method
11/18/1997	US5689135 Multi-chip device and method of fabrication employing leads over and under processes
11/18/1997	US5689106 Optical device assembly having a metallic bump bonding together two planar optical components, and its preparation
11/18/1997	US5688721 3D stack of IC chips having leads reached by vias through passivation covering access plane
11/13/1997	WO1997024706A3 True color flat panel display using an led dot matrix and led dot matrix drive method and apparatus
11/13/1997	DE19648492A1 Three=dimensional multi-chip module, e.g. memory module
11/12/1997	EP0795200A4 Mounting electronic components to a circuit board
11/12/1997	CN1164765A 半导体封装件 The semiconductor package
11/12/1997	CN1164764A Multi-layer bottom lead package
11/11/1997	US5686843 Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
11/11/1997	US5686758 Semiconductor device having integral structure of case and external connection terminals
11/11/1997	US5686697 Electrical circuit suspension system
11/11/1997	US5686360 Hermetic sealing of plastic substrate
11/11/1997	US5685885 Wafer-scale techniques for fabrication of semiconductor chip assemblies
11/06/1997	DE19717611A1 Electronic component housing structure for e.g. semiconductor sensor and control integrated circuit
11/05/1997	EP0805496A2 Integrated electro-optical package and method of fabrication
11/05/1997	EP0805494A2 Semiconductor multilayer power module having high package density
11/04/1997	US5684902 Semiconductor laser module
11/04/1997	US5684675 Semiconductor device unit having holder
10/1997
10/30/1997	DE19713656A1 Power semiconductor module with e.g. multiple semiconductor IGBT in bridge circuit
10/29/1997	EP0803910A2 Infrared to visible light image conversion device
10/29/1997	EP0803174A2 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
10/29/1997	CN1163481A Method for producing power semiconductor module
10/28/1997	US5682064 Repairable wafer scale integration system
10/28/1997	US5682062 System for interconnecting stacked integrated circuits
10/23/1997	WO1997039525A1 Silicon carbide rf power module
10/23/1997	WO1997039483A1 Method for manufacturing multi-chip modules utilizing direct lead attach
10/23/1997	WO1997039482A1 Methods for manufacturing a semiconductor package
10/23/1997	DE19615112A1 Power semiconductor component with two-lid housing
10/23/1997	DE19613820A1 Struktur mit einer pin- oder nip-Schichtenfolge Structure with a pin or nip layer sequence
10/22/1997	EP0802572A2 SMD light emitting diode
10/22/1997	EP0802566A2 Semiconductor devices, method of connecting semiconductor devices, and semicondutor device connectors
10/22/1997	EP0801815A1 Electrical circuit suspension system
10/22/1997	EP0766909A4 Vertical interconnect process for silicon segments
10/21/1997	US5679979 Surface mount package with heat transfer feature
10/21/1997	US5679977 Semiconductor chip assemblies, methods of making same and components for same
10/21/1997	US5679609 Fabrication, testing and repair of multichip semiconductor structures having connect assemblies with fuses
10/16/1997	WO1997038450A1 Three-colour sensor with a pin or nip series of layers
10/15/1997	CN1162367A Three-colour sensor
10/15/1997	CA2202316A1 Electronic device assembly
10/14/1997	US5677616 Rectifying and voltage regulating unit of AC generator and method of making the same
10/14/1997	US5677569 Semiconductor multi-package stack
10/14/1997	US5676752 Method of producing sheets of crystalline material and devices made therefrom
10/09/1997	WO1997037389A1 Integrated δe-e detector telescope
10/09/1997	WO1997037385A1 High-density solid-state lighting array for machine vision applications
10/09/1997	WO1997037374A2 Method of packaging multiple integrated circuit chips in a standard semiconductor device package
10/08/1997	CN1161572A Power semiconductor mdoule having plurality of submodules
10/08/1997	CN1036057C Method for cooling high power AC traction inverter
10/07/1997	US5675183 Hybrid multichip module and methods of fabricating same
10/07/1997	US5675180 Vertical interconnect process for silicon segments
10/07/1997	US5674785 Forming wire electroconnection between the patterned pads and patterned conductor through the opening; materials handling; packaging
10/07/1997	US5673995 Support element for a motor vehicle indicating display, and a method of making it
10/07/1997	US5673479 Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer
10/07/1997	US5673478 Method of forming an electronic device having I/O reroute
10/02/1997	WO1997036363A1 Gas-insulated high-voltage semiconductor valve means
10/02/1997	WO1997036325A1 Packaging and interconnect system for integrated circuits
10/02/1997	DE19650148A1 Semiconductor integrated circuit package apparatus
10/02/1997	DE19648728A1 High density semiconductor integrated circuit package apparatus
10/01/1997	EP0798788A1 A display sign and an optical element for use in the same
10/01/1997	EP0798784A2 LED display packaging with substrate removal and method of fabrication
10/01/1997	EP0798782A2 Microwave circuit package
10/01/1997	CN2263827Y Lattice semiconducter luminescent device and luminescent apparatus
10/01/1997	CN1160934A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/01/1997	CN1160926A 半导体装置及其制造方法 Semiconductor device and manufacturing method
10/01/1997	CN1036043C Power module
09/1997
09/30/1997	US5673131 Circuit coupling apparatus
09/30/1997	US5672908 Thin semiconductor integrated circuit device assembly
09/30/1997	US5672414 Multilayered printed board structure
09/24/1997	EP0796506A1 Arrays of optoelectronic devices and method of making same
09/23/1997	US5671125 Vertical package mounted on both sides of a printed circuit board
09/23/1997	US5670824 Vertically integrated component assembly incorporating active and passive components
09/23/1997	US5670428 Semiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the same
09/23/1997	US5669546 Apparatus for manufacturing semiconductor device and method of manufacturing the semiconductor device using the same
09/18/1997	WO1997034317A1 Method of manufacturing a hybrid integrated circuit
09/17/1997	EP0795906A2 An electronic-circuit assembly and its manufacturing method
09/17/1997	EP0795902A2 Multichip or hybrid module and process of releasing dies for the substrate
09/17/1997	EP0795200A1 Mounting electronic components to a circuit board
09/17/1997	CN2262764Y Noiseless potentiometer
09/16/1997	US5668409 Integrated circuit with edge connections and method
09/16/1997	US5668408 Packaging assembly
09/16/1997	US5668406 Semiconductor device having shielding structure made of electrically conductive paste
09/16/1997	US5668383 Semiconductor device for bidirectional non-conducted optical data transmission
09/16/1997	US5667595 Process for manufacturing a solar module and the solar module prepared thereby
09/16/1997	US5667132 Method for solder-bonding contact pad arrays
09/12/1997	WO1997033362A1 Stack structure of semiconductor devices having different electrode sizes and power converter using the same
09/11/1997	DE19608391A1 Reflex sensor for e.g. detection or position identification of object

1 ... 364 365 366 367 368 369 370 371 372 373 374 375 376 377 378 379 380 381 382 383 384 ... 409