| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/04/1998 | EP0822595A2 Hybrid module |
| 02/03/1998 | US5715147 Semiconductor device having an interconnecting circuit board |
| 02/03/1998 | US5715144 Multi-layer, multi-chip pyramid and circuit board structure |
| 02/03/1998 | US5715142 Electronic power module |
| 02/03/1998 | US5714802 High-density electronic module |
| 02/03/1998 | US5714782 Composite integrated circuit device |
| 02/03/1998 | US5714405 Semiconductor device |
| 01/29/1998 | DE19641980C1 White light source used in opto-electronic devices |
| 01/28/1998 | EP0821406A2 Method of wire bonding an integrated circuit to an ultra-flexible substrate |
| 01/28/1998 | EP0820643A1 Integrated circuit packages |
| 01/27/1998 | US5712767 Circuit elements mounting |
| 01/27/1998 | US5712517 Epoxy insulator coating on an alternator heat sink |
| 01/27/1998 | US5712190 Process for controlling distance between integrated circuit chips in an electronic module |
| 01/27/1998 | CA2061949C Electronic circuit package |
| 01/22/1998 | WO1998002921A1 Transferred flexible integrated circuit |
| 01/22/1998 | WO1998002919A1 Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device |
| 01/22/1998 | DE19628549A1 Current regulator assembly system |
| 01/22/1998 | DE19627858A1 Complex power electronic module e.g. for converters of variable speed drives |
| 01/21/1998 | CN1171167A Composite intermediate connecting element of microelectronic device and its production method |
| 01/21/1998 | CN1170961A Lid air bridge line |
| 01/21/1998 | CN1037134C Integrated circuit device |
| 01/20/1998 | US5710733 Processor-inclusive memory module |
| 01/20/1998 | US5710463 High-voltage breakover diode |
| 01/20/1998 | US5710428 Infrared focal plane array detecting apparatus having light emitting devices and infrared camera adopting the same |
| 01/14/1998 | EP0818822A2 Package structure for multichip modules |
| 01/14/1998 | EP0818132A1 A method to prevent intrusions into electronic circuitry |
| 01/14/1998 | EP0818023A2 Support module |
| 01/13/1998 | US5708566 Solder bonded electronic module |
| 01/13/1998 | US5708419 Method of wire bonding an integrated circuit to an ultraflexible substrate |
| 01/13/1998 | US5708299 Multichip press-contact type semiconductor device |
| 01/13/1998 | US5708298 Semiconductor memory module having double-sided stacked memory chip layout |
| 01/13/1998 | US5708297 Thin multichip module |
| 01/13/1998 | US5706578 Method for producing a three-dimensional circuit arrangement |
| 01/08/1998 | WO1998000869A1 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules |
| 01/08/1998 | WO1998000868A1 Process for forming a spatial chip arrangement, and said spatial arrangement |
| 01/08/1998 | WO1998000865A1 Module for an electrical device |
| 01/07/1998 | EP0817280A2 Optical sensor for reading a pattern |
| 01/07/1998 | EP0815615A1 A package housing multiple semiconductor dies |
| 01/06/1998 | US5706176 Butted chip array with beveled chips |
| 01/06/1998 | US5706172 Stacked semiconductor package having supporting bars and a socket therefor |
| 01/06/1998 | US5705858 Packaging structure for a hermetically sealed flip chip semiconductor device |
| 01/06/1998 | US5705853 Power semiconductor module |
| 01/06/1998 | US5705848 Power semiconductor module having a plurality of submodules |
| 01/06/1998 | US5705425 Process for manufacturing semiconductor devices separated by an air-bridge |
| 01/02/1998 | DE19626227A1 Anordnung zur Wärmeableitung bei Chipmodulen auf Mehrschicht-Keramikträgern, insbesondere Multichipmodule Arrangement for heat dissipation in chip modules on multi-layered ceramic carriers, particularly multi-chip modules |
| 01/02/1998 | DE19626126A1 Verfahren zur Ausbildung einer räumlichen Chipanordnung und räumliche Chipanordung A method of forming a three-dimensional chip configuration and spatial Chipanordung |
| 01/02/1998 | DE19625756A1 Modul für ein elektrisches Gerät Module for an electrical appliance |
| 12/31/1997 | WO1997050127A1 Stacked semiconductor device package |
| 12/30/1997 | US5703753 Electronic assembly |
| 12/30/1997 | US5703747 Multichip semiconductor structures with interchip electrostatic discharge protection, and fabrication methods therefore |
| 12/30/1997 | US5703400 Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers |
| 12/30/1997 | US5703399 Semiconductor power module |
| 12/30/1997 | US5703394 Integrated electro-optical package |
| 12/30/1997 | US5703363 Infrared to visible light image conversion device |
| 12/30/1997 | US5702984 Integrated mulitchip memory module, structure and fabrication |
| 12/30/1997 | US5702963 Using circuit tiles of silicon thin-films which are transferred, interconnected and packaged |
| 12/29/1997 | EP0792462A4 Probe card assembly and kit, and methods of using same |
| 12/23/1997 | US5701233 Stackable modules and multimodular assemblies |
| 12/23/1997 | US5701037 Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit |
| 12/23/1997 | US5701031 Sealed stacked arrangement of semiconductor devices |
| 12/23/1997 | US5701018 Semiconductor device having parallel connection of an insulated gate bipolar transistor and a diode |
| 12/23/1997 | US5699609 Method of making power substrate assembly |
| 12/18/1997 | WO1997048134A1 Illuminator assembly incorporating light emitting diodes |
| 12/18/1997 | DE19725464A1 Semiconductor chip stack housing |
| 12/17/1997 | EP0813246A2 Semiconductor device comprising two semiconductor substrates |
| 12/17/1997 | EP0812474A1 Integrated system package |
| 12/17/1997 | EP0812473A1 Arrangement of electronic components on a carrier strip |
| 12/17/1997 | CN1167966A Integrated electro-optical package and method of fabrication |
| 12/17/1997 | CN1036749C Inverter apparatus for electric rolling stock |
| 12/16/1997 | US5699234 Stacking of three dimensional high density interconnect modules with metal edge contacts |
| 12/16/1997 | US5699232 Power semiconductor module having a plastic housing a metal/ceramic multilayer substrate and terminals in a soft encapsulation |
| 12/16/1997 | US5699073 Integrated electro-optical package with carrier ring and method of fabrication |
| 12/16/1997 | US5698899 Semiconductor device with first and second sealing resins |
| 12/16/1997 | US5698898 Semiconductor apparatus with a multiple element electrode structure |
| 12/16/1997 | US5698895 Silicon segment programming method and apparatus |
| 12/11/1997 | DE19714470A1 Multichip interconnection for multichip module containing programmable logic component |
| 12/10/1997 | EP0811245A1 Microelectronic assemblies including z-axis conductive films |
| 12/10/1997 | EP0641485A4 Membrane dielectric isolation ic fabrication. |
| 12/09/1997 | US5696466 Heterolithic microwave integrated impedance matching circuitry and method of manufacture |
| 12/09/1997 | US5696032 Tape application platform and processes therefor |
| 12/09/1997 | US5696031 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 12/09/1997 | US5696030 Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor |
| 12/09/1997 | CA2120804C Apparatus and method for assembling and checking microwave monolithic integrated circuit (mmic) module |
| 12/04/1997 | DE19720300A1 Chip-on-chip hybrid electronic component |
| 12/04/1997 | DE19621148A1 Lighting element, especially e.g. for use in motor vehicles |
| 12/03/1997 | EP0810661A2 Microelectronic packaging using arched solder columns |
| 12/03/1997 | EP0809924A1 Multiple chip module mounting assembly and computer using same |
| 12/02/1997 | US5694300 Electromagnetically channelized microwave integrated circuit |
| 11/27/1997 | WO1997044825A1 Surface mount package with heat transfer feature |
| 11/27/1997 | WO1997044824A1 High-density, integrated circuit chip package |
| 11/27/1997 | DE19721061A1 Semiconductor module for power IGBT module |
| 11/26/1997 | EP0809292A2 Power transistor module |
| 11/26/1997 | EP0809289A2 Lid air bridge for integrated circuit |
| 11/26/1997 | CN1166058A Substrate for semiconductor package, fabrication method thereof, and stacked type semiconductor package using substrate |
| 11/26/1997 | CN1166057A Bottom lead semiconductor chip stack package |
| 11/26/1997 | CN1166013A Integrated electro-optical package and method of fabrication |
| 11/25/1997 | US5691892 Rectifier arrangement for a three-phase generator |
| 11/25/1997 | US5691884 Semiconductor device with removably fixed lead frame |
| 11/25/1997 | US5691760 Photosensitive silicon chip having photosites spaced at varying pitches |
| 11/25/1997 | US5691673 Semiconductor integrated circuit apparatus having input/output portions impedance-matched for transmission lines |