| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 04/14/1998 | US5739585 Single piece package for semiconductor die |
| 04/14/1998 | US5739582 Method of packaging a high voltage device array in a multi-chip module |
| 04/14/1998 | US5739581 High density integrated circuit package assembly with a heatsink between stacked dies |
| 04/14/1998 | US5739556 Pressure contact housing for semiconductor components |
| 04/14/1998 | US5739552 Semiconductor light emitting diode producing visible light |
| 04/09/1998 | WO1998015005A1 Microelectronic component with a sandwich design |
| 04/09/1998 | WO1998014996A1 Storage assembly with self-aligning non-integrated capacitor arrangement |
| 04/09/1998 | DE19701165C1 Chip card module |
| 04/09/1998 | DE19641272A1 Optoelectronic hybrid components mfg. method for sensor |
| 04/08/1998 | EP0834923A1 Electronic semiconductor components power module and high power interrupter using the same |
| 04/08/1998 | EP0834242A1 Connection substrate |
| 04/08/1998 | CN1038009C Inverter device |
| 04/07/1998 | US5737272 Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus |
| 04/07/1998 | US5737210 Bridge rectifier configuration and mounting for supplying exciter current in an AC generator |
| 04/07/1998 | US5737192 Density improvement in integration modules |
| 04/07/1998 | US5736786 Power module with silicon dice oriented for improved reliability |
| 04/07/1998 | US5736768 Semiconductor device on a substrate or a matrix display panel |
| 04/07/1998 | US5736452 Method of manufacturing a hybrid integrated circuit |
| 04/02/1998 | WO1998013876A1 Hybrid microwave-frequency integrated circuit |
| 04/02/1998 | WO1998013874A1 Hybrid high-power microwave-frequency integrated circuit |
| 04/02/1998 | WO1998013207A1 Light emitting diode substrate and its manufacturing method |
| 04/01/1998 | EP0833422A2 Power converter |
| 04/01/1998 | EP0833163A1 Accelerometer |
| 04/01/1998 | EP0832438A1 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus |
| 03/31/1998 | US5734199 Semiconductor device having improved test electrodes |
| 03/31/1998 | US5734156 Optical device assembly and its preparation using metallic bump bonding and a stand-off for bonding together two planar optical components |
| 03/26/1998 | WO1998012906A1 Cable repeater |
| 03/26/1998 | WO1998012748A1 Junction semiconductor module |
| 03/26/1998 | WO1998012747A1 Integrated circuit with housing accommodating the latter |
| 03/26/1998 | WO1998012706A1 Device and method for testing integrated circuit dice in an integrated circuit module |
| 03/26/1998 | DE19638175A1 Integrierte Schaltung mit einem diese in sich aufnehmenden Gehäuse An integrated circuit comprising a housing accommodating the latter within itself |
| 03/25/1998 | EP0831530A2 Integrated dielectric substrate |
| 03/24/1998 | US5731970 Power conversion device and semiconductor module suitable for use in the device |
| 03/24/1998 | US5731945 Multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes |
| 03/24/1998 | US5731747 Electronic component having a thin-film structure with passive elements |
| 03/24/1998 | US5731653 Low resistance current transfer device for a circuit of a brushless exciter |
| 03/24/1998 | US5731633 Thin multichip module |
| 03/19/1998 | WO1998011767A1 Solid state switching device arrangement for silicon transfer switch |
| 03/18/1998 | CN1176571A Multilayer metallized printing plate and its forming module |
| 03/17/1998 | US5729435 Semiconductor device and assembly board having through-holes filled with filling core |
| 03/17/1998 | US5728972 Multiple chip module for packaging integrated circuits |
| 03/17/1998 | US5728601 Process for manufacturing a single in-line package for surface mounting |
| 03/12/1998 | WO1998010508A1 Semiconductor device |
| 03/12/1998 | DE19736896A1 Gehäuse für Halbleiterbauteile Enclosure for semiconductor devices |
| 03/12/1998 | DE19645636C1 Power module for operating electric motor with speed and power control |
| 03/11/1998 | EP0828341A2 Modular type power semiconductor apparatus |
| 03/11/1998 | EP0827633A1 Semiconductor assembly |
| 03/11/1998 | CN2276200Y Fully spotlight high efficiency luminous diode |
| 03/11/1998 | CN1175805A Clock skew minimization system and method for integrated circuits |
| 03/11/1998 | CN1175793A LED display packaging with substrate removal and method of fabrication |
| 03/11/1998 | CN1037733C Single-phase high-voltage rectification equipment |
| 03/10/1998 | US5726605 Silicon carbide RF power module |
| 03/10/1998 | US5726495 Heat sink having good heat dissipating characteristics |
| 03/10/1998 | US5726493 Semiconductor device and semiconductor device unit having ball-grid-array type package structure |
| 03/10/1998 | US5726492 Semiconductor module including vertically mounted semiconductor chips |
| 03/10/1998 | US5726491 Tape carrier package |
| 03/10/1998 | US5724729 Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials |
| 03/05/1998 | WO1998009366A1 Adaptable rotating rectifier and suppression resistor assembly for two-pole, wound rotor of dynamoelectric machine |
| 03/05/1998 | DE19640213C1 Speicheranordnung mit selbstjustierender nicht integrierter Kondensatoranordnung Memory device having self-aligned non-integrated capacitor arrangement |
| 03/05/1998 | DE19634823A1 Low-inductance, high-resistance diode arrangement e.g. for converter |
| 03/05/1998 | CA2266649A1 Adaptable rotating rectifier and suppression resistor assembly for two-pole, wound rotor of dynamoelectric machine |
| 03/04/1998 | EP0827203A2 Clock skew minimisation system and method for integrated circuits |
| 03/04/1998 | EP0827201A2 Power semiconductor device |
| 03/04/1998 | EP0826234A1 Method of manufacturing a hybrid integrated circuit |
| 03/03/1998 | US5724233 Semiconductor device having first and second semiconductor chips with a gap therebetween, a die stage in the gap and associated lead frames disposed in a package, the lead frames providing electrical connections from the chips to an exterior of the packag |
| 03/03/1998 | US5723907 Loc simm |
| 03/03/1998 | US5723906 High-density wirebond chip interconnect for multi-chip modules |
| 03/03/1998 | US5723903 Thin type semiconductor device, module structure using the device and method of mounting the device on board |
| 03/03/1998 | US5723901 Stacked semiconductor device having peripheral through holes |
| 03/03/1998 | US5723363 Method of manufacturing a semiconductor device |
| 03/03/1998 | US5722767 LED display panel structure |
| 02/26/1998 | WO1998008251A1 Semiconductor and method for manufacturing the same |
| 02/25/1998 | EP0825649A2 Method of protecting during transportation or packaging the lead pins and guide pins of semiconductor devices |
| 02/25/1998 | EP0771519A4 Integrally bumped electronic package components |
| 02/25/1998 | CN1174490A Method for mounting electronic component and device with binder on circuit substrate |
| 02/25/1998 | CN1174444A Converter circuit arrangement |
| 02/25/1998 | CN1174405A LED display packaging with substrate removal and method of fabrication |
| 02/24/1998 | US5721455 Semiconductor device having a thermal resistance detector in the heat radiating path |
| 02/24/1998 | US5721452 Angularly offset stacked die multichip device and method of manufacture |
| 02/19/1998 | WO1998007193A1 Multichip module |
| 02/18/1998 | EP0824270A2 A method of mounting a plurality of electronic parts on a circuit board |
| 02/18/1998 | CN1173735A Method of wire bonding integrated circuit to ultraflexible substrate |
| 02/17/1998 | US5719745 Extended surface cooling for chip stack applications |
| 02/17/1998 | US5719438 Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging |
| 02/17/1998 | US5719436 Package housing multiple semiconductor dies |
| 02/12/1998 | WO1998006132A1 Integrated circuit device manufacture |
| 02/12/1998 | DE19733874A1 Electronic system for microwave or millimetre wave band communications |
| 02/12/1998 | DE19647229C1 Plate type component carrier to component carrier connector device for e.g. circuit board |
| 02/12/1998 | DE19632200A1 Multichipmodul Multi-chip module |
| 02/11/1998 | EP0823773A2 Power converter circuit |
| 02/11/1998 | EP0823133A1 Organic light-emitting devices |
| 02/11/1998 | EP0823130A1 Encapsulation of transmitter and receiver modules |
| 02/11/1998 | EP0823129A1 Chip cover |
| 02/11/1998 | CN1173047A Surface electroluminescent lamp and liquid crystal display device disposed surface electroluminuscent lamp |
| 02/11/1998 | CN1037387C Silicon semi-conductor commutation bridge with basilar plate structure |
| 02/10/1998 | US5717573 Interconnection card and methods for manufacturing and connecting the card |
| 02/10/1998 | US5717245 Ball grid array arrangement |
| 02/05/1998 | WO1998005069A1 Heterolithic voltage controlled oscillator |
| 02/05/1998 | DE19631046A1 Chip surface bond structure |
| 02/04/1998 | EP0822642A1 A rectifier for an alternator, particularly for motor vehicles |