Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
06/1998
06/02/1998US5761039 Electrical load switch for a motor vehicle
06/02/1998US5761028 Transistor connection assembly having IGBT (X) cross ties
06/02/1998US5760650 Coplanar waveguide amplifier
06/02/1998US5760479 Flip-chip die attachment for a high temperature die to substrate bond
06/02/1998US5760478 Clock skew minimization system and method for integrated circuits
06/02/1998US5760477 Integrated circuit contacts having resistive electromigration characteristics
06/02/1998US5760472 Surface mount semiconductor package
06/02/1998US5760471 Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package
06/02/1998US5760425 Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance
06/02/1998US5760419 Monolithic wavelength meter and photodetector using a wavelength dependent reflector
05/1998
05/28/1998WO1998022981A1 Semiconductor integrated circuit with inductor
05/28/1998WO1998022980A1 Semiconductor device and process for manufacturing the same
05/27/1998EP0844666A1 Electronic multi-level modules assembly
05/27/1998EP0753204B1 Method of froming semiconductor component designed for vertical integration and use for testing purposes
05/27/1998EP0665599B1 Lighting device by infrared radiation
05/27/1998CN1183170A Encapsulation of transmitter and receiver modules
05/26/1998USRE35807 Power semiconductor packaging
05/26/1998US5757620 Apparatus for cooling of chips using blind holes with customized depth
05/26/1998US5757445 Single crystal silicon tiles for display panels
05/26/1998US5757126 Organic light emitting diodes
05/26/1998US5757080 Resin-sealed semiconductor device
05/26/1998US5756395 Process for forming metal interconnect structures for use with integrated circuit devices to form integrated circuit structures
05/22/1998WO1998021752A1 Memory module
05/21/1998CA2219831A1 Multi-level assembly of electronic modules
05/20/1998EP0843365A2 Light source and technique for mounting light emitting diodes
05/20/1998DE19647590A1 High power semiconductor multi-chip module e.g. for power electronics
05/20/1998CN2282272Y Semiconductor energy saving lamp bulb
05/20/1998CN1182499A 芯片罩盖 Chip cover
05/19/1998US5754726 Optical device assembly used for fastening to pc boards
05/19/1998US5754408 Stackable double-density integrated circuit assemblies
05/19/1998US5754405 Stacked dual in-line package assembly
05/19/1998US5753973 Resin seal semiconductor package
05/19/1998US5753971 Power semiconductor module with terminal pins
05/19/1998US5753536 Semiconductor device and associated fabrication method
05/14/1998WO1998020553A1 Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
05/14/1998DE19646396A1 Power semiconductor module, especially power converter
05/13/1998EP0841843A1 Power module for electrical motor drive
05/13/1998EP0841842A1 Control apparatus for driving the electrical motor of vehicles
05/13/1998EP0841700A2 Semiconductor integrated circuit assembly with custom circuit mounted on standard IC
05/13/1998EP0841666A1 Multistage-coupled modules having electronic parts
05/12/1998US5752182 Hybrid IC
05/12/1998US5751553 Thin multichip module including a connector frame socket having first and second apertures
05/12/1998US5751552 Semiconductor device balancing thermal expansion coefficient mismatch
05/12/1998US5751261 Control system for display panels
05/12/1998US5751088 Alternator for vehicle
05/12/1998US5751063 Multi-chip module
05/12/1998US5751058 Semiconductor device having parallel overlapping main current terminals
05/12/1998US5749698 Substrate transport apparatus and substrate transport path adjustment method
05/11/1998WO1998049728A1 Multichip module
05/07/1998WO1998019505A1 Solder bonded electronic module
05/07/1998WO1998019340A1 Large-area high-current module of a field-controlled interruptible power semiconductor switch
05/07/1998WO1998019339A1 Integrated electronic circuit
05/07/1998WO1998019337A1 Integrated circuits and methods for their fabrication
05/07/1998WO1998019218A1 Improved process for 3d chip stacking
05/07/1998DE19644009A1 Großflächiges Hochstrommodul eines feldgesteuerten, abschaltbaren Leistungs-Halbleiterschalters Large-area high power module of a field-controlled turn-off power semiconductor switch
05/06/1998EP0840379A2 Semiconductor device comprising at least an IGBT and a diode
05/06/1998EP0840369A1 Electronic component and method of production thereof
05/06/1998EP0840198A2 Method and apparatus for increasing computer memory capacity
05/06/1998EP0839403A1 Power semiconductor module
05/06/1998CN1180927A High performance, low cost multi-chip module package
05/05/1998US5748456 Power semiconductor module system
05/05/1998US5748452 Multi-electronic device package
05/05/1998US5748161 Integrated electro-optical package with independent menu bar
05/05/1998US5747993 Movement actuator/sensor systems
05/05/1998US5747982 Multi-chip modules with isolated coupling between modules
05/05/1998US5747876 Semiconductor device and semiconductor module
05/05/1998US5747875 Semiconductor power module with high speed operation and miniaturization
05/05/1998US5747874 Semiconductor device, base member for semiconductor device and semiconductor device unit
05/05/1998US5747835 Serial arrangement of photothyristors
05/05/1998US5747692 Sensor system for determining acceleration
05/05/1998US5747363 Interconnecting organic light emitting devices to a printed circuit board
04/1998
04/30/1998WO1998018303A1 A system and method for packaging integrated circuits
04/30/1998WO1998018160A1 L-connect routing of die surface pads to the die edge for stacking in a 3d array
04/29/1998EP0838866A2 A light-emitting diode white light source
04/29/1998EP0838855A2 Semiconductor module
04/28/1998US5744947 Movement actuator/sensor systems
04/28/1998US5744862 Reduced thickness semiconductor device with IC packages mounted in openings on substrate
04/28/1998US5744861 Power semiconductor module
04/28/1998US5744860 Power semiconductor module
04/28/1998US5744827 Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements
04/28/1998US5744752 Hermetic thin film metallized sealband for SCM and MCM-D modules
04/28/1998US5744379 Semiconductor device composed of plural semiconductor chips and coupling means which couple the semiconductor chips together
04/23/1998WO1998016990A1 Low resistance current transfer device for a circuit of a brushless exciter
04/23/1998WO1998016952A1 Electronic power module, and electronic power system comprising a plurality of same
04/23/1998DE19712065A1 Duplex unit using surface wave bandpass filter
04/23/1998CA2239252A1 Electronic power module, and electronic power system comprising a plurality of same
04/22/1998CN1179641A Rectifier for alternator, particularly for motor vehicles
04/21/1998US5742477 Multi-chip module
04/21/1998US5742097 Multilevel semiconductor integrated circuit device
04/21/1998US5742045 Apparatus using diode laser logic to form a configurable optical gate system
04/16/1998WO1998016006A1 Coplanar waveguide amplifier
04/16/1998WO1998015979A1 Ehf and microwave-frequency multilayered hybrid and integrated circuit
04/16/1998WO1998015977A1 Hybrid high-power microwave-frequency integrated circuit
04/16/1998DE19642488A1 Thin-layer circuit board for e.g. chip card
04/15/1998EP0836229A2 Method and structure for integration of passive components on flexible film layers
04/15/1998EP0836105A1 An optical transmission/reception module
04/15/1998EP0835498A2 Stackable data carrier capable of being operated by a data bus
04/15/1998EP0765534A4 High impact digital crash data recorder
04/15/1998CN1179028A Power source change-over device
04/14/1998US5739800 Integrated electro-optical package with LED display chip and substrate with drivers and central opening
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