Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/1998
07/14/1998US5780930 Method for direct attachment of an on-chip bypass capacitor in an integrated circuit
07/14/1998US5780926 Multichip package device having a lead frame with stacked patterned metallization layers and insulation layers
07/14/1998US5780925 Lead frame package for electronic devices
07/14/1998US5780776 Multilayer circuit board unit
07/14/1998US5780321 Forming indium-gallium-aluminum-phosphide epilayer
07/14/1998US5778529 Method of making a multichip module substrate
07/14/1998US5778526 Method for mounting a power-dissipating component
07/14/1998US5778522 Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief
07/09/1998WO1998029904A1 Bump-bonded semiconductor imaging device
07/08/1998CN1187035A Semiconductor chip package and method for fabricating the same
07/08/1998CN1039073C Semiconductor switch stack
07/07/1998US5777849 Power semiconductor module having elongate plug contacts
07/07/1998US5777407 Alternator for vehicle
07/07/1998US5777381 Semiconductor devices method of connecting semiconductor devices and semiconductor device connectors
07/07/1998US5777377 Bus bar having reduced parasitic inductances and equal current path lengths
07/07/1998US5777345 Multi-chip integrated circuit package
07/07/1998US5776797 Three-dimensional flexible assembly of integrated circuits
07/02/1998WO1998028320A2 Affinity based self-assembly systems and devices for photonic and electronic applications
07/02/1998DE19747105A1 Component with stacked semiconductor chips
07/02/1998DE19743766A1 Semiconductor chip housing
07/01/1998EP0850799A2 Indication unit with transparent indicating element
07/01/1998CN1186338A Stacking type semiconductor chip package
06/1998
06/30/1998US5774353 Fixture for motor controller power substrate and motor controller incorporating
06/30/1998US5774342 Electronic circuit with integrated terminal pins
06/30/1998US5773896 Semiconductor device having offsetchips
06/30/1998US5773883 Semiconductor device and semiconductor module
06/30/1998US5773780 Method of severing bond wires and forming balls at their ends
06/30/1998US5773321 Semiconductor integrated circuit devices having particular terminal geometry and mounting method
06/30/1998US5773320 Method for producing a power semiconductor module
06/30/1998US5772451 Sockets for electronic components and methods of connecting to electronic components
06/25/1998WO1998027588A1 A via structure
06/25/1998WO1998027587A1 A packaging structure for integrated circuits
06/25/1998DE19755675A1 Semiconductor housing with structure containing conductor parts for integrated circuit mfr.
06/25/1998CA2275523A1 Flip-chip type connection with elastic contacts
06/25/1998CA2275506A1 A packaging structure for integrated circuits
06/25/1998CA2275435A1 A via structure
06/24/1998EP0849800A1 Multichip module with differently packaged integrated circuits and method of manufacturing it
06/24/1998EP0849799A1 Bispectral photoconductive detector
06/24/1998EP0849798A1 Photoconductive detector
06/24/1998EP0849738A2 Improvements in or relating to electronic systems
06/24/1998EP0792519A4 Interconnection elements for microelectronic components
06/24/1998EP0792517A4 Electrical contact structures from flexible wire
06/24/1998EP0792463A4 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
06/24/1998EP0729652A4 Contact structure for interconnections, interposer, semiconductor assembly and method
06/24/1998EP0705529A4 Method and apparatus for non-conductively interconnecting integrated circuits
06/24/1998CN1185656A Semi-conductor package structure and mfg. method thereof
06/23/1998US5770973 Semiconductor device for amplifying audio signals
06/23/1998US5770888 Integrated chip package with reduced dimensions and leads exposed from the top and bottom of the package
06/23/1998US5770884 Semiconductor substrate
06/23/1998US5770816 Planar, hermetic metal matrix housing
06/23/1998US5770478 Integral mesh flat plate cooling method
06/23/1998US5770477 Flip chip-on-flip chip multi-chip module
06/23/1998US5770300 Multilayered metallic printed board and molded module
06/23/1998US5769987 Post-firing method for integrating passive devices into ceramic electronic packages
06/23/1998US5769389 Apparatus for controlling a flow of a fluid
06/18/1998WO1998026453A1 Chip module and manufacture of same
06/18/1998WO1998026452A1 High density integrated circuits and the method of packaging the same
06/18/1998WO1998025749A1 Injection molding encapsulation for an electronic device directly onto a substrate
06/18/1998DE19752408A1 Power semiconductor module with cast resin housing
06/18/1998DE19702121C1 Vertical chip interconnection production
06/18/1998DE19651632A1 Power semiconductor module with pressure contacted power semiconductor element for current rectifiers
06/18/1998DE19651566A1 Chip-Modul sowie Verfahren zu dessen Herstellung -Chip module and method of producing the
06/17/1998EP0848433A2 High efficiency multi-junction solar cells
06/17/1998EP0847597A1 Process for forming a spatial chip arrangement, and said spatial arrangement
06/17/1998CN1185232A Semiconductor assembly
06/17/1998CN1185042A Light-emitting diode white light source
06/16/1998US5767824 Optical display apparatus
06/16/1998US5767579 Semiconductor device having an electrical connection between a control electrode and a resistive layer
06/16/1998US5767576 Snap lines localize cracks and cleavages formed by bending stress to the snap line
06/16/1998US5767573 Semiconductor device
06/16/1998US5767572 Semiconductor integrated circuit device assembly
06/16/1998US5767009 Structure of chip on chip mounting preventing from crosstalk noise
06/16/1998US5767001 Process for producing semiconductor components between which contact is made vertically
06/16/1998US5766975 Packaged integrated circuit having thermal enhancement and reduced footprint size
06/11/1998WO1998025306A1 High-power microwave-frequency hybrid integrated circuit
06/11/1998WO1998025305A1 Method for manufacturing semiconductor device
06/11/1998WO1998025304A1 Semiconductor device
06/11/1998WO1998025090A1 Spherical shaped semiconductor integrated circuit
06/10/1998EP0847088A2 Semiconductor device, method for manufacturing the same, and method for mounting the same
06/10/1998EP0847086A2 Improvements in or relating to semiconductor devices
06/10/1998DE19721967A1 Memory component with base platelet and several types of applied unit platelets
06/10/1998CN1184333A Memory device module
06/10/1998CN1184332A Semiconductor device, method for manufacturing the same, and method for mounting the same
06/09/1998US5763949 Surface-mount semiconductor package
06/09/1998US5763946 Semiconductor device with bent electrode terminal
06/09/1998US5763943 Electronic modules with integral sensor arrays
06/09/1998US5763939 Semiconductor device having a perforated base film sheet
06/09/1998US5763901 Semiconductor light-emitting device and method for manufacturing the device
06/09/1998US5761811 Assembling method for cooling apparatus
06/04/1998WO1998024231A1 Opsistor image processor
06/04/1998WO1998024196A1 Opsistor transmitter data compression circuit
06/04/1998WO1998024128A1 Semiconductor device
06/04/1998CA2272700A1 Opsistor transmitter data compression circuit
06/04/1998CA2272686A1 Opsistor image processor
06/04/1998CA2223548A1 Bispectral electromagnetic wave detector
06/04/1998CA2223539A1 Electromagnetic wave detector
06/03/1998EP0845809A2 Semiconductor power module
06/02/1998US5761054 Integrated circuit assembly preventing intrusions into electronic circuitry
06/02/1998US5761044 Semiconductor module for microprocessor
06/02/1998US5761040 Semiconductor device
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