Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
04/2014
04/30/2014EP2724369A1 Power semiconductor housing with contact mechanism
04/30/2014DE112012003318T5 Dünnfilm-Struktur für hochdichte Induktivitäten und Umverdrahtung bei Wafer-Level Packaging Thin film structure for high density inductors and rewiring at wafer level packaging
04/30/2014DE102013111772A1 Halbleiterbauelemente und Verfahren zur Herstellung von Halbleiterbauelementen Semiconductor devices and methods of manufacturing of semiconductor devices
04/30/2014DE102013104950B3 Leistungshalbleitermodul und Anordnung hiermit Power semiconductor module and assembly hereby
04/30/2014DE102013000911A1 Formgehäuse für lichtemittierende Vorrichtung und lichtemittierende Vorrichtung, die dieses verwendet Case shape light emitting device and light emitting device using this
04/30/2014DE102012219879A1 Verfahren zum Herstellen eines LED-Moduls mit Kühlkörper A method for manufacturing an LED module with heat sink
04/30/2014DE102012021238A1 Dichter Steckverbinder und LED-Leuchtmodul ausgestattet mit einem gedichteten Steckverbinder Proof connector and LED light module equipped with a sealed connector
04/30/2014CN203573986U Full-color LED lamp integrated with IC packaging, and lamp string made of full-color LED lamp
04/30/2014CN203573985U Alternating-current integrated built-in IC-package LED drive circuit module group
04/30/2014CN203573984U Empty encapsulation LED digital tube
04/30/2014CN203573983U Cob led module
04/30/2014CN203573982U High-brightness COB LED module
04/30/2014CN203573981U Cob led module
04/30/2014CN203573980U LED surface light source
04/30/2014CN203573979U Igbt module
04/30/2014CN203573967U Chip overlapping and packaging structure
04/30/2014CN103765751A Power conversion device
04/30/2014CN103765579A Method of making system-in-package device, and system-in-package device
04/30/2014CN103765577A Power module
04/30/2014CN103765496A Topology of distributing and connecting LEDs in a large area matrix
04/30/2014CN103762214A Integrated circuit module applied to switching type adjuster
04/30/2014CN103762213A Integrated circuit module applied to switch-type regulator
04/30/2014CN103762212A Integrated circuit module applied to switch-type regulator
04/30/2014CN103762211A Flexible circuit substrate double-sided light-emitting LED array light source
04/30/2014CN103762210A Circuit substrate-free LED array light source
04/30/2014CN103762209A Color temperature and color rendering-adjustable light emitting diode
04/30/2014CN103762187A Chip packaging method and structure
04/30/2014CN102437147B Dense-pitch small-pad copper-line bonded intelligent card (IC) chip stacking packing piece and preparation method thereof
04/30/2014CN102339818B Power module and manufacture method thereof
04/30/2014CN102280441B Semiconductor device
04/30/2014CN102257644B Method for producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component
04/30/2014CN102244066B Power semiconductor module
04/30/2014CN102157504B Light emitting diode package and light unit having the same
04/30/2014CN102157187B Method and device for memory resource management in chip
04/30/2014CN102104012B Manufacturing method of light-emitting diode
04/29/2014US8711650 Semiconductor device including multi-chip
04/29/2014US8710676 Stacked structure and stacked method for three-dimensional chip
04/29/2014US8710522 Organic light emitting diode light source device
04/29/2014US8709880 Method for fabrication of a semiconductor device and structure
04/24/2014WO2014061984A1 Display portion included in mobile terminal capable of receiving wireless power and method for manufacturing wireless power receiving portion
04/24/2014WO2014061643A1 Method for manufacturing semiconductor device, and semiconductor device
04/24/2014WO2014061426A1 Semiconductor device
04/24/2014WO2014061211A1 Semiconductor device
04/24/2014WO2014061178A1 Cooling structure and heat generating body
04/24/2014WO2014060921A1 Led package with capacitive couplings
04/24/2014WO2014060318A1 Radiation-emitting component
04/24/2014US20140111894 Diode lighting arrangement
04/24/2014US20140111273 Inductor with conductive trace
04/24/2014US20140110864 Chip arrangement and a method for forming a chip arrangement
04/24/2014US20140110863 Power Converter Package Including Vertically Stacked Driver IC
04/24/2014US20140110860 Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate
04/24/2014US20140110832 Co-support circuit panel and microelectronic packages
04/24/2014US20140110811 Semiconductor device, imaging device, method of inspecting semiconductor substrate, and method of fabricating semiconductor device
04/24/2014US20140110728 Submount with cavities and through vias for led packaging
04/24/2014US20140110564 Optical navigation device
04/24/2014US20140109949 Method for quickly stabilizing the nominal output of a thin-film solar module
04/24/2014DE112012000369T5 Schaltvorrichtung mit Freilaufdiode Switching device with freewheeling diode
04/24/2014DE102013111569A1 Semiconductor package of semiconductor system, has chip that is provided with several contact pads on first major surface, and substrate that is located in first Vias tab that is provided with first antenna structure
04/24/2014DE102013110404A1 Chipanordnungen, ein Chip Package und ein Verfahren zum Herstellen einer Chipanordnung Chip arrays, a chip package and a method for producing a chip arrangement
04/24/2014DE102013104949B3 Leistungselektronische Schalteinrichtung und Anordnung hiermit Power electronic switching device and assembly hereby
04/24/2014DE102012219465A1 Verfahren zum Herstellen einer Kappe für ein MEMS-Bauelement und hybrid integriertes Bauteil mit einer solchen Kappe A method of manufacturing a cap for a MEMS device and hybrid integrated component with such a cap
04/24/2014DE102012219461A1 Träger für leuchtvorrichtung mit begrenzungsstruktur für auflagefläche Carrier for light device with limiting structure for surface contact area
04/24/2014DE102012219460A1 Leuchtdiodenmodul Light emitting diode module
04/24/2014DE102012219364A1 Connectable module for connecting modular components with LEDs to LED TV, has pads arranged at substrate surface such that sequence of pads is reversed with respect to each other from surface edges in clockwise direction around edges
04/24/2014DE102012110136A1 LED tape for LED lamp, has mark horizontally formed by mark edge running at side walls, where upper wall section of side walls is aligned in vertical manner and adjacent above mark edge or protrudes as mark edge in inner space
04/24/2014DE102012110021A1 Multifunktions-Mikroelektronikbauteil und Herstellungsverfahren dafür Multifunction microelectronics component and production method thereof
04/24/2014DE102012019670A1 LED light part i.e. energy-efficient/energy-saving lamp, has LED chips including color temperatures from color temperature spectrum of specific Kelvin combined with LED chips with low color temperature and LED chips with high red/blue parts
04/24/2014DE102009014582B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
04/23/2014EP2722886A1 Power converter package including vertically stacked driver IC
04/23/2014EP2722885A1 Surface mountable power components
04/23/2014EP2722884A1 Semiconductor package with conductive carrier integrated heat spreader
04/23/2014EP2722883A1 Semiconductor package including conductive carrier coupled power switches
04/23/2014EP2722879A1 Semiconductor unit and semiconductor device using same
04/23/2014EP2722877A1 Cooling structure for semiconductor element
04/23/2014EP2721638A1 Stress-aware design for integrated circuits
04/23/2014CN203562425U Power module
04/23/2014CN203562424U System-level LED encapsulation device
04/23/2014CN203562423U LED integrated packaging structure
04/23/2014CN103748683A Method for manufacturing semiconductor device, block stacked body, and sequential stacked body
04/23/2014CN103748682A Laminated module and interposer used in same
04/23/2014CN103748681A A system and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3d chip stacks
04/23/2014CN103748677A Power converting apparatus
04/23/2014CN103748676A Mounting structure of laminated module using interposer
04/23/2014CN103748675A Laminated module and interposer used in same
04/23/2014CN103746059A Mixed-color dual-flashing LED (Light-Emitting Diode) lamp
04/23/2014CN103745975A Thyristor press-fitting structure in modular multilevel converter power module
04/23/2014CN102349168B Led module with improved light output
04/23/2014CN102112807B Color tunable light source
04/23/2014CN101809740B Structure with electronic component mounted therein and method for manufacturing such structure
04/23/2014CN101404314B Light emitting device and method for manufacturing the same
04/22/2014US8704259 Optical illumination device
04/22/2014DE202013008610U1 LED-Beleuchtungseinrichtungen LED Lighting Units
04/17/2014WO2014059169A1 Clock network fishbone architecture for a structured asic manufactured on a 28 nm cmos process lithographic node
04/17/2014WO2014059166A1 Architectural floorplan for a structured asic
04/17/2014WO2014059161A1 Via-configurable high-performance logic block involving transistor chains
04/17/2014WO2014058836A1 Stacked multi-chip integrated circuit package
04/17/2014WO2014057902A1 Semiconductor device, ceramic circuit board, and semiconductor device manufacturing method
04/17/2014WO2014057622A1 Power converter
04/17/2014WO2014056977A1 Printed circuit board for populating with illumination bodies, comprising a variable working window
04/17/2014WO2014056911A1 Optoelectronic component with integrated protection diode and method for producing same
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