Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
09/1998
09/09/1998EP0637080B1 Pressure contact type semiconductor device
09/08/1998US5805865 Semiconductor device
09/08/1998US5805424 Microelectronic assemblies including Z-axis conductive films
09/08/1998US5804874 Stacked chip package device employing a plurality of lead on chip type semiconductor chips
09/08/1998US5804872 Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof
09/08/1998US5804464 Semiconductor chip kerf clear method for forming semiconductor chips and electronic module therefore
09/08/1998US5804004 Stacked devices for multichip modules
09/08/1998US5803579 Illuminator assembly incorporating light emitting diodes
09/03/1998WO1998038740A1 Fpga having logic element carry chains capable of generating wide xor functions
09/03/1998WO1998038680A1 Memory module
09/03/1998WO1998038678A1 Semiconductor module
09/02/1998EP0862225A2 Transparent light beam detectors
09/02/1998EP0862217A2 Semiconductor device and semiconductor multi-chip module
09/02/1998EP0862134A2 Chip card and fabrication method
09/02/1998EP0861504A1 A dual-band multi-level microbridge detector
09/01/1998US5801936 Semiconductor module for a power conversion device
09/01/1998US5801452 Multi chip module including semiconductor wafer or dice, interconnect substrate, and alignment member
09/01/1998US5801448 Conductive lines on the back side of wafers and dice for semiconductor interconnects
09/01/1998US5801446 Microelectronic connections with solid core joining units
09/01/1998US5801439 Semiconductor device and semiconductor device unit for a stack arrangement
09/01/1998US5801438 Semiconductor device mounting and multi-chip module
09/01/1998US5801437 Three-dimensional warp-resistant integrated circuit module method and apparatus
09/01/1998US5801432 Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes
08/1998
08/27/1998DE19707514A1 Halbleitermodul Semiconductor module
08/26/1998EP0860024A2 Circuit structure having a flip-mounted matrix of devices
08/26/1998EP0859686A1 Fabricating interconnects and tips using sacrificial substrates
08/26/1998CN1191500A Ribbon-like core interconnection elements
08/26/1998CN1191388A Automated stacking and soldering apparatus for three dimensional stack package devices and manufacturing method thereof
08/25/1998US5798565 For integrating diced integrated circuits
08/25/1998US5798564 Multiple chip module apparatus having dual sided substrate
08/25/1998US5798558 Monolithic x-ray image detector and method of manufacturing
08/25/1998US5798286 Connecting multiple microelectronic elements with lead deformation
08/25/1998US5798282 Semiconductor stack structures and fabrication sparing methods utilizing programmable spare circuit
08/20/1998WO1998036461A1 Optoelectronic semiconductor diodes and devices comprising same
08/20/1998WO1998036455A1 A diode array
08/20/1998DE19732028A1 Apparatus for production of three-dimensional stacked electronic components
08/20/1998DE19716674A1 Semiconductor component with two or more chips for multiple switch
08/19/1998EP0859414A1 Semiconductor power device
08/19/1998EP0858578A1 Liquid cooled heat sink for cooling electronic components
08/19/1998EP0801815A4 Electrical circuit suspension system
08/19/1998CN1191019A Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
08/18/1998US5796746 Device and method for testing integrated circuit dice in an integrated circuit module
08/18/1998US5796196 Adaptable rotating rectifier and suppression resistor assembly for two-pole, wound rotor of dynamoelectric machine
08/18/1998US5796164 Packaging and interconnect system for integrated circuits
08/18/1998US5795799 Method for manufacturing electronic apparatus sealed by concave molded resin enveloper
08/18/1998US5794607 Process for producing heat sink having good heat dissipating characteristics
08/12/1998EP0858108A1 Monoblock structure consisting of stacked components
08/12/1998CN1190261A Freely integrating holder for power semiconductor
08/11/1998US5793116 Microelectronic packaging using arched solder columns
08/11/1998US5793115 Three dimensional processor using transferred thin film circuits
08/11/1998US5793108 Semiconductor integrated circuit having a plurality of semiconductor chips
08/11/1998US5793106 Semiconductor device
08/11/1998US5793103 Insulated cube with exposed wire lead
08/11/1998US5793101 Package housing multiple semiconductor dies
08/11/1998US5793099 Semiconductor device
08/11/1998US5793098 Package including conductive layers having notches formed
08/11/1998US5793067 Semiconductor device
08/11/1998US5792984 Molded aluminum nitride packages
08/11/1998US5792676 Method of fabricating power semiconductor device and lead frame
08/10/1998CA2226419A1 Monoblock structure of stacked components
08/05/1998EP0698288B1 Process for producing vertically connected semiconductor components
08/05/1998CN1189931A Power semiconductor module
08/04/1998US5790384 Bare die multiple dies for direct attach
08/04/1998US5790380 Method for fabricating a multiple chip module using orthogonal reorientation of connection planes
08/04/1998US5790255 Position sensitive detector
08/04/1998US5789817 Electrical apparatus with a metallic layer coupled to a lower region of a substrate and a metallic layer coupled to a lower region of a semiconductor device
08/04/1998US5789816 Multiple-chip integrated circuit package including a dummy chip
08/04/1998US5789815 Three dimensional semiconductor package having flexible appendages
08/04/1998US5789805 Semiconductor multi-chip module
08/04/1998US5789276 Optical FET
07/1998
07/30/1998WO1998033217A1 Semiconductor device and method for manufacturing thereof
07/30/1998WO1998033216A1 Method for producing vertical chip connections
07/30/1998WO1998032493A1 Compact flexible circuit configuration
07/30/1998DE19733045C1 Electric heating for vehicle
07/29/1998EP0855741A1 Component arrangement having magnetic field controlled transistor
07/29/1998EP0855090A1 Multichip module
07/28/1998US5787462 Configuration management system
07/28/1998US5786985 Semiconductor device and semiconductor device unit
07/28/1998US5786979 High density inter-chip connections by electromagnetic coupling
07/28/1998US5786973 Semiconductor power module and compound power module
07/28/1998US5786636 Semiconductor device and method of fabricating same
07/28/1998US5786632 Semiconductor package
07/28/1998US5786629 3-D packaging using massive fillo-leaf technology
07/28/1998US5786628 Method and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packaging
07/28/1998US5786237 Method for forming a monolithic electronic module by stacking planar arrays of integrated circuit chips
07/23/1998WO1998032213A2 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same
07/23/1998WO1998032180A1 Method for producing a radiation detector by assembling elementary blocks and resulting detector
07/23/1998WO1998032098A1 Chip card module
07/22/1998EP0853816A1 Connecting multiple microelectronic elements with lead deformation
07/22/1998CN1188451A Semiconductor device
07/21/1998US5784264 MCM (Multi Chip Module) carrier with external connection teminals BGA (Ball Grid Array) type matrix array form
07/21/1998US5783870 Method for connecting packages of a stacked ball grid array structure
07/21/1998US5783856 Method for fabricating self-assembling microstructures
07/16/1998DE19700963A1 Verfahren zur Herstellung eines Leistungsmoduls mit einer aktive Halbleiterbauelemente und passive Halbleiterbauelemente aufweisenden Schaltungsanordnung Method for producing a power module having a semiconductor active devices and passive semiconductor devices having circuitry
07/15/1998EP0853340A2 Semiconductor package
07/15/1998EP0853337A1 Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
07/14/1998US5781791 Digital microelectronic circuit package using buffer dies and programmable device or memory dies
07/14/1998US5781415 Semiconductor package and mounting method
07/14/1998US5781413 Method and apparatus for directing the input/output connection of integrated circuit chip cube configurations
07/14/1998US5781031 Programmable logic array
1 ... 359 360 361 362 363 364 365 366 367 368 369 370 371 372 373 374 375 376 377 378 379 ... 409