Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/1998
11/04/1998CN1198016A Circuit and method for providing interconnections among individual integrated circuit chips in multi-chip module
11/03/1998US5831699 Display with inactive portions and active portions, and having drivers in the inactive portions
11/03/1998US5831331 Self-shielding inductor for multi-layer semiconductor integrated circuits
11/03/1998US5829516 Liquid cooled heat sink for cooling electronic components
11/03/1998US5829128 Method of mounting resilient contact structures to semiconductor devices
11/03/1998US5829125 Wireless bonding method
10/1998
10/28/1998EP0645816B1 Semiconductor device comprising a plurality of semiconductor elements
10/28/1998CN1197544A Connecting multiple microelectronic elements with lead deformation
10/27/1998US5828564 Rectifier heat dissipation
10/27/1998US5828172 Diode mount for an led with a plug connector and compensating resistor, and a method of its manufacture
10/27/1998US5828125 Ultra-high density warp-resistant memory module
10/27/1998US5828093 Ceramic capacitor and semiconductor device in which the ceramic capacitor is mounted
10/21/1998EP0872890A1 High frequency module
10/21/1998EP0774165B1 Method of manufacturing a three-dimensional circuit
10/20/1998US5825627 Multistage-coupled modules having electronic parts
10/20/1998US5825092 Integrated circuit with an air bridge having a lid
10/20/1998US5825090 High power semiconductor device and method of making same
10/20/1998US5825087 Integral mesh flat plate cooling module
10/20/1998US5825085 Power semiconductor device, armoring case thereof and method for manufacturing the same
10/20/1998US5825082 Semiconductor device in which a first resin-encapsulated package is mounted on a second resin-encapsulated package
10/20/1998US5825080 Semiconductor device provided with surface grounding conductor for covering surfaces of electrically insulating films
10/20/1998US5824964 Circuit board for a semiconductor device and method of making the same
10/20/1998US5824571 Multi-layered contacting for securing integrated circuits
10/20/1998US5824186 Method and apparatus for fabricating self-assembling microstructures
10/15/1998WO1998045947A1 Configurable logic element for fpga
10/15/1998WO1998045130A1 Three dimensional structure memory
10/14/1998EP0871352A1 Integrated circuit device cooling structure
10/14/1998EP0871222A2 Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module
10/14/1998EP0870627A1 Semiconductor device
10/14/1998EP0870336A1 Surface mount led alphanumeric display
10/14/1998EP0870294A2 True color flat panel display using an led dot matrix and led dot matrix drive method and apparatus
10/14/1998EP0734586A4 Method for fabricating self-assembling microstructures
10/14/1998EP0712534B1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits
10/13/1998US5821763 For probing an electronic device
10/13/1998US5821762 Semiconductor device, production method therefor, method for testing semiconductor elements, test substrate for the method and method for producing the test substrate
10/13/1998US5821674 For an alternator
10/13/1998US5821625 Structure of chip on chip mounting preventing from crosstalk noise
10/13/1998US5821618 Semiconductor component with insulating housing
10/13/1998US5821614 Card type semiconductor device
10/13/1998US5821606 Semiconductor device
10/13/1998US5819402 Method for cooling of chips using blind holes with customized depth
10/08/1998WO1998044559A1 Memory module
10/08/1998WO1998044557A1 High-voltage, high-current multilayer circuit board, method for the production thereof
10/08/1998DE19714054A1 Silicon-germanium photodetector
10/07/1998EP0729644A4 Multi-chip electronic package module utilizing an adhesive sheet
10/06/1998US5818984 Optoelectronic interconnection of integrated circuits
10/06/1998US5818748 Chip function separation onto separate stacked chips
10/06/1998US5818404 Integrated electro-optical package
10/06/1998US5818112 Arrangement for capacitive signal transmission between the chip layers of a vertically integrated circuit
10/06/1998US5818108 High-density, highly reliable integrated circuit assembly
10/06/1998US5818107 Chip stacking by edge metallization
10/06/1998US5818102 System having integrated circuit package with lead frame having internal power and ground busses
10/06/1998US5817986 Three dimensional package and architecture for high performance computer
10/06/1998US5817543 Method of constructing an integrated circuit memory
10/06/1998US5817535 LOC SIMM and method of fabrication
10/06/1998US5817530 Use of conductive lines on the back side of wafers and dice for semiconductor interconnects
10/01/1998WO1998043354A1 Fpga repeatable interconnect structure
10/01/1998WO1998043304A1 Photovoltaic element and method for manufacture thereof
10/01/1998WO1998043301A1 Flat semiconductor device and power converter employing the same
10/01/1998DE19742360A1 Stackable side-insulated semiconductor chip
10/01/1998DE19741585C1 Production of light emitting diode LED matrix
10/01/1998DE19712749A1 PCB for high current or high voltage applications
09/1998
09/30/1998EP0868013A1 A voltage source converter (VSC) with low self inductance
09/30/1998EP0867942A2 Liquid crystal display apparatus
09/30/1998EP0649565B1 Fitting unit for multilayer hybrid circuit with power components
09/30/1998CN1194462A Semiconductor device and its producing method
09/30/1998CN1194460A Packaging for stacked semiconductor chip and its producing method
09/29/1998US5815427 Modular memory circuit and method for forming same
09/29/1998US5815372 Electrical arrangement
09/29/1998US5814884 Commonly housed diverse semiconductor die
09/29/1998US5814880 Thick film copper metallization for microwave power transistor packages
09/29/1998US5814878 Semiconductor device
09/29/1998US5814871 Optical semiconductor assembly having a conductive float pad
09/24/1998WO1998042032A1 Light-emitting diode apparatus
09/23/1998CN1194058A Electronic component and method of production thereof
09/23/1998CN1193886A Mounted base board
09/22/1998US5812388 Bridge rectifier for diode-rectified alternating current generator
09/22/1998US5812380 Mesh planes for multilayer module
09/22/1998US5812105 Circuit for driving a light emitting diode display
09/22/1998US5811879 Stacked leads-over-chip multi-chip module
09/22/1998US5811878 High-power semiconductor module
09/22/1998US5811877 Semiconductor device structure
09/22/1998US5811815 Dual-band multi-level microbridge detector
09/22/1998US5811351 Semiconductor device and method of manufacturing the same
09/22/1998CA2135027C Semiconductor stack
09/22/1998CA2114563C Integrated semiconductor devices and method for manufacture thereof
09/17/1998WO1998040915A1 Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board
09/16/1998EP0864432A2 Light-emitting device and recording device using the same
09/16/1998EP0758487A4 Tape application platform and processes therefor
09/15/1998US5808897 Integrated circuit device having interchangeable terminal connection
09/15/1998US5808878 Circuit substrate shielding device
09/15/1998US5808877 Multichip package having exposed common pads
09/15/1998US5808868 Electronic module with power components
09/15/1998US5808592 Integrated light-emitting diode lamp and method of producing the same
09/15/1998US5808325 Optical transmitter package assembly including lead frame having exposed flange with key
09/15/1998US5807791 Methods for fabricating multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes
09/15/1998US5807768 Method for fabricating a heat sink-integrated semiconductor package
09/10/1998DE19735074A1 Power module
09/09/1998EP0862788A2 Vertically integrated semiconductor component and method of producing the same
09/09/1998EP0832438A4 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
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