Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
01/1999
01/12/1999US5857858 Electrical interconnection
01/07/1999WO1999000845A1 Electronic control apparatus
01/07/1999EP0889526A2 Powersemiconductor module with enclosed submodules
01/07/1999EP0888637A1 Semiconductor integrated circuit with inductor
01/07/1999EP0839403B1 Power semiconductor module
01/07/1999DE19728692A1 IC-Baustein IC module
01/07/1999DE19727548A1 Elektronisches Steuergerät Electronic control unit
01/06/1999CN1041579C Method and apparatus for stress relieved electronic module
01/05/1999US5856913 Multilayer semiconductor device having high packing density
01/05/1999US5856662 Information carrier and process for producing same
12/1998
12/30/1998EP0887861A1 Semiconductor device having separated exchange means
12/30/1998EP0886894A2 Contact carriers (tiles) for populating larger substrates with spring contacts
12/30/1998CN1203455A 半导体装置 Semiconductor device
12/30/1998CN1203454A 多芯片模块 A multi-chip module
12/30/1998CN1041479C Component module
12/29/1998US5854740 Electronic circuit board with semiconductor chip mounted thereon, and manufacturing method therefor
12/29/1998US5854534 For coupling an integrated circuit chip to a multichip module substrate
12/29/1998US5854507 Multiple chip assembly
12/29/1998US5854085 Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
12/29/1998US5853497 High efficiency multi-junction solar cells
12/29/1998US5852871 Method of making raised contacts on electronic components
12/23/1998EP0886368A2 Power semiconductor switching device
12/23/1998EP0886315A1 Electronic power module and electronic power device employing the same
12/23/1998EP0885483A1 Push-pull power amplifier
12/23/1998EP0885459A1 Electronic power module, and electronic power system comprising a plurality of same
12/23/1998EP0885457A2 Method for making a circuit structure having a flip-mounted matrix of devices
12/23/1998CN1202735A Power semiconductor switch device
12/22/1998US5852326 Face-up semiconductor chip assembly
12/22/1998US5851894 Method of vertically integrating microelectronic systems
12/22/1998US5851063 General illumination system
12/17/1998DE19740542C1 Damping device for active power diode
12/16/1998EP0884786A2 Multiple display apparatus
12/16/1998EP0884782A1 Integrated electro-optical package and method of fabrication
12/16/1998EP0884781A2 Power semiconductor module
12/16/1998CN1041254C Three dimension semiconductor device
12/15/1998US5848467 Methods of making semiconductor chip assemblies
12/10/1998DE19735071A1 Power module
12/09/1998EP0883191A2 Electroluminescence device, electroluminescence apparatus, and production methods thereof
12/09/1998CN1201257A Semiconductor package body and semiconductor module using same
12/08/1998US5848083 Expansion-matched high-thermal-conductivity stress-relieved mounting modules
12/08/1998US5847985 Memory modules
12/08/1998US5847951 Method and apparatus for voltage regulation within an integrated circuit package
12/08/1998US5847935 Electronic circuit chip package
12/08/1998US5847930 Edge terminals for electronic circuit modules
12/08/1998US5847453 Microwave circuit package
12/08/1998US5847448 Method and device for interconnecting integrated circuits in three dimensions
12/08/1998US5846879 Contact structure for vertical chip connections
12/03/1998WO1998054760A1 Method for manufacturing electric modules, and the electric module
12/03/1998DE19801493A1 Semiconductor component housing with numerous electrodes
12/03/1998DE19722355A1 Verfahren zur Herstellung elektrischer Baugruppen und elektrische Baugruppe Method for manufacturing electrical components and electrical assembly
12/02/1998EP0881680A2 Semiconductor device
12/02/1998EP0881679A2 Semiconductor module including a plurality of semiconductor devices detachably
12/02/1998EP0881676A2 Flip chip packaging of memory chips
12/02/1998EP0881674A2 High power semiconductor module device
12/02/1998CN1041035C Multi-chip module
12/01/1998US5843807 Method of manufacturing an ultra-high density warp-resistant memory module
11/1998
11/26/1998WO1998053651A1 A system and method for packaging integrated circuits
11/26/1998WO1998053493A1 A system and method for packaging integrated circuits
11/26/1998WO1998028320A3 Affinity based self-assembly systems and devices for photonic and electronic applications
11/26/1998DE19720695A1 DC/AC converter
11/26/1998CA2295541A1 A system and method for packaging integrated circuits
11/26/1998CA2290396A1 A system and method for packaging integrated circuits
11/24/1998US5841193 Single chip modules, repairable multichip modules, and methods of fabrication thereof
11/24/1998US5841189 Semiconductor device and manufacturing method thereof
11/24/1998US5841177 Multicolor light emitting device
11/24/1998US5841128 Optical sensor for reading a pattern
11/24/1998US5840593 Membrane dielectric isolation IC fabrication
11/19/1998WO1998052221A1 Power semiconductor module with ceramic substrate
11/18/1998EP0878026A1 Led matrix
11/18/1998EP0878025A1 Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
11/18/1998EP0811245A4 Microelectronic assemblies including z-axis conductive films
11/18/1998CN1199274A Converter modules having busbar system for power semiconductor switches
11/17/1998US5838546 Mounting structure for a semiconductor circuit
11/17/1998US5838545 High performance, low cost multi-chip modle package
11/17/1998US5838544 Heat dissipating structure for rectifiers of car alternators
11/17/1998US5838061 Semiconductor package including a semiconductor chip adhesively bonded thereto
11/17/1998US5838060 Stacked assemblies of semiconductor packages containing programmable interconnect
11/17/1998US5838024 Image forming system
11/17/1998US5837995 Wavelength-controllable voltage-phase photodiode optoelectronic switch ("opsistor")
11/17/1998US5837566 Vertical interconnect process for silicon segments
11/17/1998US5836676 Light emitting display apparatus
11/12/1998WO1998051001A1 Bridge rectifier configuration and mounting for supplying exciter current in an ac generator
11/12/1998WO1998050954A1 Stacked semiconductor devices, particularly memory chips
11/12/1998DE19719703A1 Leistungshalbleitermodul mit Keramiksubstrat Power semiconductor module with a ceramic substrate
11/11/1998EP0877472A2 Rectifier modules with a bus bar system for power semiconductor switches
11/11/1998EP0859686A4 Fabricating interconnects and tips using sacrificial substrates
11/11/1998CN1198839A Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
11/11/1998CN1198594A 多芯片模块 A multi-chip module
11/11/1998CN1198593A 多芯片模块 A multi-chip module
11/10/1998US5835988 Packed semiconductor device with wrap around external leads
11/10/1998US5835357 Ceramic integrated circuit package with optional IC removably mounted thereto
11/10/1998US5835352 Power amplifying module
11/10/1998US5834843 Multi-chip semiconductor chip module
11/10/1998US5834836 Multi-layer bottom lead package
11/10/1998US5834334 Method of forming a multi-chip module from a membrane circuit
11/10/1998US5834162 Process for 3D chip stacking
11/10/1998US5833903 Injection molding encapsulation for an electronic device directly onto a substrate
11/10/1998US5832601 Method of making temporary connections between electronic components
11/10/1998US5832599 Method of interfacing detector array layers
11/04/1998CN2296580Y 半导体节能灯 Semiconductor energy-saving lamps
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