| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/11/1999 | WO1999012205A1 Multicolor-color sensor |
| 03/11/1999 | DE19739684A1 Wafer stacking to form chip stacks |
| 03/10/1999 | EP0901167A1 Base for power diode of vehicle alternator |
| 03/10/1999 | EP0901166A1 Power semiconductor device module with submodules having integrated coolers |
| 03/09/1999 | US5880403 Using combination of high z, low z materials |
| 03/09/1999 | US5880010 Ultrathin electronics |
| 03/09/1999 | US5878486 Method of burning-in semiconductor devices |
| 03/04/1999 | WO1999010925A1 Vertical interconnect process for silicon segments with thermally conductive epoxy preform |
| 03/03/1999 | EP0717443B1 Integrated circuit device |
| 03/03/1999 | CN2309619Y Plastic silicon photoelectric diode |
| 03/02/1999 | US5877550 Hybrid module and method of manufacturing the same |
| 03/02/1999 | US5877533 Hybrid integrated circuit component |
| 03/02/1999 | US5877034 Method of making a three-dimensional integrated circuit |
| 03/02/1999 | US5876427 Compact flexible circuit configuration |
| 03/02/1999 | CA2139266C Semiconductor package |
| 02/25/1999 | WO1999009599A2 Vertical interconnect process for silicon segments with dielectric isolation |
| 02/25/1999 | WO1999009596A1 Printed circuit substrate with cavities for encapsulating integrated circuits |
| 02/25/1999 | DE19803670A1 Semiconductor component for single-chip microcomputer |
| 02/24/1999 | CN1209217A Secure semiconductor device |
| 02/24/1999 | CN1208960A Power semiconductor modular for cooling means having inlegration with sub-modular mode |
| 02/24/1999 | CN1208959A High-frequency integrated circuit device and mfr. method thereof |
| 02/23/1999 | US5875100 High-density mounting method and structure for electronic circuit board |
| 02/23/1999 | US5874781 Angularly offset stacked die multichip device and method of manufacture |
| 02/23/1999 | US5874774 Flat package semiconductor device |
| 02/23/1999 | US5874770 Flexible interconnect film including resistor and capacitor layers |
| 02/23/1999 | US5874748 Light-emitting diode device and illuminator with light-emitting surface using same |
| 02/23/1999 | US5874321 Package integrated circuit having thermal enhancement and reduced footprint size |
| 02/18/1999 | WO1999008498A1 Contact arrangement linking two substrates and method for the production of said contact arrangement |
| 02/18/1999 | WO1999008326A1 Power transistor cell |
| 02/18/1999 | DE19734509A1 Leistungstransistorzelle Power transistor cell |
| 02/17/1999 | EP0897172A2 Display device for informations and their use and method of manufacture |
| 02/17/1999 | EP0896738A1 Integrated g (d)e-e detector telescope |
| 02/17/1999 | CN1208502A High-power microwave-frequency hybrid integrated circuit |
| 02/17/1999 | CN1208501A Electronic power module, and electronic power system comprising a plurality of same |
| 02/17/1999 | CN1208368A Fabricating interconnects and tips using sacrificial substrates |
| 02/17/1999 | CN1208253A Integrated circuit package and semi-conductor component |
| 02/17/1999 | CN1208215A Display apparatus |
| 02/17/1999 | CN1042181C Inverter apparatus |
| 02/16/1999 | US5872700 Multi-chip module package with insulating tape having electrical leads and solder bumps |
| 02/16/1999 | US5872397 Semiconductor device package including a thick integrated circuit chip stack |
| 02/16/1999 | US5872384 Component arrangement having magnetic field controlled transistor |
| 02/16/1999 | US5872025 Method for stacked three dimensional device manufacture |
| 02/11/1999 | WO1999007197A1 Heat spreader for electronic ballast |
| 02/11/1999 | WO1999007185A1 Electric heater for a motor vehicle |
| 02/11/1999 | WO1999007015A1 Conductive epoxy flip-chip on chip |
| 02/11/1999 | WO1999006107A1 Cardiac stimulator having stackable microelectronic components with self-addressing scheme |
| 02/11/1999 | CA2298525A1 Cardiac stimulator having stackable microelectronic components with self-addressing scheme |
| 02/10/1999 | EP0896501A2 Mounting structure for one or more semiconductor devices |
| 02/10/1999 | CN2307369Y Three phase controllable commutating bridge clamping device |
| 02/09/1999 | US5870300 Voltage converter having a commutation circuit with reduced inductance |
| 02/09/1999 | US5870289 Chip connection structure having diret through-hole connections through adhesive film and wiring substrate |
| 02/09/1999 | US5870128 Light-emitting device assembly having in-line light-emitting device arrays and manufacturing method therefor |
| 02/09/1999 | US5869896 Packaged electronic module and integral sensor array |
| 02/09/1999 | US5869895 Embedded memory assembly |
| 02/09/1999 | US5869894 RF IC package |
| 02/09/1999 | US5869888 Semiconductor device with lead structure on principal surface of chip |
| 02/09/1999 | US5869354 Forming a etch stop layer in the substrate parallel to the principal surface, forming semiconductor on the principal surface, depositing a low stress dielectric membranes over semiconductor, etching etch barrier and a substrate portion |
| 02/09/1999 | US5869353 Modular panel stacking process |
| 02/04/1999 | DE19833245A1 Solid state LED light bulb for indicator |
| 02/03/1999 | EP0895446A2 Controller for an electrical motor with a regulating circuit and a power semiconductor |
| 02/03/1999 | EP0895291A2 Photovoltaic element and method of producing the same |
| 02/02/1999 | USRE36077 Method of manufacturing inversion type IC's and IC module using same |
| 02/02/1999 | US5867419 In a computer system |
| 02/02/1999 | US5867367 Quad flat pack integrated circuit package |
| 02/02/1999 | US5866963 Bridge rectifier with insulating support having expandable legs |
| 02/02/1999 | US5866952 High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate |
| 02/02/1999 | US5866944 Multichip press-contact type semiconductor device |
| 02/02/1999 | US5866443 Very dense integrated circuit package and method for forming the same |
| 02/02/1999 | US5865904 Flexible photoelectric conversion module and method for its manufacture |
| 02/02/1999 | US5864946 Method of making contact tip structures |
| 01/28/1999 | WO1999004433A2 Mcm semiconductor device assemblies and circuits |
| 01/28/1999 | DE19832560A1 Control circuit module for electrical system in automobile |
| 01/28/1999 | DE19830475A1 Manufacturing semiconductor component with several chips |
| 01/27/1999 | EP0893823A1 Semiconductor bonding and sealing structure |
| 01/27/1999 | EP0892992A1 Three-colour sensor with a pin or nip series of layers |
| 01/27/1999 | EP0892987A1 Method for manufacturing multi-chip modules utilizing direct lead attach |
| 01/27/1999 | CN2305757Y Beta transistor component with standing high voltage over kilovolts |
| 01/27/1999 | CN1206484A True color flat panel display using led dot matrix and led dot matrix drive method and apparatus |
| 01/27/1999 | CN1206227A Method and apparatus for stress relieved electronic module |
| 01/27/1999 | CN1206226A Spherical grid array plugin unit |
| 01/26/1999 | US5864177 Bypass capacitors for chip and wire circuit assembly |
| 01/26/1999 | US5864175 Wrap-resistant ultra-thin integrated circuit package fabrication method |
| 01/26/1999 | US5863817 Semiconductor device |
| 01/26/1999 | CA2154053C Led array vehicle lamp |
| 01/20/1999 | EP0892487A1 Power module using semiconductors |
| 01/20/1999 | EP0892434A2 RF IC package |
| 01/20/1999 | EP0891648A1 Gas-insulated high-voltage semiconductor valve means |
| 01/19/1999 | US5861666 Multiple semiconductor chip assembly |
| 01/14/1999 | WO1999001898A1 Integrated circuit component |
| 01/14/1999 | DE19756941A1 Resin packaged semiconductor device |
| 01/14/1999 | DE19729690A1 Light source for traffic signals |
| 01/13/1999 | EP0891125A1 Reworkable circuit board assembly including a flip chip |
| 01/13/1999 | EP0890990A2 Mini-module with upwardly directed leads and method for making |
| 01/13/1999 | EP0890989A1 Semiconductor device and method for manufacturing thereof |
| 01/13/1999 | EP0890297A1 Solder bonded electronic module |
| 01/13/1999 | CN2304186Y Lamp-chain type light-emitting diode |
| 01/13/1999 | CN1204984A LED array plate and method for manufacturing said LED array plate |
| 01/12/1999 | US5859772 Power converter circuit |
| 01/12/1999 | US5859473 Duplexer package |
| 01/12/1999 | US5859468 Micro semiconductor bridge rectifier and method of manufacturing the same |