| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/12/1999 | EP0915505A1 Semiconductor device package, manufacturing method thereof and circuit board therefor |
| 05/12/1999 | EP0915504A1 Semiconductor package and method of forming the same |
| 05/12/1999 | CN1216402A Low noise ball grid array package |
| 05/11/1999 | US5903437 Electronic integrated circuit package |
| 05/11/1999 | US5903049 Semiconductor module comprising semiconductor packages |
| 05/11/1999 | US5903045 Semiconductor structure |
| 05/11/1999 | US5902959 Surface mount semiconductor package |
| 05/11/1999 | US5902118 Method for production of a three-dimensional circuit arrangement |
| 05/06/1999 | EP0913866A1 Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board |
| 05/06/1999 | EP0913865A2 Low noise ball grid array package |
| 05/06/1999 | EP0803174A4 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
| 05/04/1999 | US5901044 Mini-module with upwardly directed leads |
| 05/04/1999 | US5901042 Package and semiconductor device |
| 05/04/1999 | US5901040 Heat sink and Faraday Cage assembly for a semiconductor module and a power converter |
| 05/04/1999 | US5900743 Programmable logic array devices with interconnect lines of various lengths |
| 05/04/1999 | US5900738 Method of testing semiconductor devices |
| 05/04/1999 | US5899705 Stacked leads-over chip multi-chip module |
| 04/29/1999 | WO1999021228A1 Semiconductor module and power converter comprising it |
| 04/28/1999 | CN1215509A Bridge rectifier configuration and mounting for supplying exciter current in a ac generator |
| 04/27/1999 | US5898909 Ultra high frequency radio communication apparatus |
| 04/27/1999 | US5898575 Support assembly for mounting an integrated circuit package on a surface |
| 04/27/1999 | US5898223 Chip-on-chip IC packages |
| 04/27/1999 | US5898220 Multi-chip device and method of fabrication employing leads over and under processes |
| 04/27/1999 | US5898218 Structure for mounting electronic components and method for mounting the same |
| 04/27/1999 | US5898128 Electronic component |
| 04/27/1999 | US5897341 Forming solid state diffusion bond between component aluminum bonding pad and metal-coated substrate bonding pad |
| 04/27/1999 | US5897333 Method for forming integrated composite semiconductor devices |
| 04/27/1999 | US5897326 Method of exercising semiconductor devices |
| 04/27/1999 | US5897195 Oblique led illuminator device |
| 04/22/1999 | WO1999019911A1 Three-dimensional packaging configuration for multi-chip module assembly |
| 04/22/1999 | DE19740701A1 Vertical surface mount packaged semiconductor component e.g. for novel high power memory chip` |
| 04/21/1999 | EP0909972A2 Method of forming a high resolution liquid crystal display device |
| 04/21/1999 | EP0909462A1 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules |
| 04/21/1999 | CN1214800A LED matrix |
| 04/21/1999 | CN1214548A 多芯片模块 A multi-chip module |
| 04/21/1999 | CN1214547A 多芯片模块 A multi-chip module |
| 04/20/1999 | US5895974 Durable substrate subassembly for transistor switch module |
| 04/20/1999 | US5895970 Semiconductor package having semiconductor element, mounting structure of semiconductor package mounted on circuit board, and method of assembling semiconductor package |
| 04/20/1999 | US5895969 Thin type semiconductor device, module structure using the device and method of mounting the device on board |
| 04/20/1999 | US5895232 Three-dimensional warp-resistant integrated circuit module method and apparatus |
| 04/20/1999 | CA2125266C High density and high fiability integrated circuit assembly and manufacturing process for said assembly |
| 04/15/1999 | WO1999018613A1 Reduced area imaging devices incorporated within surgical instruments |
| 04/15/1999 | WO1999018612A2 Wafer level integration of multiple optical elements |
| 04/15/1999 | WO1999018611A1 Stacked integrated circuits using tape automated bonding within an implantable medical device |
| 04/15/1999 | WO1999018607A1 Methods of making flexible substrates for electronic packaging and flexible substrates formed by the method |
| 04/15/1999 | WO1999009599A3 Vertical interconnect process for silicon segments with dielectric isolation |
| 04/15/1999 | WO1999004433A3 Mcm semiconductor device assemblies and circuits |
| 04/15/1999 | WO1998051001A8 Bridge rectifier configuration and mounting for supplying exciter current in an ac generator |
| 04/15/1999 | DE19842615A1 Electronic component comprises a boxed printed circuit board module |
| 04/15/1999 | DE19747177A1 Stackable encased electronic component |
| 04/15/1999 | DE19744297A1 Stackable, encapsulated electronic component |
| 04/14/1999 | EP0908953A1 Light emitting element module and chip |
| 04/14/1999 | EP0908952A2 Chip-on-chip IC packages |
| 04/14/1999 | EP0908951A2 Improved air isolated crossovers |
| 04/14/1999 | CN1213861A Photovoltaic element and method of producing same |
| 04/13/1999 | US5893633 Light-emitting apparatus and method of producing the same |
| 04/08/1999 | WO1999017368A1 Three-dimensional component stacking using high density multichip interconnect decals |
| 04/08/1999 | DE19802347A1 Semiconductor substrate with stackable semiconductor module |
| 04/07/1999 | CN1213179A Power semiconductor module with closed submodules |
| 04/07/1999 | CN1213175A Semiconductor device and method for manufacture thereof |
| 04/06/1999 | US5892676 Rectifier bridges assembly having improved heat dispersing characteristics and an arcing-free design |
| 04/06/1999 | US5892657 Electronic-circuit assembly and its manufacturing method |
| 04/06/1999 | US5892287 Semiconductor device including stacked chips having metal patterned on circuit surface and on edge side of chip |
| 04/06/1999 | US5891761 Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform |
| 04/01/1999 | WO1999016136A1 Optical irradiation device |
| 04/01/1999 | WO1999016133A1 Optical module and lead frame for optical module |
| 04/01/1999 | CA2304166A1 Optical irradiation device |
| 04/01/1999 | CA2272615A1 Optical module and lead frame for optical module |
| 03/31/1999 | EP0905779A2 Method for manufacturing an emulation integrated circuit device as a device with two integrated circuits |
| 03/31/1999 | CN1212463A Printed-circuit board bearing plate for ball grid array integrated circuit component |
| 03/30/1999 | US5889654 Advanced chip packaging structure for memory card applications |
| 03/30/1999 | US5889411 FPGA having logic element carry chains capable of generating wide XOR functions |
| 03/30/1999 | US5889327 Semiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devices |
| 03/30/1999 | US5889320 Tape application platform and processes therefor |
| 03/30/1999 | US5888884 Electronic device pad relocation, precision placement, and packaging in arrays |
| 03/30/1999 | CA2002213C High performance integrated circuit chip package and method of making same |
| 03/25/1999 | WO1999014851A1 Attenuation unit for power diodes |
| 03/25/1999 | WO1999014806A1 Carrier plate for micro-hybrid circuits |
| 03/25/1999 | DE19740330A1 Ceramic carrier plate for microhybrid circuits |
| 03/24/1999 | EP0903786A2 Light emitting diode array and method of manufacturing |
| 03/24/1999 | EP0902977A1 Surface mount package with heat transfer feature |
| 03/24/1999 | EP0791962A4 Semiconductor rectifier module |
| 03/24/1999 | CN1211821A Semiconductor substrate and stackable semiconductor package and fabrication method thereof |
| 03/23/1999 | US5886412 Angularly offset and recessed stacked die multichip device |
| 03/23/1999 | US5886408 Multi-chip semiconductor device |
| 03/23/1999 | US5885850 Method for the 3D interconnection of packages of electronic components, and device obtained by this method |
| 03/23/1999 | US5885849 Methods of making microelectronic assemblies |
| 03/23/1999 | US5884398 Mounting spring elements on semiconductor devices |
| 03/18/1999 | WO1998032213A3 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same |
| 03/17/1999 | EP0902480A2 Bidirectional power semiconductor device |
| 03/17/1999 | EP0902472A2 Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor |
| 03/17/1999 | EP0714555B1 High-voltage breakover diode |
| 03/17/1999 | CN1211081A Bidirectional power semiconductor component |
| 03/16/1999 | US5883431 Device with power semiconductor components |
| 03/16/1999 | US5883429 Chip cover |
| 03/16/1999 | US5883428 Package for housing a semiconductor element |
| 03/16/1999 | US5883426 Stack module |
| 03/16/1999 | US5883425 Circuit device |
| 03/11/1999 | WO1999012208A1 Electrical interface to integrated device having high density i/o count |
| 03/11/1999 | WO1999012206A1 Multicolor sensor |