Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/1999
07/22/1999WO1999036962A1 Semiconductor component with several substrate layers and at least one semiconductor chip and method for producing a semiconductor component
07/22/1999WO1999036959A1 High-density computer modules with stacked parallel-plane packaging
07/22/1999DE19801312A1 Semiconductor element with semiconductor chip for multi-chip module
07/22/1999DE19758197A1 Semiconductor memory chip stacking arrangement for large memory capacity computer application
07/21/1999EP0930815A1 High-power electronic device, and method of manufacturing such device
07/21/1999EP0929990A1 Electric heater for a motor vehicle
07/21/1999EP0929935A1 Coplanar waveguide amplifier
07/20/1999US5926372 For use with a high power switching module
07/20/1999US5926369 Vertically integrated multi-chip circuit package with heat-sink support
07/20/1999US5926358 Lead frame capacitor and capacitively-coupled isolator circuit using same
07/20/1999US5926308 High-speed optical modulator module
07/20/1999US5925929 Cooling apparatus for electronic elements
07/20/1999US5925924 Methods for precise definition of integrated circuit chip edges
07/20/1999US5925897 Optoelectronic semiconductor diodes and devices comprising same
07/19/1999CA2259703A1 Electronic power component and manufacturing process
07/15/1999WO1999035691A1 An integrated circuit (ic) package including accompanying ic chip and coil and a method of production therefor
07/15/1999WO1999035689A1 Semiconductor package converter module
07/15/1999WO1999035686A1 A vertical connector based packaging solution for integrated circuits
07/15/1999WO1999025165A3 Modular and multifunctional structure
07/14/1999EP0928486A1 Device and method for testing integrated circuit dice in an integrated circuit module
07/14/1999CN1222761A Moldless semiconductor device and photovoltaic device module making use of same
07/13/1999US5923951 Method of making a flip-chip bonded GaAs-based opto-electronic device
07/13/1999US5923181 Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
07/13/1999US5923091 Bonded semiconductor integrated circuit device
07/13/1999US5923090 Microelectronic package and fabrication thereof
07/13/1999US5923085 Power transistor assembly
07/08/1999DE19758309A1 Electrolytically produced hydrogen using solar energy
07/07/1999EP0927433A2 Semiconductor device assemblies and circuits
07/07/1999CN1221983A Multi-chip module
07/06/1999US5920770 Resin seal semiconductor package and manufacturing method of the same
07/06/1999US5920202 Configurable logic element with ability to evaluate five and six input functions
07/06/1999US5920119 Power semiconductor module employing metal based molded case and screw fastening type terminals for high reliability
07/06/1999US5918794 Solder bonding of dense arrays of microminiature contact pads
07/06/1999CA2181467C Photo-thermal therapeutic device and method
07/01/1999DE19757513A1 Diode for rectifiers in welding, current supply apparatus, etc.
06/1999
06/29/1999US5918112 Semiconductor component and method of fabrication
06/29/1999US5917707 Flexible contact structure with an electrically conductive shell
06/29/1999US5917236 For semiconductor components
06/24/1999DE19755155A1 Electronic module for simple circuits of electronic components
06/23/1999EP0924764A2 Pinned circuit board with a plurality of semiconductor devices
06/23/1999CN1220492A Semiconductor device
06/22/1999US5915167 Three dimensional structure memory
06/22/1999US5914616 FPGA repeatable interconnect structure with hierarchical interconnect lines
06/22/1999US5914535 Flip chip-on-flip chip multi-chip module
06/22/1999US5914530 Semiconductor device
06/22/1999US5914501 Light emitting diode assembly having integrated electrostatic discharge protection
06/22/1999CA2256778A1 Power semiconductor module
06/17/1999DE19848743A1 Two-stage filter for interference signals
06/17/1999DE19842481A1 Stackable chip production involves forming insulation-filled slits in a wafer prior to chip separation
06/16/1999EP0923131A2 Semiconductor assembly
06/16/1999EP0923130A1 Electronic circuit, in particular for implantable active medical device, like a heart stimulator or defibrillator, and its manufacturing method
06/16/1999EP0923127A2 Encapsulating semiconductor chips
06/16/1999EP0886894A4 Contact carriers (tiles) for populating larger substrates with spring contacts
06/16/1999EP0788661B1 Three-colour sensor
06/16/1999CN1219837A Built-in circuit device assembly and its manufacturing method
06/16/1999CN1219769A Semiconductor device
06/15/1999US5912808 Semiconductor component
06/15/1999US5912465 Photoelectric converter
06/15/1999US5912046 By placing the liquid having solids in suspension in a centrifuge and spinning it about an axis so that liquid is forced against the surface of component
06/15/1999CA2050091C Electronic circuit and method with thermal management
06/10/1999WO1999028971A1 Electronic hybrid component and method for the production thereof
06/10/1999WO1999028970A1 Semiconductor device and method for manufacturing the same
06/10/1999WO1999000845A8 Electronic control apparatus
06/09/1999EP0921569A1 Integrated circuit package
06/09/1999EP0921568A2 LED Luminaire
06/09/1999EP0921566A1 Microelectromechanical component, such as a microsensor or a microactuator transferable onto a hybrid circuit substrate
06/09/1999EP0920726A1 Adaptable rotating rectifier and suppression resistor assembly for two-pole, wound rotor of dynamoelectric machine
06/08/1999US5910885 Electronic stack module
06/08/1999US5910685 Semiconductor memory module having double-sided stacked memory chip layout
06/08/1999US5910683 Power semiconductor module
06/08/1999US5910682 Semiconductor chip stack package
06/08/1999US5910010 Semiconductor integrated circuit device, and process and apparatus for manufacturing the same
06/02/1999EP0920058A2 Circuit component built-in module and method for producing the same
06/02/1999EP0809924A4 Multiple chip module mounting assembly and computer using same
06/02/1999DE19854180A1 Adaptable planar module case for semiconductor components, e.g. motor control module
06/01/1999US5909052 Semiconductor device having plural chips with the sides of the chips in face-to-face contact with each other in the same crystal plane
06/01/1999US5909050 Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
06/01/1999US5909037 Bi-level injection molded leadframe
06/01/1999US5908304 Mass memory and method for the manufacture of mass memories
05/1999
05/27/1999WO1999026288A1 Semiconductor device and method for manufacturing the same
05/27/1999WO1999026285A1 Multi-chip module having interconnect dies
05/26/1999EP0917734A1 Illuminator assembly incorporating light emitting diodes
05/26/1999EP0917733A1 Integrated circuit device manufacture
05/26/1999EP0725939B1 Head-mounted display system
05/25/1999US5907477 Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant
05/25/1999US5907248 FPGA interconnect structure with high-speed high fanout capability
05/25/1999US5907178 Multi-view imaging apparatus
05/25/1999US5906700 Method of manufacturing circuit module
05/20/1999WO1999025165A2 Modular and multifunctional structure
05/19/1999EP0917211A2 Moldless semiconductor device and photovoltaic device module making use of the same
05/19/1999EP0858578A4 Liquid cooled heat sink for cooling electronic components
05/18/1999US5905639 Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds
05/18/1999US5905635 Multi-level electronic module assembly
05/18/1999US5905305 Condensed memory matrix
05/18/1999US5904545 Apparatus for fabricating self-assembling microstructures
05/18/1999US5904497 Method and apparatus for semiconductor assembly which includes testing of chips and replacement of bad chips prior to final assembly
05/14/1999WO1999023701A1 A high power prematched mmic transistor with improved ground potential continuity
05/14/1999WO1999022571A2 Three-dimensional flexible electronic module
05/14/1999WO1999022570A2 Three-dimensional electronic module
05/12/1999EP0915516A2 Substrate for stacked module and stacked module
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