| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/28/1999 | US5959357 Fet array for operation at different power levels |
| 09/23/1999 | WO1999048157A1 Solar battery |
| 09/23/1999 | WO1999048140A1 Attachment method for stacked integrated circuit (ic) chips |
| 09/23/1999 | WO1999041732A3 Tiled electronic display structure |
| 09/23/1999 | DE19909524A1 Power module with several power thyristors and integral temperature probe |
| 09/22/1999 | EP0943158A2 Affinity based self-assembly systems and devices for photonic and electronic applications |
| 09/22/1999 | EP0943157A1 Integrated electronic circuit |
| 09/22/1999 | CN1229330A Hybrid module and making method thereof and mounting method thereof |
| 09/22/1999 | CN1229212A Signaling improvement using extended transmission lines on high speed DIMMS |
| 09/21/1999 | US5956236 Integrated circuit package support system |
| 09/21/1999 | US5956233 High density single inline memory module |
| 09/21/1999 | US5956231 Semiconductor device having power semiconductor elements |
| 09/21/1999 | US5955776 Spherical shaped semiconductor integrated circuit |
| 09/15/1999 | EP0942471A2 Circuit with small package for mosfets |
| 09/14/1999 | US5953588 Stackable layers containing encapsulated IC chips |
| 09/14/1999 | US5953213 Multichip module |
| 09/14/1999 | US5953210 Reworkable circuit board assembly including a reworkable flip chip |
| 09/14/1999 | US5952725 Stacked semiconductor devices |
| 09/14/1999 | US5952646 Low temperature bump-bonding semiconductor imaging device |
| 09/14/1999 | US5950304 Methods of making semiconductor chip assemblies |
| 09/10/1999 | WO1999045593A1 Three-dimensional device |
| 09/10/1999 | WO1999045592A1 Semiconductor component with several semiconductor chips |
| 09/10/1999 | WO1999045591A1 An integrated circuit package having interchip bonding and method therefor |
| 09/09/1999 | DE19808986A1 Halbleiterbauelement mit mehreren Halbleiterchips A semiconductor device comprising a plurality of semiconductor chips |
| 09/08/1999 | EP0940850A1 Signaling improvement using extended transmission lines on 'DIMM'memory modules |
| 09/08/1999 | EP0940030A1 Opsistor image processor |
| 09/08/1999 | EP0605712B1 Packaging electrical components |
| 09/07/1999 | US5949651 Quad flat pack integrated circuit package |
| 09/07/1999 | US5949135 Module mounted with semiconductor device |
| 09/07/1999 | US5949064 Opsistor image processor with a reference detector and a reference image |
| 09/02/1999 | WO1999044401A1 Stacking layers containing enclosed ic chips |
| 09/02/1999 | WO1999044235A1 Multichip semiconductor package and method of making |
| 09/02/1999 | WO1999012205A9 Multicolor-color sensor |
| 09/02/1999 | DE19806550A1 Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement Electronic component, in particular operating with acoustic surface waves component - SAW component |
| 09/01/1999 | EP0938750A1 Large-area high-current module of a field-controlled interruptible power semiconductor switch |
| 09/01/1999 | EP0938749A1 Integrated circuit with housing accommodating the latter |
| 09/01/1999 | EP0835498B1 Stackable data carrier capable of being operated by a data bus |
| 09/01/1999 | EP0812473B1 Arrangement of electronic components on a carrier strip |
| 08/31/1999 | US5946559 Method of forming a field effect transistor |
| 08/31/1999 | US5946545 Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit |
| 08/31/1999 | US5945730 Semiconductor power device |
| 08/31/1999 | US5945728 Lead frame capacitor and capacitively coupled isolator circuit |
| 08/31/1999 | US5945725 Spherical shaped integrated circuit utilizing an inductor |
| 08/31/1999 | US5944199 Integrated circuit package support system |
| 08/25/1999 | EP0938139A2 Microwave and millimeter wave device |
| 08/25/1999 | EP0938138A2 Fet array for operation at different power levels |
| 08/24/1999 | US5943563 Method for producing a three-dimensional circuit arrangement |
| 08/24/1999 | US5943254 Multichip semiconductor structures with consolidated circuitry and programmable ESD protection for input/output nodes |
| 08/24/1999 | US5943213 Three-dimensional electronic module |
| 08/24/1999 | US5943211 Heat spreader system for cooling heat generating components |
| 08/24/1999 | US5942797 Power semiconductor module |
| 08/24/1999 | US5942770 Light-emitting diode chip component and a light-emitting device |
| 08/19/1999 | WO1999041833A1 Electronic component, especially a component working with acoustic surface waves |
| 08/19/1999 | WO1999041788A1 Contrast enhancement for an electronic display device |
| 08/19/1999 | WO1999041787A1 Sealing of large area display structures |
| 08/19/1999 | WO1999041786A1 Semiconductor device packaging and method of fabrication |
| 08/19/1999 | WO1999041785A1 Adaptable led light panel |
| 08/19/1999 | WO1999041732A2 Tiled electronic display structure |
| 08/19/1999 | WO1999041632A1 Improved photovoltaic generator circuit |
| 08/19/1999 | DE19905220A1 Multichip module on intermediate support |
| 08/19/1999 | DE19805820A1 Semiconductor clamped stack for high power rectifier |
| 08/19/1999 | CA2320907A1 Electronic component, particularly a component working with surface acoustic waves-saw component |
| 08/18/1999 | EP0936671A1 Resin-moulded semiconductor hybrid module and manufacturing method thereof |
| 08/18/1999 | EP0936400A2 Multiple light emitting diode module |
| 08/18/1999 | EP0935818A1 Electronic control apparatus |
| 08/17/1999 | US5940686 Method for manufacturing multi-chip modules utilizing direct lead attach |
| 08/17/1999 | US5940683 Forming array of light emitting diode (led) chips each having connectors around the perimeter on surface of gallium arsenide first substrate, flip-chip mounting to a driver chip, engaging connectors, etching away first substrate |
| 08/17/1999 | US5940273 Semiconductor clamping device |
| 08/17/1999 | US5939996 Display sign and an optical element for use in the same |
| 08/17/1999 | US5939779 Bottom lead semiconductor chip stack package |
| 08/12/1999 | WO1999040625A1 Thermal bus bar design for an electronic cartridge |
| 08/12/1999 | WO1999040624A1 Integrated circuit device |
| 08/12/1999 | CA2319506A1 Integrated circuit device |
| 08/11/1999 | EP0934621A1 Bridge rectifier configuration and mounting for supplying exciter current in an ac generator |
| 08/10/1999 | US5936833 Converter modules having a busbar system for power semiconductor switches |
| 08/10/1999 | US5936353 High-density solid-state lighting array for machine vision applications |
| 08/10/1999 | US5936305 Stacked leads-over chip multi-chip module |
| 08/10/1999 | US5936302 Speaker diaphragm |
| 08/10/1999 | US5935687 Three dimensional package and architecture for high performance computer |
| 08/05/1999 | DE19903342A1 Multiple chip module |
| 08/04/1999 | EP0933816A2 Hybrid module and methods for manufacturing and mounting thereof |
| 08/04/1999 | EP0932926A1 Low resistance current transfer device for a circuit of a brushless exciter |
| 08/04/1999 | CN1225232A Heat spreader system and method for cooling heat generating components |
| 08/03/1999 | US5933712 Joining edge-pad of each stacked chip to metal conductor line along a flexible plastic tape and joining end of conductor line to single pad on circuit board whereby joining is done with anisotropically conducting adhesive and without solder |
| 08/03/1999 | US5933002 Controlled bending actuator system |
| 07/29/1999 | WO1999038211A1 Microsystem and method for the production thereof |
| 07/29/1999 | WO1999018612A3 Wafer level integration of multiple optical elements |
| 07/29/1999 | DE19903028A1 MOS semiconductor structure used as a MOSFET or IGBT structure |
| 07/28/1999 | EP0931346A1 Microelectronic component with a sandwich design |
| 07/28/1999 | EP0931337A1 Storage assembly with self-aligning non-integrated capacitor arrangement |
| 07/27/1999 | US5930599 Semiconductor device and method of manufacturing the same |
| 07/27/1999 | US5930596 Semiconductor component for vertical integration and manufacturing method |
| 07/27/1999 | US5930098 Multichip semiconductor structures with interchip electrostatic discharge protection, and fabrication methods therefore |
| 07/27/1999 | US5929901 Reduced area imaging devices incorporated within surgical instruments |
| 07/27/1999 | US5929562 Organic electroluminescent display, |
| 07/27/1999 | US5929520 Circuit with small package for mosfets |
| 07/27/1999 | US5929519 Semiconductor module including switching device chips and diode chips |
| 07/27/1999 | US5929510 Integrated electronic circuit |
| 07/27/1999 | US5928437 Microarray for efficient energy generation for satellites |
| 07/27/1999 | US5926951 Method of stacking electronic components |