Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/1999
11/23/1999US5991160 Surface mount LED alphanumeric display
11/23/1999US5990566 High density semiconductor package
11/23/1999US5990564 Flip chip packaging of memory chips
11/23/1999US5990550 Integrated circuit device cooling structure
11/23/1999US5990549 Thermal bus bar design for an electronic cartridge
11/23/1999US5990501 Multichip press-contact type semiconductor device
11/23/1999US5990472 Microelectronic radiation detectors for detecting and emitting radiation signals
11/23/1999US5988511 Stackable data carrier that can be operated on a data bus
11/23/1999US5987732 Method of making compact integrated microwave assembly system
11/18/1999WO1999041788A9 Contrast enhancement for an electronic display device
11/18/1999DE19920445A1 High density bottom leaded package stack of integrated circuits
11/18/1999DE19920444A1 Thin small outline package for semiconductor device
11/18/1999CA2272005A1 Memory cube and manufacturing process of same
11/17/1999EP0957517A2 Power semiconductor device
11/17/1999EP0807369A4 Stackable modules and multimodular assemblies
11/16/1999US5987358 Semiconductor device packaging and method of fabrication
11/16/1999US5987357 Stackable microelectronic components with self-addressing scheme
11/16/1999US5986906 Converter circuit arrangement
11/16/1999US5986886 Three-dimensional flexible electronic module
11/16/1999US5986693 Reduced area imaging devices incorporated within surgical instruments
11/16/1999US5986342 Liquid crystal display apparatus structure for mounting semiconductor device
11/16/1999US5986341 Semiconductor device
11/16/1999US5986209 Package stack via bottom leaded plastic (BLP) packaging
11/16/1999US5985693 High density three-dimensional IC interconnection
11/16/1999US5983493 Method of temporarily, then permanently, connecting to a semiconductor device
11/11/1999WO1999057765A1 Chip stack and method of making same
11/11/1999WO1999045591A9 An integrated circuit package having interchip bonding and method therefor
11/10/1999CN1234910A Electronic control apparatus
11/10/1999CN1234909A Semiconductor device and process for manufacturing same
11/10/1999CN1234610A Multiple device integrated circuit package having feed-through connections
11/09/1999US5982654 System for connecting semiconductor devices
11/09/1999US5982062 Alternator including adaptors for rectifier bridge diodes, in particular for a motor vehicle, and an adaptor for such an alternator
11/09/1999US5982032 Electronic device having FETs on a low dielectric constant GaAs base member and passive elements on a high dielectric constant base member
11/09/1999US5982031 Power semiconductor module with closed submodules
11/09/1999US5981315 Transfer molding
11/09/1999US5981310 Multi-chip heat-sink cap assembly
11/04/1999WO1999056508A1 Rigid interconnect device and method of making
11/03/1999EP0954028A1 Memory module
11/03/1999EP0953186A1 Chip card module
11/03/1999EP0765534B1 High impact digital crash data recorder
11/03/1999CN1233773A Camera having flexible printed circuit board
11/02/1999US5978227 Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends
11/02/1999US5978224 Quad flat pack integrated circuit package
11/02/1999US5978223 Dual heat sink assembly for cooling multiple electronic modules
11/02/1999US5978222 Semiconductor device and assembly board having through-holes filled with filling core
11/02/1999US5977640 Highly integrated chip-on-chip packaging
11/02/1999US5977629 Condensed memory matrix
11/02/1999US5977621 Power semiconductor module
11/02/1999US5977575 Semiconductor sensor device comprised of plural sensor chips connected to function as a unit
11/02/1999US5976953 Three dimensional processor using transferred thin film circuits
11/02/1999US5975402 Stacking and soldering apparatus for three dimensional stack package devices
11/02/1999US5974662 Method of planarizing tips of probe elements of a probe card assembly
10/1999
10/28/1999DE19818402A1 Arrangement for illumination and signaling purposes produces light that is friendly to the eye
10/27/1999EP0952613A1 A multiple device integrated circuit package having feed-through connections
10/27/1999EP0951735A1 A packaging structure for integrated circuits
10/27/1999EP0951631A1 Spherical shaped semiconductor integrated circuit
10/26/1999US5973930 Mounting structure for one or more semiconductor devices
10/26/1999US5973928 Multi-layer ceramic substrate decoupling
10/26/1999US5973403 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
10/26/1999US5973396 Surface mount IC using silicon vias in an area array format or same size as die array
10/26/1999US5973393 Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits
10/26/1999US5973392 Stacked carrier three-dimensional memory module and semiconductor device using the same
10/20/1999EP0950263A1 A high power prematched mmic transistor with improved ground potential continuity
10/20/1999EP0950262A1 A via structure
10/20/1999CN2344876Y Ball gridarray type integrated circuit wafer connector and terminal structure
10/20/1999CN1045865C Fastening base board
10/19/1999US5969420 Semiconductor device comprising a plurality of interconnection patterns
10/19/1999US5968150 Processor element having a plurality of CPUs for use in a multiple processor system
10/19/1999US5967858 Power module
10/14/1999WO1999052155A1 Semiconductor structure having photovoltaic component
10/14/1999WO1999041788A8 Contrast enhancement for an electronic display device
10/13/1999EP0948810A1 Bump-bonded semiconductor imaging device
10/13/1999EP0948808A1 Integrated circuits and methods for their fabrication
10/13/1999CN1231761A Storage assembly with self-aligning non-integrated capacitor arrangement
10/13/1999CN1045693C Contact structure for interconnections, interposer, semiconductor assembly and method
10/12/1999US5966291 Power module for the control of electric motors
10/12/1999US5965947 Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads
10/12/1999US5965907 Full color organic light emitting backlight device for liquid crystal display applications
10/07/1999WO1999050905A1 Wafer-pair having deposited layer sealed chambers
10/07/1999WO1999050890A1 Method for making multilayer thin-film electronics
10/07/1999WO1999050889A2 Printed insulators for active and passive electronic devices
10/07/1999WO1999022570A3 Three-dimensional electronic module
10/07/1999DE19914305A1 On-board device relaying digital input signal as complementary signal on transmission line pair
10/07/1999DE19913454A1 LED module for light source with tailored emission wavelength
10/06/1999EP0947063A1 Opsistor transmitter data compression circuit
10/05/1999USRE36325 Directly bonded SIMM module
10/05/1999US5963794 Angularly offset stacked die multichip device and method of manufacture
10/05/1999US5963793 Microelectronic packaging using arched solder columns
10/05/1999US5963430 Multi-electronic device package comprising at least two substrates and at least four layers of electrically conductive circuitry
10/05/1999US5963429 Printed circuit substrate with cavities for encapsulating integrated circuits
10/05/1999US5963427 Multi-chip module with flexible circuit board
10/05/1999US5963050 Configurable logic element with fast feedback paths
10/05/1999US5962874 Light emitting diode array and optical image forming apparatus with light emitting diode array
10/05/1999US5962840 Data carrier with electronic module and embedded coil feature
10/05/1999US5960539 Method of making high density integrated circuit module
09/1999
09/30/1999WO1999049509A1 Wiring method for producing a vertical, integrated circuit structure and vertical, integrated circuit structure
09/30/1999WO1999049468A1 Rambus stakpak
09/30/1999WO1999041632A8 Improved photovoltaic generator circuit
09/29/1999EP0944922A1 Chip module and manufacture of same
09/29/1999CN1229968A Superthin luminous screen and its prodn. method
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