Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
01/2000
01/12/2000CN1241353A System and method for packaging integrated circuits
01/12/2000CN1241316A Low resistance current transfer device for circuit of brushless exciter
01/12/2000CN1241056A Board for distributing implement
01/12/2000CN1241032A Highly integrated chip-on-chip packaging
01/11/2000US6014586 Vertically integrated semiconductor package for an implantable medical device
01/11/2000US6014316 IC stack utilizing BGA contacts
01/11/2000US6014314 Package structure of a multi-chip module
01/11/2000US6014313 Packaging structure for integrated circuits
01/11/2000US6014064 Heterolithic voltage controlled oscillator
01/11/2000US6013948 Stackable chip scale semiconductor package with mating contacts on opposed surfaces
01/11/2000US6012210 Light emitting diode jig
01/06/2000WO2000001208A1 Assembly of an electronic component with spring packaging
01/06/2000WO2000001060A1 Electronic package assembly
01/06/2000WO2000001014A1 Method for producing and separating semiconductor light-emitting diodes
01/06/2000WO2000001013A1 Integrated electronic micromodule and method for making same
01/05/2000EP0969511A2 Power module board and power module using the board
01/05/2000EP0818132A4 A method to prevent intrusions into electronic circuitry
01/05/2000DE19828970A1 Verfahren zur Herstellung und Vereinzelung von Halbleiter-Lichtemissionsdioden Process for the preparation and separation of semiconductor light emitting diodes
01/05/2000DE19828664A1 Semiconductor arrangement e.g. power semiconductor based on chip-on-chip (COC) technology
01/05/2000CN1240535A Chip module and manufacture of same
12/1999
12/30/1999DE19854899C1 Lighting unit for automobile
12/29/1999EP0967712A1 Sub-assembly with electronic components for an alternator of motor vehicle
12/29/1999EP0967648A2 Semiconductor clamping device
12/29/1999CN1239831A Semiconductor device and method for fabricating the same
12/28/1999USRE36469 Packaging for semiconductor logic devices
12/28/1999US6008991 Electronic system including packaged integrated circuits with heat spreading standoff support members
12/28/1999US6008988 Integrated circuit package with a heat spreader coupled to a pair of electrical devices
12/28/1999US6008530 Polyhedral IC package for making three dimensionally expandable assemblies
12/28/1999US6008450 Solar cell module having a back face reinforcing member covered by a resin and a process for the production of said solar cell module
12/28/1999US6008126 Membrane dielectric isolation IC fabrication
12/28/1999US6006426 Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
12/23/1999WO1999066629A1 Half bridge module
12/23/1999WO1999066556A1 Vertically integrated microelectronic system and method for producing the same
12/23/1999WO1999066551A1 Scaleable integrated data processing device
12/23/1999WO1999050889A3 Printed insulators for active and passive electronic devices
12/23/1999DE19826731A1 Halbbrückenbaugruppe Half bridge assembly
12/23/1999DE19813239C1 Verdrahtungsverfahren zur Herstellung einer vertikalen integrierten Schaltungsstruktur und vertikale integrierte Schaltungsstruktur A wiring method for producing a vertical integrated circuit structure and vertical integrated circuit structure
12/22/1999EP0853816A4 Connecting multiple microelectronic elements with lead deformation
12/22/1999CN1239543A Spherical shaped semiconductor integrated circuit
12/22/1999CN1239327A Heat sink and memory module with heat sink
12/21/1999US6005778 Chip stacking and capacitor mounting arrangement including spacers
12/21/1999US6005776 Vertical connector based packaging solution for integrated circuits
12/21/1999US6004396 Spherical shaped semiconductor integrated circuit
12/16/1999WO1999065282A1 Ic stack utilizing flexible circuits with bga contacts
12/16/1999WO1999065076A1 Semiconductor device and method for manufacturing the same
12/16/1999WO1999065062A2 Ic stack utilizing secondary leadframes
12/16/1999WO1999064978A1 Light beam scanning device and method for making same
12/16/1999DE19926756A1 Electronic circuit housing with improved heat dissipation for e.g. rectifiers in automobile circuits
12/15/1999EP0964446A2 An electronic circuit assembly
12/15/1999CN2354242Y Microspan spherical-grating array storage model group
12/14/1999USRE36446 Providing electrically insulating substrate; mounting a device having termainals on individual land areas; electrically connecting terminals; depositing curable layer of insulative material; curing; dividing into modular components
12/14/1999US6002592 Electronic device and method for manufacturing electronic device
12/14/1999US6002183 Power semiconductor packaging
12/14/1999US6002177 High density integrated circuit packaging with chip stacking and via interconnections
12/14/1999US6002167 Semiconductor device having lead on chip structure
12/14/1999US6002163 Electronic device pad relocation, precision placement, and packaging in arrays
12/14/1999US6002147 Hybrid microwave-frequency integrated circuit
12/14/1999US6001671 Methods for manufacturing a semiconductor package having a sacrificial layer
12/09/1999WO1999063527A2 Data storage and processing apparatus, and method for fabricating the same
12/09/1999DE19842080A1 Carrier disk manufacture for semiconductor chip
12/08/1999EP0962974A2 Semiconductor device
12/08/1999EP0962973A1 Multichip press-contact power semiconductor device
12/08/1999CA2273687A1 Semiconductor clamping device
12/07/1999US5999437 Processor-inclusive memory module
12/07/1999US5999151 Pixel, video display screen and power delivery
12/07/1999US5998868 Very dense chip package
12/07/1999US5998865 Loc simm
12/07/1999US5998864 Stacking semiconductor devices, particularly memory chips
12/07/1999US5998860 Double sided single inline memory module
12/07/1999US5998859 Packaging and interconnect system for integrated circuits
12/07/1999US5998856 Semiconductor device
12/07/1999US5998817 High power prematched MMIC transistor with improved ground potential continuity
12/07/1999US5998806 Three-color sensor with a pin or nip series of layers
12/07/1999US5998292 Method for making three dimensional circuit integration
12/07/1999US5998228 Method of testing semiconductor
12/07/1999US5997152 Light emitting element module and printer head using the same
12/07/1999US5996221 Method for thermocompression bonding structures
12/04/1999CA2273589A1 Method for producing an electronic circuit assembly
12/02/1999WO1999022571A3 Three-dimensional flexible electronic module
12/02/1999DE19845316A1 Stackable ball grid array (BGA) semiconductor casing
12/01/1999EP0961322A2 Microwave integrated circuit multi-chip-module and mounting structure therefor
12/01/1999EP0960442A1 Method for producing a radiation detector by assembling elementary blocks and resulting detector
12/01/1999EP0960438A1 High density integrated circuits and the method of packaging the same
11/1999
11/30/1999US5995379 Stacked module and substrate therefore
11/30/1999US5995371 Integrated dielectric substrate
11/30/1999US5994774 Surface mountable integrated circuit package with detachable module and interposer
11/30/1999US5994772 Semiconductor package
11/30/1999US5994739 Integrated circuit device
11/30/1999US5994170 Silicon segment programming method
11/30/1999US5994166 Method of constructing stacked packages
11/25/1999WO1999060619A1 Semiconductor device and method of manufacture thereof
11/25/1999WO1999060618A1 Semiconductor device and method of manufacture thereof
11/24/1999EP0959500A2 Packaging silicon on silicon multichip modules
11/24/1999EP0959494A1 Semiconductor and method for manufacturing the same
11/24/1999EP0959474A1 Memory cube and its manufacturing process
11/24/1999EP0958607A1 Transferred flexible integrated circuit
11/24/1999EP0784342B1 Pressure contact type semiconductor device and assembly method therefor
11/23/1999US5991184 Vehicular extended thermal cycle minimal part robust rectifier assembly
11/23/1999US5991162 High-frequency integrated circuit device and manufacture method thereof
11/23/1999US5991161 Multi-chip land grid array carrier
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