| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/22/2000 | EP0987760A2 Multimodule interconnect structure and process |
| 03/22/2000 | CN2370569Y Diode |
| 03/22/2000 | CN1050697C Large power semiconductor module with pin |
| 03/21/2000 | US6040624 Semiconductor device package and method |
| 03/21/2000 | US6040204 Method of stacking chips with a removable connecting layer |
| 03/21/2000 | US6040203 Clock skew minimization and method for integrated circuits |
| 03/16/2000 | WO2000014802A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 03/16/2000 | WO2000014798A1 Electronic part module mounted on socket |
| 03/16/2000 | DE19914281C1 Light emitting module for combining and fusing to other light emitting modules of equal type; has connector devices in external casing areas and electrical contacts that can be fixed to contacts with other modules |
| 03/15/2000 | EP0986103A1 Light emitting element module and printer head using the same |
| 03/15/2000 | EP0985226A1 Method for manufacturing electric modules, and the electric module |
| 03/15/2000 | CN1247635A Via structure |
| 03/15/2000 | CN1247634A Packaging structure for integrated circuits |
| 03/14/2000 | USRE36614 Modular surface mount component for an electrical device or LED's |
| 03/14/2000 | USRE36613 Multi-chip stacked devices |
| 03/14/2000 | US6038133 Circuit component built-in module and method for producing the same |
| 03/14/2000 | US6038132 Memory module |
| 03/14/2000 | US6037666 Semiconductor integrated circuit having standard and custom circuit regions |
| 03/14/2000 | US6037602 Photovoltaic generator circuit and method of making same |
| 03/09/2000 | DE19919944A1 Anordnung mit lichtemittierenden Dioden mit einem integrierten Schutz vor einer elektrostatischen Entladung Arrangement with light-emitting diodes with an integrated protection against electrostatic discharge |
| 03/08/2000 | EP0984494A1 Solar battery |
| 03/08/2000 | EP0984491A1 Explosion protection for semiconductor module |
| 03/08/2000 | EP0983611A1 An integrated circuit package having interchip bonding and method therefor |
| 03/08/2000 | CN1246728A Explosive protection for semiconductor module |
| 03/07/2000 | US6034862 Diode module assembly with bifurcated terminals |
| 03/07/2000 | US6034438 L-connect routing of die surface pads to the die edge for stacking in a 3D array |
| 03/07/2000 | US6034425 Flat multiple-chip module micro ball grid array packaging |
| 03/07/2000 | US6033931 Semiconductor device including stacked chips having metal patterned on circuit surface and one edge side of chip |
| 03/07/2000 | US6032356 Wafer-level test and burn-in, and semiconductor process |
| 03/02/2000 | WO2000011713A1 Integrated electronic circuit comprising at least an electronic power component |
| 03/02/2000 | DE19938302A1 Power semiconductor circuit with oscillation damped parallel circuit of IGBT power switches |
| 03/02/2000 | DE19839422A1 Explosionsschutz für Halbleitermodule Explosion protection for semiconductor modules |
| 03/01/2000 | EP0982773A2 System and method for bonding and sealing microfabricated wafers to form a single structure having a vacuum chamber therein |
| 03/01/2000 | CN1246202A Flip-chip type connection with elastic contacts |
| 02/29/2000 | US6031733 Preventing movement of integrated circuit packages relative to their support surface |
| 02/29/2000 | US6031729 Integral heater for reworking MCMS and other semiconductor components |
| 02/29/2000 | US6031279 Power semiconductor component |
| 02/29/2000 | US6031278 IC card and manufacturing method thereof |
| 02/29/2000 | US6030858 Stacked bottom lead package in semiconductor devices and fabricating method thereof |
| 02/29/2000 | US6030855 Self-aligned connector for stacked chip module |
| 02/29/2000 | US6029344 Composite interconnection element for microelectronic components, and method of making same |
| 02/24/2000 | WO2000010203A1 Combination positive temperature coefficient resistor and metal-oxide semiconductor field-effect transistor devices |
| 02/23/2000 | EP0980586A1 Power semiconductor module with ceramic substrate |
| 02/22/2000 | US6028497 RF pin grid array |
| 02/22/2000 | US6028365 Integrated circuit package and method of fabrication |
| 02/22/2000 | US6028358 Package for a semiconductor device and a semiconductor device |
| 02/22/2000 | US6028352 IC stack utilizing secondary leadframes |
| 02/22/2000 | US6027958 Transferred flexible integrated circuit |
| 02/22/2000 | US6027952 Method of manufacturing a string of electrically connected light emitting diodes |
| 02/17/2000 | WO2000008430A1 Method for measuring the temperature of a power semiconductor and component with such a semiconductor |
| 02/17/2000 | WO1999063527A3 Data storage and processing apparatus, and method for fabricating the same |
| 02/17/2000 | DE19935803A1 Semiconductor switching installation with integrated current bus has bottom side mechanically connected to heat dissipation device |
| 02/17/2000 | DE19835453A1 Verfahren zum Messen der Temperatur eines Leistungshalbleiters und Bauelement A method for measuring the temperature of a power semiconductor component and |
| 02/17/2000 | DE19835265A1 Electronics power component esp. low-resistance field-effect transistor and integrated circuit |
| 02/16/2000 | EP0980099A1 Multichip module |
| 02/16/2000 | CN1244935A 芯片卡模块 Chip Card Module |
| 02/16/2000 | CN1244832A Injection molding encapsulation for an electronic device directly onto a substrate |
| 02/15/2000 | US6025995 Integrated circuit module and method |
| 02/15/2000 | US6025651 Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads |
| 02/15/2000 | US6025648 Shock resistant semiconductor device and method for producing same |
| 02/15/2000 | US6025642 Ultra high density integrated circuit packages |
| 02/15/2000 | US6025638 Structure for precision multichip assembly |
| 02/10/2000 | WO2000007242A1 Conductor frame, printed circuit board with a conductor frame and a method for producing a conductor frame |
| 02/10/2000 | WO2000007240A1 Three-dimensional packaging technology for multi-layered integrated circuits |
| 02/10/2000 | DE19924934A1 Surface mountable electronic package for high frequency digital applications |
| 02/10/2000 | DE19915065A1 Semiconductor module with improved heat dissipation; has power component and control component chip on fastening face of carrier |
| 02/10/2000 | CA2338335A1 Three-dimensional packaging technology for multi-layered integrated circuits |
| 02/09/2000 | CN1244027A Method for transferring miniature machined block including integrated circuits |
| 02/08/2000 | US6023097 Stacked multiple-chip module micro ball grid array packaging |
| 02/08/2000 | US6022759 Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit |
| 02/03/2000 | WO2000005758A1 Electronic component and method for the production thereof |
| 02/03/2000 | DE19935804A1 Encapsulated chip, especially an encapsulated integrated millimeter wave circuit, comprises interconnectors on a substrate-mountable base having wave-guide openings |
| 02/02/2000 | EP0976161A1 Optoelectronic semiconductor diodes and devices comprising same |
| 02/02/2000 | EP0976155A1 High-voltage, high-current multilayer circuit board, method for the production thereof |
| 02/02/2000 | EP0975472A1 Three dimensional structure memory |
| 02/01/2000 | US6020633 Integrated circuit packaged for receiving another integrated circuit |
| 02/01/2000 | US6020629 Stacked semiconductor package and method of fabrication |
| 02/01/2000 | US6020597 Repairable multichip module |
| 02/01/2000 | US6020593 Opsistor transmitter data compression system |
| 01/27/2000 | DE19928075A1 Dynamic random access memory module |
| 01/27/2000 | DE19833039A1 Opto-electronic components encapsulated in transparent plastic to make e.g. displays, are rear-injected individually through holes in substrate to prevent undesirable segment cross-illumination |
| 01/26/2000 | CN1242637A Electric power conversion means |
| 01/25/2000 | US6018462 Multi-tip module |
| 01/25/2000 | US6018191 Semiconductor device |
| 01/25/2000 | CA2161569C Circuit element mounting structure |
| 01/20/2000 | WO1999036959A9 High-density computer modules with stacked parallel-plane packaging |
| 01/19/2000 | EP0972344A1 Fpga repeatable interconnect structure |
| 01/19/2000 | EP0972307A4 Multi-chip device and method of fabrication employing leads over and under processes |
| 01/19/2000 | EP0972307A1 Multi-chip device and method of fabrication employing leads over and under processes |
| 01/19/2000 | EP0972301A1 Manufacturing a heterobipolar transistor and a laser diode on the same substrate |
| 01/19/2000 | CN1242106A Bump-bonded semiconductor imaging device |
| 01/18/2000 | US6016256 Multi-chip module having interconnect dies |
| 01/13/2000 | WO2000002258A1 Large area x-ray imager with vented seam and method of fabrication |
| 01/13/2000 | WO2000002246A1 Double-sided electronic device |
| 01/13/2000 | DE19931784A1 Semiconductor substrate for electronic circuit elements |
| 01/13/2000 | DE19830540A1 Electronic flexible type circuit board especially for power semiconductors, sensors and passive components |
| 01/13/2000 | DE19830424A1 Formteil zur Halterung von Kühlkörpern in einem Spannstapel Molding for mounting heat sinks in a chip stack |
| 01/13/2000 | CA2336378A1 Large area x-ray imager with vented seam and method of fabrication |
| 01/12/2000 | EP0971412A2 Power Semiconductor with Attachable Protection Circuit |
| 01/12/2000 | EP0971408A2 Molded Part Holding a Heatsink in a Press Stack |