Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
05/2014
05/08/2014US20140124953 Multi-chip semiconductor apparatus
05/08/2014US20140124890 Semiconductor Package Having Multi-Phase Power Inverter with Internal Temperature Sensor
05/08/2014US20140124823 Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
05/08/2014US20140124026 Solar cell device
05/08/2014DE202014001943U1 LED-Streifen, Lampe LED strip light
05/08/2014DE112012003296T5 Halbleitermodul, Halbleitervorrichtung mit dem Halbleitermodul und Verfahren zur Herstellung des Halbleitermoduls A semiconductor module, the semiconductor device with the semiconductor module and method for manufacturing the semiconductor module
05/08/2014DE102013221954A1 Halbleitereinheit Semiconductor unit
05/08/2014DE102013111581A1 Halbleiterpackages mit integrierter Antenne und Verfahren zu deren Herstellung Semiconductor packages with an integrated antenna and processes for their preparation
05/08/2014DE102013018381A1 Ohne Lotmaske definierte Kupferanschlussflächen und eingebettete Kupferanschlussflächen zur Reduzierung der Gehäusesystemhöhe Without solder mask defined pads and embedded copper copper pads to reduce the housing system height
05/08/2014DE102013018192A1 Vergrabene, für Entkopplungskondensatoren verwendete TSV Buried, used for decoupling capacitors TSV
05/08/2014DE102012019669A1 Method for producing white light color in candle lamp, involves positioning LED-chips having low and high color temperatures and high red and blue portions together on carrier medium in any arrangement, and placing LED-chips in tension
05/08/2014DE102008064789B3 Harzabgedichtete Halbleitervorrichtung Harzabgedichtete semiconductor device
05/08/2014DE102008003670B4 Lichtquelle mit mehreren LED-Chips Light source with a plurality of LED chips
05/08/2014DE102007012154B4 Halbleitermodul mit Halbleiterchips und Verfahren zur Herstellung desselben The same semiconductor module with a semiconductor chip and method for producing
05/07/2014EP2728968A1 Wireless power supply-type light-emitting element, and light-emitting device
05/07/2014EP2728618A1 Semiconductor device
05/07/2014EP2728617A1 Semiconductor power converter and method of manufacturing the same
05/07/2014EP2728616A1 Circuit board for peripheral circuit in high-capacity module and high-capacity module including peripheral circuit using circuit board
05/07/2014EP2728615A1 Semiconductor device and method for manufacturing semiconductor device
05/07/2014EP2727146A1 A method of making a system-in-package device, and a system-in-package device
05/07/2014EP2727143A1 Heat sink for cooling of power semiconductor modules
05/07/2014EP2726784A1 Luminaire with a potting compound
05/07/2014EP2726780A1 Light guide
05/07/2014EP2726775A1 Lighting module for a modular lighting system
05/07/2014CN203590187U 一种用于固态复合开关装置的模块化晶闸管阀组 A solid-state complex modular thyristor valve switching device
05/07/2014CN203589024U 一种大功率uvled的垂直芯片集成模块 One kind of power uvled vertical chip module
05/07/2014CN203589023U 一种大功率uvled的芯片集成模块 One kind of high-power chip integration module uvled
05/07/2014CN203589022U 一种新型led封装结构 A new structure led package
05/07/2014CN203589021U 一种360度透光led灯丝 One kind of translucent led filament 360
05/07/2014CN203589020U 一种led显示装置 One kind of led display device
05/07/2014CN203589019U 组合led节能灯封装 Combination led energy saving light package
05/07/2014CN203589018U 发光二极管支架及其灯具 Light-emitting diode and lamp holder
05/07/2014CN203589017U 照明装置 Lighting device
05/07/2014CN203589014U 一种带有支撑保护结构的封装结构 A support package with a protective structure
05/07/2014CN203589007U 一种基于框架的多器件smt扁平封装件 A framework is based on a multi-device smt flat package
05/07/2014CN1964077B 电容器及其制造方法、以及包含该电容器的半导体器件 Capacitor and a manufacturing method and a semiconductor device comprising the capacitor
05/07/2014CN103782401A 半导体发光器件及其制造方法 The semiconductor light emitting device and its manufacturing method
05/07/2014CN103782384A 改进的发光二极管照明系统和/或其制造方法 Improved LED lighting system and / or method of manufacture
05/07/2014CN103782383A 偏差补偿的多晶片封装 Deviation Compensation multi-chip package
05/07/2014CN103782380A 半导体模块 Semiconductor Modules
05/07/2014CN103782379A 半导体模块，电路基板 The semiconductor module, the circuit board
05/07/2014CN103780102A 一种智能半导体功率模块 An intelligent semiconductor power module
05/07/2014CN103779348A 一种平板式功率半导体模块 A flat-type power semiconductor module
05/07/2014CN103779347A 高亮度可调光cob光源、射灯及日光灯cob工艺 High brightness dimmable cob light, spotlights and fluorescent cob craft
05/07/2014CN103779346A 一种近紫外或紫光激发的led发光装置 A UV or violet excitation light emitting device led nearly
05/07/2014CN103779345A Led组件的芯片电极连接结构 Led chip electrode assembly connected to the structure
05/07/2014CN103779344A 一种功率模块封装结构 A power module package structure
05/07/2014CN103779343A 功率半导体模块 Power semiconductor module
05/07/2014CN103779342A 一种功率半导体模块 A power semiconductor module
05/07/2014CN103779341A 一种大功率半桥模块 One kind of high-power half-bridge module
05/07/2014CN103779340A 半导体器件和制造半导体器件的方法 The method of manufacturing a semiconductor device and a semiconductor device
05/07/2014CN103779339A 功率半导体模块 Power semiconductor module
05/07/2014CN103779338A 电子设备和半导体器件 Electronic device and a semiconductor device
05/07/2014CN103779337A 包括磁耦合单片集成线圈的半导体器件 A semiconductor device comprising a monolithic integrated magnetically coupled coils
05/07/2014CN103779315A 一种散热一体化功率模块的封装结构 A package structure integrated power module cooling
05/07/2014CN103779303A 凸点式封装及其形成方法 Bump package and method of forming
05/07/2014CN103779300A 封装基板及芯片封装构件 Package substrate and chip packaging member
05/07/2014CN103779295A 功率模块封装 Power Module Package
05/07/2014CN103779293A 一种小功率绝缘栅双极性晶体管全桥模块 A small-power insulated gate bipolar transistor full bridge modules
05/07/2014CN103779239A 一种智能功率模块的制造方法及智能功率模块 An intelligent power module manufacturing method and intelligent power module
05/07/2014CN103778966A 堆叠芯片模块及其制造和维修方法 Stacked chip module and its manufacturing and repair methods
05/07/2014CN103769764A 一种软钎焊的焊片和功率模块组装结构 A soft soldering lug and power module assembly structure
05/07/2014CN102610730B 发光二极管封装结构及其制造方法 Light emitting diode package structure and manufacturing method
05/07/2014CN102376592B 芯片尺寸封装件及其制法 Chip size package Jiqizhifa
05/07/2014CN102272904B 制造沟道式电容器的方法 The method of manufacturing a trench capacitor
05/07/2014CN102157502B 系统级封装结构 System level package structure
05/07/2014CN102149960B 用于普通照明的集成led基照明器 Integrated led group luminaire for general illumination
05/07/2014CN102005453B 三维结构存储器 Three-dimensional structure of the memory
05/07/2014CN101728369B 表面可安装的集成电路封装方法 The method of the surface mountable integrated circuit package of
05/07/2014CN101521183B 半导体发光器件及其制造方法 The semiconductor light emitting device and its manufacturing method
05/06/2014US8717772 Printed circuit board
05/06/2014US8717765 Integrated-inverter electric compressor and inverter unit thereof
05/06/2014US8716872 Stacked semiconductor package including connections electrically connecting first and second semiconductor packages
05/06/2014US8716742 Light emitting device for AC operation
05/06/2014US8716722 Photosensor chip package structure
05/01/2014WO2014066153A1 Multiple die stacking for two or more die
05/01/2014WO2014065278A1 Semiconductor-element manufacturing method
05/01/2014WO2014065124A1 Semiconductor device, and electronic device
05/01/2014WO2014065038A1 Semiconductor device and method for manufacturing same
05/01/2014WO2014063976A1 Light-emitting diode module
05/01/2014WO2014063974A1 Substrate for lighting device having bounding structure for contact surface
05/01/2014WO2014063637A1 Cob led module and manufacturing method thereof
05/01/2014US20140120667 Beol structures incorporating active devices and mechanical strength
05/01/2014US20140117564 Interconnect Structures for Substrate
05/01/2014US20140117541 Semiconductor device and manufacturing method thereof
05/01/2014US20140117526 Semiconductor power converter and method of manufacturing the same
05/01/2014US20140117518 Control and Driver Circuits on a Power Quad Flat No-Lead (PQFN) Leadframe
05/01/2014US20140117500 Implementing decoupling devices inside a tsv dram stack
05/01/2014US20140117495 Switch circuit package module
05/01/2014US20140117457 Beol structures incorporating active devices and mechanical strength
05/01/2014US20140117430 Semiconductor package
04/2014
04/30/2014EP2725699A1 Power semiconductor module and electric power conversion device using same
04/30/2014EP2725631A1 Method of manufacturing LED assembly using liquid molding technologies and a LED assembly
04/30/2014EP2725614A2 Light emitting device package
04/30/2014EP2725613A1 An LED having two pins that handle contingencies of open, static electricity, and surge
04/30/2014EP2725610A1 Semiconductor device and method for producing semiconductor device
04/30/2014EP2725609A1 Semiconductor module
04/30/2014EP2724544A1 Autostereoscopic display apparatus having optical magnification
04/30/2014EP2724371A1 Integrated circuit design using through silicon vias
04/30/2014EP2724370A1 Methods and arrangements relating to semiconductor packages including multi-memory dies
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