Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
05/2014
05/21/2014CN203607407U 可调色温的白光led结构 Adjustable color temperature white led structure
05/21/2014CN203607406U 集成封装式led光源 Integrated packaged led light
05/21/2014CN203607405U 发光装置、发光装置集合体以及带有电极的基板 A light emitting device, a light emitting device and a substrate having an electrode assembly
05/21/2014CN203607404U 发光装置、发光装置集合体以及带有电极的基板 A light emitting device, a light emitting device and a substrate having an electrode assembly
05/21/2014CN203607403U 高压led集成封装光源及高压led灯具 High-pressure and high-pressure light led integrated package led lamps
05/21/2014CN203607402U 一种高亮度集成led封装结构 A high-brightness led package integrated structure
05/21/2014CN203607401U 一种点式矩阵led集成封装结构 One kind of dot matrix led integrated package structure
05/21/2014CN203607400U 显指可调双晶大功率led CRI tunable double-crystal power led
05/21/2014CN203607399U 一种新型白光led结构 A new white led structure
05/21/2014CN203607398U 一种高显色性白光led结构 A high-color rendering white led structure
05/21/2014CN203607397U 一种功率单管集成封装模块 A power single-tube integrated package module
05/21/2014CN203607396U 一种可拆卸、可组装的SiP封装结构 One kind of removable, assembled SiP package structure
05/21/2014CN203607395U 一种可拆卸、可组装的SiP封装结构的连接器初始件 A disengageable, the connector can be assembled package SiP initial member
05/21/2014CN203607394U 功率集成模块 Power Integration Module
05/21/2014CN203607392U 器件安装结构和集成电路模块 Device mounting structure and the integrated circuit module
05/21/2014CN103814443A 用于吸收式制冷器的倾斜监测器及压力控制器 Tilt the monitor for the absorption chiller and the pressure controller
05/21/2014CN103811635A 一种软基板光源模组及其制造方法 A soft substrate and method for manufacturing the light source module
05/21/2014CN103811480A 具有感应装置的载板封装结构及制作方法 Carrier package structure and method of preparing a sensor device
05/21/2014CN103811479A 一种led光源模块的封装方法 An encapsulation method led light source module
05/21/2014CN103811478A 印刷式led集成cob封装 Printing style led integrated cob package
05/21/2014CN103811477A 半导体单元 Semiconductor unit
05/21/2014CN103811476A 半导体器件 Semiconductor devices
05/21/2014CN103811475A 具有背对背内嵌半导体元件及内建定位件的半导体组体板 Embedded semiconductor element having a back to back and built-in spacer plate semiconductor group
05/21/2014CN103811474A 半导体器件、半导体器件的制造方法及天线开关模块 The method of manufacturing a semiconductor device, the semiconductor device and the antenna switch module
05/21/2014CN103811470A 电路模块 Circuit module
05/21/2014CN103811457A 多芯片sop封装结构 Multi-chip package structure sop
05/21/2014CN103811454A 使用引线框架的磁耦合电流隔离式通信 Use leadframe magnetic coupling galvanically isolated communication
05/21/2014CN102610598B 一种高亮高密高对比度全户外led灯 One kind of highlight-density high-contrast full-outdoor led lights
05/21/2014CN102386308B 发光装置和发光装置的制造方法 The method of manufacturing a light emitting device and a light emitting device
05/21/2014CN102315184B 半导体器件 Semiconductor devices
05/21/2014CN102122623B 一种换流阀晶闸管压装机构 One kind of converter valve thyristor press-fit mechanism
05/20/2014USRE44903 Lighting devices using a plurality of light sources
05/20/2014US8729690 Assembly having stacked die mounted on substrate
05/20/2014US8729687 Stackable integrated circuit package system
05/20/2014US8729571 Multiple die LED and lens optical system
05/20/2014US8728870 Thin film silicon wafer and method for manufacturing the same
05/15/2014WO2014075001A1 Led spirit system and manufacturing method
05/15/2014WO2014074933A2 Microelectronic assembly with thermally and electrically conductive underfill
05/15/2014WO2014073311A1 Semiconductor device
05/15/2014WO2014072871A1 Light emitting device including a filter and a protective layer
05/15/2014WO2014072865A1 Wavelength converted light emitting device
05/15/2014WO2013178529A3 Network of electronic devices assembled on a flexible support and communication method
05/15/2014WO2013052372A8 Stub minimization for multi-die wirebond assemblies with parallel windows
05/15/2014US20140134950 Vertical System Integration
05/15/2014US20140134802 Chip-on-Wafer Structures and Methods for Forming the Same
05/15/2014US20140134798 Semiconductor package and method of manufacturing the same
05/15/2014US20140131895 Memory module and memory system
05/15/2014US20140131891 Semiconductor device and process for fabricating the same
05/15/2014US20140131870 Multi-chip package and manufacturing method
05/15/2014US20140131864 Connector Design for Packaging Integrated Circuits
05/15/2014US20140131849 Stacked chip-on-board module with edge connector
05/15/2014US20140131755 Micro-reflectors on a substrate for high-density led array
05/15/2014US20140131747 Packaging Photon Building Blocks Having Only Top Side Connections In A Molded Interconnect Structure
05/15/2014US20140131549 Through silicon optical interconnects
05/15/2014DE102013112589A1 System und Verfahren für ein elektronisches Gehäuse mit einem Ausfallöffnungsmechanismus System and method for an electronic housing having a discharge opening mechanism
05/15/2014DE102013112214A1 System und Verfahren zum Entwerfen eines Halbleiter-Packages unter Verwendung eines Computersystems, Vorrichtung zur Herstellung eines Halbleiter-Packages das System umfassend, und mit dem Verfahren entworfenes Halbleiter-Package System and method for designing a semiconductor package using a computer system, apparatus for manufacturing a semiconductor package comprising the system, and designed by the method of semiconductor package
05/15/2014DE102013104081B3 3-Level-Stromrichterhalbbrücke 3-level inverter half bridge
05/15/2014DE102013018601A1 Verbesserung des thermischen Verhaltens eines Logikchips in einer Gehäuse-auf-Gehäuse-Struktur Enhance the thermal performance of a logic chip in a case-to-case structure
05/15/2014DE102013018599A1 Verfahren zur Einbettung eines CPU/GPU/LOGIC-Chips in ein Substrat einer Gehäuse-auf-Gehäuse-Struktur A method for embedding a CPU / GPU / LOGIC chips in a substrate of a case-to-case structure
05/15/2014DE102010055935B4 Verfahren zum Verbinden mehrerer ungehäuster Substrate A method for connecting a plurality of bare substrates
05/15/2014DE102009042319B9 Verfahren zur Herstellung eines Sensorknoten-Moduls A method for producing a sensor node module
05/15/2014DE102009009874B4 Elektronikbauelement mit einem Halbleiterchip und mehreren Zuleitungen Electronic component having a semiconductor chip and a plurality of feed lines
05/14/2014EP2731134A1 Multi-chip module connection by way of bridging blocks
05/14/2014EP2731132A2 Package structure and method of forming the same
05/14/2014EP2730035A2 Ehf communication with electrical isolation and with dielectric transmission medium
05/14/2014EP2729964A1 Short-circuit failure mode with multiple device breakdown
05/14/2014DE202014003171U1 Leistungshalbleitermodul The power semiconductor module
05/14/2014CN203596366U 一种易于加工的led模组结构 An easy processing led module structure
05/14/2014CN203596351U 一种led-cob光源 One kind of led-cob light
05/14/2014CN203596350U 一种条形led模组的结构 A strip led module structure
05/14/2014CN203596349U 一种多用型led A multi-use led
05/14/2014CN203596348U 桥堆生产用矩阵式料带 Bridge reactor used in the production of matrix material belt
05/14/2014CN203596347U 高速同轴光电探测组件 High-speed coaxial optical detection assembly
05/14/2014CN203596346U 多芯片无引线组件 Multichip leadless components
05/14/2014CN203596343U 无引线片式混合集成电路陶瓷管壳 Leadless ceramic chip hybrid integrated shell
05/14/2014CN103797578A 封装中的存储器模块 The memory module in the package
05/14/2014CN103797577A 模块制造方法及端子集合体 Module manufacturing method and terminal assembly
05/14/2014CN103797574A 封装中的存储器模块 The memory module in the package
05/14/2014CN103794710A Led 面光源模块及其制作方法 Led surface light source module and its manufacturing method
05/14/2014CN103794604A 一体式功率半导体模块 Integrated power semiconductor module
05/14/2014CN103794603A 免封装uvled固化光源模组 Free Package uvled curing light module
05/14/2014CN103794602A 一种全方位出光的高效led模组器件 A holistic and efficient light led module devices
05/14/2014CN103794601A 插接式led荧光晶体片及其制备方法与led灯泡 Plug-led fluorescent crystal pieces and preparation method and led bulb
05/14/2014CN103794600A 高显色指数led均匀光源 High color rendering index led uniform light source
05/14/2014CN103794591A 半导体器件 Semiconductor devices
05/14/2014CN103794590A 功率模块封装 Power Module Package
05/14/2014CN102334186B 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/14/2014CN102034802B 标准芯片尺寸封装的结构和方法 Structures and methods standard chip size package
05/13/2014US8723015 Photoelectric conversion device, image display, method of manufacturing photoelectric conversion device, and method of manufacturing image display
05/13/2014US8722450 Method for manufacturing improved solar cell module
05/08/2014WO2014069406A1 Semiconductor device
05/08/2014WO2014068937A1 Semiconductor module
05/08/2014WO2014068936A1 Semiconductor module
05/08/2014WO2014068935A1 Semiconductor module
05/08/2014WO2014067717A1 Light-emitting diode arrangement, module, and method for producing a light-emitting diode arrangement
05/08/2014WO2014067716A1 Led light system
05/08/2014WO2014067286A1 Ultrathin miniature bridge rectifier
05/08/2014WO2014043316A3 Hybrid on-chip and package antenna
05/08/2014US20140124961 Techniques and configurations for recessed semiconductor substrates
05/08/2014US20140124959 Memory device, laminated semiconductor substrate and method of manufacturing the same
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