Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
05/2014
05/29/2014US20140147970 Semiconductor device using emc wafer support system and fabricating method thereof
05/29/2014US20140145352 Semiconductor packages and electronic systems including the same
05/29/2014US20140145348 Rf (radio frequency) module and method of maufacturing the same
05/28/2014EP2735025A1 Optoelectronic module comprising a lens system
05/28/2014EP2735024A1 Improved led lighting systems and/or methods of making the same
05/28/2014EP2735023A1 Optoelectronic module with improved optical system
05/28/2014DE112006002488B4 Halbleiter-Baueinheit Semiconductor package
05/28/2014DE102013223500A1 Hochfrequenzvorrichtung The high frequency apparatus
05/28/2014DE102012111458A1 Halbleitervorrichtung Semiconductor device
05/28/2014DE102011013228B4 Verfahren zur Herstellung eines Halbleiterbauelements für 3D-Integration A process for producing a semiconductor device for 3D integration
05/28/2014CN203617297U 一种led模组的结构 Structure for a led module
05/28/2014CN203617296U 覆晶式发光二极管单元 Flip-chip LED unit
05/28/2014CN203617295U 一种led光源器件 One kind of led light source device
05/28/2014CN203617294U 一种大功率白光led One kind of high-power white led
05/28/2014CN203617293U 用于整流电路的二极管模组组件 Diode rectifier circuit module assembly for
05/28/2014CN203617292U 薄膜太阳能电池组件 Thin-film solar cell module
05/28/2014CN203617265U 一种功率半导体模块 A power semiconductor module
05/28/2014CN103828053A 半导体发光器件和发光模块 The semiconductor light emitting device and a light emitting module
05/28/2014CN103828045A Led模块 Led Module
05/28/2014CN103828044A 半导体器件 Semiconductor devices
05/28/2014CN103828043A 模块的制造方法及模块 Manufacturing method and module module
05/28/2014CN103828042A 具有改进的光学系统的光电子模块 Optoelectronic module having an improved optical system
05/28/2014CN103828040A 散热结构体、功率模块、散热结构体的制造方法以及功率模块的制造方法 The method of manufacturing heat dissipation structure, the power module, the method for manufacturing a heat dissipation structure, and the power module
05/28/2014CN103827353A 由承载膜和包括由至少一种金属粉末制成的可烧结的层和焊接层的层组件组成的复合层 By the carrier film and comprises a layer component layer and the solder layer can be a sintered metal powder prepared from at least one composite layer consisting of
05/28/2014CN103824925A 一种全透光式led封装结构及其封装工艺 A fully transmissive led package structure and packaging technology
05/28/2014CN103824853A 应用于开关型调节器的集成电路组件 Applied to the switching regulator IC components
05/28/2014CN103824852A 嵌入裸芯片背光源结构 Embed die backlight structure
05/28/2014CN103824851A Led灯条封装结构及其封装方法 Led light bar package and packaging method
05/28/2014CN103824850A 一种薄壁陶瓷透镜封装的led光源 One kind of thin-walled ceramic lens package led light
05/28/2014CN103824849A 一种具有强化出光结构的多led芯片封装器件及其制造方法 An enhanced light led chip package structure of a multi-device and its manufacturing method
05/28/2014CN103824848A Led 显示屏及其制作方法 Led display and production methods
05/28/2014CN103824847A 发光装置 Light-emitting device
05/28/2014CN103824846A 一种多场效晶体管集成模块 A multi-field effect transistor integrated module
05/28/2014CN103824845A 半导体装置 Semiconductor device
05/28/2014CN103824844A 功率半导体模块及其制造方法 The power semiconductor module and the manufacturing method
05/28/2014CN103824843A 通过桥接块的多芯片模块连接 A multi-chip module are connected by bridging block
05/28/2014CN103824842A 集成电路、半导体管芯布置以及用于制造集成电路的方法 An integrated circuit, a semiconductor die and a method of manufacturing an integrated circuit arrangement for
05/28/2014CN103824841A 用连接片实现连接的半导体封装 Realization of a semiconductor package is connected with the connecting piece
05/28/2014CN103824836A 半导体承载元件及半导体封装件 Carrying a semiconductor element and semiconductor package
05/28/2014CN102625539B 一种基于以太网接口的可级联景观照明控制系统与方法 Cascadable landscape lighting control system and method based on the Ethernet interface
05/28/2014CN102468263B 具有分布式电源的集成电路系统 IC system with distributed power
05/28/2014CN101930960B 集成电路芯片封装和形成方法 And a method of forming an integrated circuit chip package
05/28/2014CN101884104B 感光性粘接剂 The photosensitive adhesive
05/28/2014CN101843181B 内置元件电路板 Built-element circuit board
05/27/2014US8736303 PSOC architecture
05/27/2014US8736302 Reconfigurable integrated circuit
05/27/2014US8736301 System on chip and control module therefor
05/27/2014US8736296 Stacked semiconductor apparatus with configurable vertical I/O
05/27/2014US8736075 Semiconductor chip module, semiconductor package having the same and package module
05/27/2014US8736068 Hybrid bonding techniques for multi-layer semiconductor stacks
05/27/2014US8736043 Power device having a specific range of distances between collector and emitter electrodes
05/27/2014US8736035 Semiconductor package and method of forming the same
05/27/2014US8735918 Light-emitting device having light-emitting elements with polygonal shape
05/27/2014US8735917 Light emitting device array
05/27/2014US8735911 Light emitting device having shared electrodes
05/27/2014US8735189 Flip light emitting diode chip and method of fabricating the same
05/27/2014US8735180 Multiple-points measurement
05/27/2014CA2633368C Semiconductor module for light reception or light emission
05/22/2014WO2014078485A1 Through silicon optical interconnects
05/22/2014WO2014078256A1 Side-viewing multi-colour led device
05/22/2014WO2014077980A1 Three-dimensional flash memory system
05/22/2014WO2014077154A1 Semiconductor device
05/22/2014WO2014039833A3 Integrated led based illumination device
05/22/2014US20140141566 Multi-chip package with pillar connection
05/22/2014US20140141544 Packaged microelectronic components
05/22/2014US20140139271 Integrated circuit having stack structure
05/22/2014US20140138853 Wafer level packaging bond
05/22/2014US20140138852 Semiconductor device and method for producing the same
05/22/2014US20140138851 Semiconductor memory chips and stack-type semiconductor packages including the same
05/22/2014US20140138847 Method for electrically connecting wafers using butting contact structure and semiconductor device fabricated through the same
05/22/2014US20140138827 Enhanced flip chip package
05/22/2014US20140138826 High-Density Package-on-Package Structure
05/22/2014US20140138815 Server processing module
05/22/2014US20140138812 Photoelectric module
05/22/2014US20140138715 Light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
05/22/2014US20140138707 Power semiconductor module
05/22/2014DE102013223846A1 Logikchip und andere in Aufbauschichten eingebettete Komponenten Logic chip and embedded in pavement layers components
05/22/2014DE102013112636A1 Integrierte schaltung, halbleiternacktchipanordnung und verfahren zum herstellen einer integrierten schaltung Integrated circuit, semiconductor chip assembly naked and process for the manufacture of an integrated circuit
05/22/2014DE102013108782A1 Light-emitting device, e.g., back light module for LCD, has carrier which is arranged to carry first light-emitting unit in which difference between first dominant wavelength and second dominant wavelength is five to thirty nanometers
05/22/2014DE102013106988A1 Kompaktes Gehäusesystem für ICs Compact housing system for ICs
05/22/2014DE102013103866B3 Leistungshalbleitereinrichtung Power semiconductor device
05/22/2014DE102013018914A1 Server-Verarbeitungsmodul Server processing module
05/22/2014DE102012221250A1 Lighting apparatus e.g. LED lighting apparatus has support plate that is provided with two adjacent portions which are fixed with semiconductor light sources and connected by bonding wire, and notch formed between adjacent portions
05/22/2014DE102012221230A1 Leuchtvorrichtung mit Lichterzeugungseinheit und Elektronikplatine auf Träger Lighting apparatus with light generating unit and electronic board to support
05/22/2014DE102012221229A1 Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe The optoelectronic assembly and method of making an optoelectronic assembly
05/22/2014DE102012111065A1 Optoelectronic component e.g. LED, has phosphor element provided to convert the blue light into red light of specific wavelength range, and phosphor-free element placed in optical path of semiconductor portion
05/22/2014DE102007017733B4 Kühlmechanismus für Stapelchip-Packung und Verfahren zur Herstellung einer Stapelchip-Packung, die diesen enthält Cooling mechanism for stacking chip package and method of manufacturing a stack chip package that includes that
05/21/2014EP2733754A2 Light-emitting module
05/21/2014EP2733744A1 Light emitting element comprising a plurality of vertical-type LEDs connected in series on the same carrier substrate
05/21/2014EP2733743A1 Power semiconductor module
05/21/2014EP2733729A2 Semiconductor device and method for producing the same
05/21/2014EP2732466A1 De-skewed multi-die packages
05/21/2014EP2732465A2 Memory module in a package
05/21/2014EP2732463A2 Memory module in a package
05/21/2014CN203607458U Led灯珠 Led lamp beads
05/21/2014CN203607455U 双面贴合式360度发光的led器件 360 double-sided conformable glowing led device
05/21/2014CN203607452U 一种白光数码管 One kind of white digital
05/21/2014CN203607410U 集成led激光源装置 Integration led laser source means
05/21/2014CN203607409U 3d集成式led光源模块 3d integrated led light module
05/21/2014CN203607408U 高压led多点封装光源及高压led灯具 High pressure led multi-point light source and high voltage led lighting package
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