Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
06/2014
06/11/2014CN103855285A Light source module with flexible substrate and manufacturing method thereof
06/11/2014CN103855273A LED lamp substrate and manufacturing process thereof
06/11/2014CN103855149A Inverted high-voltage light-emitting diode and manufacturing method thereof
06/11/2014CN103855148A Led filament and lighting device
06/11/2014CN103855147A LED lamp filament and lamp
06/11/2014CN103855146A Led filament and lighting device
06/11/2014CN103855145A LED lamp filament and illumination device
06/11/2014CN103855144A LED filament and light-emitting device
06/11/2014CN103855143A LED lamp filament and light-emitting device
06/11/2014CN103855142A Light emitting device and luminaire
06/11/2014CN103855141A Light-emitting diode element, light-emitting diode module, and manufacturing method of light-emitting diode element
06/11/2014CN103855140A Partial SOI on power device for breakdown voltage improvement
06/11/2014CN103855139A Sheet-type difference composite tube
06/11/2014CN103855138A Semiconductor package and method for manufacturing the same
06/11/2014CN103855137A Semiconductor device
06/11/2014CN103855136A Semiconductor apparatus and electronic apparatus
06/11/2014CN103855135A Three dimensional through-silicon via construction
06/11/2014CN103855134A Apparatus including a semiconductor device coupled to a decoupling device
06/11/2014CN103855120A Multichip package and fabrication method thereof
06/11/2014CN103855117A Semiconductor device including a redistribution layer and metallic pillars coupled thereof
06/11/2014CN103855114A Methods and apparatus for package with interposers
06/11/2014CN102610600B High-power white light emitting diode (LED) module encapsulated by nano silver solder paste and encapsulation method of high-power white light emitting diode module
06/11/2014CN102365738B Assembly of optoelectronic components
06/11/2014CN102215618B LED (light emitting diode) street lamp driving circuit capable of regulating output illuminance automatically
06/11/2014CN102016409B Waterproof LED beacon light
06/11/2014CN101997077B Light emitting module
06/10/2014US8749302 Semiconductor integrated circuit apparatus having I/O signal line
06/10/2014US8749077 Three-dimensional integrated circuit (3DIC)
06/10/2014US8748311 Microelectronic devices and methods for filing vias in microelectronic devices
06/10/2014US8747707 Paste for solar cell electrode and solar cell using the same
06/05/2014WO2014085564A1 Route-based substance analysis system and method
06/05/2014WO2014083974A1 Semiconductor-device manufacturing method
06/05/2014WO2014083717A1 Power module
06/05/2014WO2014082809A1 Semiconductor device
06/05/2014US20140154840 Chip package and method for forming the same
06/05/2014US20140154839 Method of manufacturing chip-stacked semiconductor package
06/05/2014US20140152512 Antenna using through-silicon via
06/05/2014US20140152384 Transmission line for an integrated circuit package
06/05/2014US20140152350 Integrated Circuits Including Magnetic Devices, And Associated Methods
06/05/2014US20140151882 Three-dimensional integrated circuit having stabilization structure for power supply voltage, and method for manufacturing same
06/05/2014US20140151880 Package-on-package structures
06/05/2014US20140151697 Semiconductor Packages, Systems, and Methods of Formation Thereof
06/05/2014DE102013113558A1 Eingebettetes chipgehäuse, chipgehäuse und verfahren zur herstellung eines eingebetteten chipgehäuses Embedded chip packages, chip packages and methods for manufacturing of an embedded chip package
06/05/2014DE102013019513A1 Dreidimensionaler aufbau von siliziumdurchführungen Three-dimensional construction of silicon grommets
06/05/2014DE102012222093A1 Lighting device e.g. LED module has conversion transparent protective cover which is covered on light-emitting surface in which translucent diffusing layer is arranged with translucent matrix material having scattering particles
06/05/2014DE102012222011A1 Leistungshalbleitermodulsystem Power semiconductor module system
06/05/2014DE102011075921B4 Mittels Klemmkeil und Gegenkeil elektrisch anschließbares Leistungshalbeiitermodul und Leistungshalbleitermodulsystem mit einem solchen Leistungshalbleitermodul By means of clamping wedge and counter-wedge electrically connectable Leistungshalbeiitermodul and power semiconductor module system with such a power semiconductor module
06/05/2014DE102010000539B4 Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device
06/04/2014EP2738808A1 Semiconductor device and method for producing a semiconductor device
06/04/2014CN203631598U 一种长条形led光源 A long-strip led light
06/04/2014CN203631596U 一种新型rgb 全彩发光二极管 A new full-color light emitting diode rgb
06/04/2014CN203631592U 一种垂直的led封装结构及led灯条 The vertical structure of led package and led lights
06/04/2014CN203631591U 一种垂直的led灯条 The vertical strip led lights
06/04/2014CN203631590U 一种垂直的led灯条 The vertical strip led lights
06/04/2014CN203631549U 一种色温可调节的功率型cob集成封装结构 Power type cob integrated package structure of a color temperature can be adjusted
06/04/2014CN203631548U 全彩表面贴装器件 Full-color surface mount devices
06/04/2014CN203631547U 一种功率型cob集成封装led光源 A power-type cob integrated package led light
06/04/2014CN203631546U 一种大功率集成封装芯片排布结构 One kind of high-power integrated chip package structure arrangement
06/04/2014CN203631545U 全面有效发光的led制造工艺及产品 Comprehensive and effective luminous led manufacturing processes and products
06/04/2014CN203631532U 半导体整流桥 Semiconductor rectifier bridge
06/04/2014CN203631531U 四方形扁平无引脚封装的内封外露散热装置改良结构 Within four quad flat no-lead package sealing the exposed heat sink structure improvement
06/04/2014CN103843136A Packaging dram and soc in an IC package
06/04/2014CN103843135A Semiconductor device
06/04/2014CN103843132A Semiconductor device and method for manufacturing same
06/04/2014CN103843122A Semiconductor device
06/04/2014CN103840065A Transparent U-shaped LED light-emitting sheet with quick plug-in pins and LED bulb formed by the LED light-emitting sheet
06/04/2014CN103840061A Light-emitting diode
06/04/2014CN103840057A Light-emitting diode and manufacturing method thereof
06/04/2014CN103840049A Semiconductor LED light source with customized light emitting surface shape
06/04/2014CN103839938A Server processing module
06/04/2014CN103839937A White light emitting diode module
06/04/2014CN103839936A Manufacturing method for LED array device
06/04/2014CN103839935A Integrated white light LED light source high in color expression capacity
06/04/2014CN103839934A Light-emitting device
06/04/2014CN103839933A Buffer material for light emitting module and manufacturing method thereof
06/04/2014CN103839932A Logic die and other components embedded in build-up layers
06/04/2014CN103839931A Double-faced packaging structure of double chips
06/04/2014CN103839930A Lamination packaging structure of double chips
06/04/2014CN103839927A Protective device of single IGBT and power module provided with single IGBT
06/04/2014CN103839913A Semiconductor Packages and Methods of Formation Thereof
06/04/2014CN103839904A Electric power converter
06/04/2014CN103839896A Spiral substrate and three-dimensional packaging element having the same
06/04/2014CN103839840A Manufacturing method of inductor unit
06/04/2014CN103838684A Multi-chip system and semiconductor package
06/04/2014CN102224590B Antenna integrated in a semiconductor chip
06/04/2014CN102194980B Light emitting diode package and lighting system including the same
06/04/2014CN101859753B High-performance semiconductor with connection device and internal auxiliary connection elements designed as contact springs
06/04/2014CN101542702B Bonding method of three dimensional wafer lamination based on silicon through holes
06/03/2014US8742839 Double through silicon via structure
06/03/2014US8742838 Stacked structure with a voltage boosting supply circuit
06/03/2014US8742789 Interconnected array of logic cells reconfigurable with intersecting interconnection topology
06/03/2014US8742588 Method for making via interconnection
06/03/2014US8742562 Electronic device protected against electro static discharge
06/03/2014US8742434 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
05/2014
05/30/2014WO2014081476A1 Logic die and other components embedded in build-up layers
05/30/2014WO2014080476A1 Semiconductor device and method for producing same
05/30/2014WO2014049154A3 Optoelectronic component with protective circuit
05/30/2014WO2014048553A3 Led lighting devices and methods of manufacturing the same
05/29/2014US20140149253 Tasking system for manufacturing an electronic unit, trading system for a customized electronic unit, quality controlling system for trading a customized electronic unit and methods thereof
05/29/2014US20140147972 Multi-Dimensional Integrated Circuit Structures and Methods of Forming the Same
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