| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/02/2002 | US6413797 Semiconductor device and method for making the same |
| 07/02/2002 | US6412971 Light source including an array of light emitting semiconductor devices and control method |
| 06/27/2002 | WO2002051224A2 Multilayered hybrid electronic module |
| 06/27/2002 | WO2002051217A2 Packaged integrated circuits and methods of producing thereof |
| 06/27/2002 | WO2002050907A2 Interconnection of active and passive components in substrate |
| 06/27/2002 | WO2002050899A2 Semiconductor package |
| 06/27/2002 | US20020081779 Device comprising an electrical circuit carried by a carrier element and method for the manufacture of such a device |
| 06/27/2002 | US20020081774 Flip-chip on flex for high performance packaging applications |
| 06/27/2002 | US20020080588 Probe card assembly and kit, and methods of making same |
| 06/27/2002 | US20020080248 Reduced area imaging devices utilizing selected charge integration periods |
| 06/27/2002 | US20020079834 High resolution and brightness full-color LED display manufactured using CMP technique |
| 06/27/2002 | US20020079757 Rectifier assembly for an air-cooled generator |
| 06/27/2002 | US20020079594 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 06/27/2002 | US20020079591 Semiconductor chip, set of semiconductor chips and multichip module |
| 06/27/2002 | US20020079590 Semiconductor device and method for fabricating the same |
| 06/27/2002 | US20020079573 Chip package with grease heat sink |
| 06/27/2002 | US20020079568 Stacked module package |
| 06/27/2002 | US20020079567 Package structure stacking chips on front surface and back surface of substrate |
| 06/27/2002 | US20020079566 Multiple semiconductor chip (multi-chip) module for use in high-power applications |
| 06/27/2002 | US20020079505 Semiconductor light unit and method for production of the same |
| 06/27/2002 | US20020079457 X-ray image recording system and x-ray image recording method |
| 06/27/2002 | US20020079429 Opto-electronic assembly for receiving optical signals |
| 06/27/2002 | US20020079119 Electronic control unit |
| 06/27/2002 | US20020078991 Solar battery, solar generating apparatus, and building |
| 06/27/2002 | DE10147084A1 Halbleitervorrichtung vom gestapelten Typ Semiconductor device stacked type |
| 06/27/2002 | DE10062108A1 Leistungsmodul mit verbessertem transienten Wärmewiderstand Power module with improved transient thermal resistance |
| 06/27/2002 | CA2436990A1 Interconnection of active and passive components in substrate |
| 06/26/2002 | EP1217664A2 Semiconductor lighting unit and method for producing the same |
| 06/26/2002 | CN1355936A Hybrid white light source comprising LED and phosphor-LED |
| 06/26/2002 | CN1355568A Chip stack package structure |
| 06/25/2002 | US6411561 Semiconductor device including multi-chip |
| 06/25/2002 | US6411536 Rectifier device, having a cooling body, for a three-phase dynamo of a motor vehicle |
| 06/25/2002 | US6410989 Chip-scale package |
| 06/25/2002 | US6410983 Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip |
| 06/25/2002 | US6410960 Hybrid integrated circuit component |
| 06/25/2002 | US6410942 Enhanced light extraction through the use of micro-LED arrays |
| 06/25/2002 | US6410921 X-ray image recording system and x-ray image recording method |
| 06/25/2002 | US6410859 Electrical assembly for semiconductor dice |
| 06/25/2002 | US6408509 Vertically mountable interposer, assembly and method |
| 06/25/2002 | US6408507 Heat sink to semiconductor module assembly equipment and method |
| 06/20/2002 | WO2002049160A1 Circuit module with universal connectivity |
| 06/20/2002 | WO2002049109A1 Stacked die package |
| 06/20/2002 | WO2002049108A1 Semiconductor device package and lead frame with die overhanging lead frame pad |
| 06/20/2002 | WO2002049107A2 Method for stacking semiconductor die within an implanted medical device |
| 06/20/2002 | WO2002049104A2 Power module having improved transient thermal impedance |
| 06/20/2002 | WO2002013231A3 Radiation source and method for producing a lens mould |
| 06/20/2002 | WO2001060119A3 Lighting body |
| 06/20/2002 | US20020076958 Circuit module with universal connectivity |
| 06/20/2002 | US20020076858 Semiconductor device and manufacturing method thereof |
| 06/20/2002 | US20020075678 Method and device for generating white light by two types of diode chips |
| 06/20/2002 | US20020075663 Module having a lead frame equipped with components on both sides |
| 06/20/2002 | US20020075662 Stack-type expansible electronic device |
| 06/20/2002 | US20020075658 Module part and electronic device |
| 06/20/2002 | US20020075106 High frequency module device and method for its preparation |
| 06/20/2002 | US20020074669 Semiconductor device having capacitors for reducing power source noise |
| 06/20/2002 | US20020074668 Multi-chip integrated circuit module |
| 06/20/2002 | US20020074654 Wiring substrate, wiring board, and wiring substrate mounting structure |
| 06/20/2002 | US20020074653 Electronic component overlapping dice of unsingulated semiconductor wafer |
| 06/20/2002 | US20020074652 Method, apparatus and system for multiple chip assemblies |
| 06/20/2002 | US20020074642 Semiconductor device and package for containing semiconductor element |
| 06/20/2002 | US20020074639 Semiconductor module with improved solder joint reliability |
| 06/20/2002 | US20020074637 Stacked flip chip assemblies |
| 06/20/2002 | US20020074636 Semiconductor package |
| 06/20/2002 | US20020074633 Interconnection of active and passive components in substrate |
| 06/20/2002 | US20020074630 Semiconductor device having protruding electrodes higher than a sealed portion |
| 06/20/2002 | US20020074522 Scene projector apparatus |
| 06/20/2002 | US20020074034 Solar power generation system having cooling mechanism |
| 06/19/2002 | CN1354518A Multiwafer integrated circuit package structure |
| 06/19/2002 | CN1354514A High power semi-conductor module and its use |
| 06/19/2002 | CN1354510A Power semiconductor device |
| 06/18/2002 | US6407456 Multi-chip device utilizing a flip chip and wire bond assembly |
| 06/18/2002 | US6407448 Stackable ball grid array semiconductor package and fabrication method thereof |
| 06/18/2002 | US6407438 Semiconductor opto-electronic device packaging |
| 06/18/2002 | US6407334 I/C chip assembly |
| 06/18/2002 | US6406583 Wafer level creation of multiple optical elements |
| 06/18/2002 | US6406172 Headlamp and dynamic lighting system for vehicles |
| 06/13/2002 | WO2002047310A2 Display tile structure using organic light emitting materials |
| 06/13/2002 | WO2002047162A2 Microelectronic package having an integrated heat sink and build-up layers |
| 06/13/2002 | US20020072163 Module and method of making same |
| 06/13/2002 | US20020072147 High-frequency circuit board unit, high frequency module using the same unit, electronic apparatus using the same module, and manufacturing method for the high-frequency circuit board unit |
| 06/13/2002 | US20020070681 Led lamp |
| 06/13/2002 | US20020070458 Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same |
| 06/13/2002 | US20020070447 Vertical surface mount package utilizing a back-to-back semiconductor device module |
| 06/13/2002 | US20020070446 Semiconductor device and method for the production thereof |
| 06/13/2002 | US20020070443 Microelectronic package having an integrated heat sink and build-up layers |
| 06/13/2002 | US20020070439 Semiconductor device |
| 06/13/2002 | US20020070438 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array |
| 06/12/2002 | EP1213773A1 Bulk lens, light emitting body, lighting device and optical information system |
| 06/12/2002 | EP1212927A1 A printed circuit board assembly |
| 06/12/2002 | EP0972307B1 Multi-chip device and method of fabrication employing leads over and under processes |
| 06/12/2002 | CN1353865A Power feed and heat dissipating device for power semiconductor devices |
| 06/11/2002 | US6404662 Rambus stakpak |
| 06/11/2002 | US6404649 Printed circuit board assembly with improved bypass decoupling for BGA packages |
| 06/11/2002 | US6404648 Assembly and method for constructing a multi-die integrated circuit |
| 06/11/2002 | US6404062 Semiconductor device and structure and method for mounting the same |
| 06/11/2002 | US6404061 Semiconductor device and semiconductor chip |
| 06/11/2002 | US6404060 Semiconductor device having a chip-on-chip structure |
| 06/11/2002 | US6404056 Semiconductor integrated circuit |
| 06/11/2002 | US6404050 Commonly housed diverse semiconductor |
| 06/11/2002 | US6404046 Module of stacked integrated circuit packages including an interposer |