| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/16/2002 | EP1172850A2 Semiconductor device having at least three power terminals superposed on each other |
| 01/16/2002 | EP1172026A1 Electronic power module and method for making same |
| 01/16/2002 | EP1171914A1 Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
| 01/16/2002 | EP1171912A1 Method for the vertical integration of electric components by |
| 01/16/2002 | CN2472349Y Light emitting diode bulb |
| 01/15/2002 | US6339255 Stacked semiconductor chips in a single semiconductor package |
| 01/15/2002 | US6339254 Stacked flip-chip integrated circuit assemblage |
| 01/15/2002 | US6339231 Gate commutated turn-off thyristor module |
| 01/15/2002 | US6338973 Semiconductor device and method of fabrication |
| 01/15/2002 | US6338813 Molding method for BGA semiconductor chip package |
| 01/15/2002 | US6338767 Circuit component built-in module and method for producing the same |
| 01/15/2002 | CA2233481C Integrated circuit device cooling structure |
| 01/10/2002 | WO2002003465A2 Semiconductor package with stacked flip chip and wire bonded upper die |
| 01/10/2002 | WO2002003464A2 Semiconductor chip |
| 01/10/2002 | WO2002003422A2 Integrated circuits packaging system and method |
| 01/10/2002 | US20020004320 Attaratus for socketably receiving interconnection elements of an electronic component |
| 01/10/2002 | US20020004288 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof |
| 01/10/2002 | US20020004258 A pendulum motor having a stator and a cantilever beam moveable by an electrostatic force to predetermined positions relative to a supporting structure. A micro electro mechanical system (MEMS) mechanism is formed on a |
| 01/10/2002 | US20020004257 Semiconductor device and process for fabricating the same |
| 01/10/2002 | US20020003307 Semiconductor device and method for fabricating the device |
| 01/10/2002 | US20020003304 Semiconductor device having multilevel interconnection |
| 01/10/2002 | US20020003297 Vertically integrated semiconductor configuration |
| 01/10/2002 | US20020003296 Assembly of plurality of semiconductor devices |
| 01/10/2002 | US20020003232 Silicon interposer with optical connections |
| 01/10/2002 | US20020003231 Semi-transparent power monitor integrated with a light producing module |
| 01/10/2002 | DE10129032A1 HF-Modul RF module |
| 01/10/2002 | DE10031303A1 Beleuchtungsvorrichtung mit lichtemittierenden Dioden (LED), Beleuchtungsverfahren und Verfahren zur Bildaufzeichnung mit derartiger LED-Beleuchtungsvorrichtung A lighting device with light emitting diodes (LED), illumination method, and method for image recording with such LED lighting device |
| 01/10/2002 | DE10029069A1 Lamp, lamp arrangement and use of lamp employs LEDs as light source interchangeable with standard filament lamps |
| 01/09/2002 | EP1170794A1 Method of fabricating a power electronic component and power electronic component obtained thereby |
| 01/09/2002 | EP1169736A1 Power semiconductor module |
| 01/09/2002 | CN2470959Y Piling type image detector |
| 01/08/2002 | US6337579 Multichip semiconductor device |
| 01/08/2002 | US6337521 Semiconductor device and a method of manufacturing the same |
| 01/08/2002 | US6337513 Chip packaging system and method using deposited diamond film |
| 01/08/2002 | US6337512 Semiconductor module |
| 01/08/2002 | US6337510 Stackable QFN semiconductor package |
| 01/08/2002 | US6337436 Solar module for attachment to motor vehicles and a process for its manufacture |
| 01/08/2002 | US6337265 Method for integration of integrated circuit devices |
| 01/08/2002 | US6337227 Method of fabrication of stacked semiconductor devices |
| 01/08/2002 | US6337226 Semiconductor package with supported overhanging upper die |
| 01/08/2002 | US6336269 Method of fabricating an interconnection element |
| 01/07/2002 | CA2352513A1 Manufacturing process for a power electronic component, and power electronic component thus obtained |
| 01/03/2002 | WO2002001921A1 Illuminating device with light emitting diodes (led), method of illumination and method for image recording with said led illumination device |
| 01/03/2002 | WO2001082376A8 Semiconductor device |
| 01/03/2002 | WO2001045140A3 Encapsulation for organic led device |
| 01/03/2002 | WO2001041225A3 Enhanced light extraction in leds through the use of internal and external optical elements |
| 01/03/2002 | US20020001872 Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package |
| 01/03/2002 | US20020001216 Semiconductor device and process for manufacturing the same |
| 01/03/2002 | US20020001180 Heat sink and memory module with heat sink |
| 01/03/2002 | US20020000672 Plastic-packaged semiconductor device including a plurality of chips |
| 01/03/2002 | US20020000648 Thin integrated circuit unit |
| 01/03/2002 | US20020000645 Semiconductor module including a plurality of semiconductor devices detachably |
| 01/03/2002 | US20020000639 Semiconductor device with inductance element |
| 01/03/2002 | US20020000327 Wiring substrate, semiconductor device and package stack semiconductor device |
| 01/03/2002 | DE10026743C1 Substrat zur Aufnahme einer Schaltungsanordnung Substrate for receiving a circuit arrangement |
| 01/02/2002 | EP1168583A2 Alternator for vehicle |
| 01/02/2002 | EP1168447A2 Multi-layered semiconductor device and method |
| 01/02/2002 | EP1168446A2 Housing semiconductor chips |
| 01/02/2002 | EP1168441A2 Multi-layer wiring substrate and semiconductor device using the multi-layer wiring substrate |
| 01/02/2002 | EP1166361A1 Apparatus and method for an integrated circuit having high q reactive components |
| 01/02/2002 | EP1166355A1 Multi-chip module |
| 01/02/2002 | EP1164916A1 Surgical devices incorporating reduced area imaging devices |
| 01/02/2002 | EP0725981B1 Component stacking in multi-chip semiconductor packages |
| 01/02/2002 | EP0584349B1 Process and device for three-dimensional interconnection of housings for electronic components |
| 01/02/2002 | CN1329754A 高频功率晶体管器件 A high frequency power transistor device |
| 01/02/2002 | CN1329369A Luminous module and drive method for said same and optical detector |
| 01/02/2002 | CN1329365A Method for manufacturing optical illuminating device |
| 01/02/2002 | CN1329364A Optical illuminating device, its manufacturing methd and illuminator used the same |
| 01/02/2002 | CN1329362A Mixed IC device |
| 01/02/2002 | CN1329261A Platform and optical module, and producing method and optical transmission device |
| 01/01/2002 | US6335669 RF circuit module |
| 01/01/2002 | US6335565 Semiconductor device |
| 01/01/2002 | US6335528 Method for producing a radiation detector by assembling elementary blocks and resulting detector |
| 01/01/2002 | US6335479 Protective sheet for solar battery module, method of fabricating the same and solar battery module |
| 01/01/2002 | US6334247 High density integrated circuit apparatus, test probe and methods of use thereof |
| 12/27/2001 | WO2001099194A2 Semiconductor arrangement |
| 12/27/2001 | WO2001099189A1 Method and apparatus for edge connection between elements of an integrated circuit |
| 12/27/2001 | WO2001099188A2 Semiconductor package and method |
| 12/27/2001 | WO2001099187A1 Panel stacking of bga devices to form three-dimensional modules |
| 12/27/2001 | US20010055714 Electronic power device |
| 12/27/2001 | US20010055458 Sheet-like light emitting display and method |
| 12/27/2001 | US20010055454 Fiber carrying light emitting elements having patterned insulation |
| 12/27/2001 | US20010054905 Probe card assembly and kit |
| 12/27/2001 | US20010054770 Panel stacking of BGA devices to form three-dimensional modules |
| 12/27/2001 | US20010054762 Semiconductor device and method of fabricating the same |
| 12/27/2001 | US20010054759 Semiconductor device |
| 12/27/2001 | US20010054758 Three-dimensional memory stacking using anisotropic epoxy interconnections |
| 12/27/2001 | US20010054757 Multi-layer wiring board substrate and semiconductor device using the multi-layer wiring substrate |
| 12/27/2001 | US20010054756 Multi-layered semiconductor device and method for producing the same |
| 12/27/2001 | US20010054751 Semiconductor device and liquid crystal module |
| 12/26/2001 | CN1328644A Probe card for probing wafers with raised contact elements |
| 12/26/2001 | CN1076946C Cooling apparatus and assembling method thereof |
| 12/25/2001 | US6333856 Arrangement for mounting chips in multilayer printed circuit boards |
| 12/25/2001 | US6333721 Identification element and method of manufacturing an identification element |
| 12/25/2001 | US6333566 Semiconductor having high density packaging thereof |
| 12/25/2001 | US6333562 Multichip module having stacked chip arrangement |
| 12/25/2001 | US6333553 Wafer thickness compensation for interchip planarity |
| 12/25/2001 | US6333549 Integrated circuit package having interchip bonding and method therefor |
| 12/20/2001 | WO2001097287A1 Led lamp |
| 12/20/2001 | US20010053565 Method and apparatus for edge connection between elements of an integrated circuit |