| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/05/2002 | US6353540 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board. |
| 03/05/2002 | US6353538 Protective cover and packaging for multi-chip memory modules |
| 03/05/2002 | US6353265 Semiconductor device |
| 03/05/2002 | US6353264 Pseudomonolithic wafer scale module |
| 03/05/2002 | US6353263 Semiconductor device and manufacturing method thereof |
| 03/05/2002 | US6353258 Semiconductor module |
| 03/05/2002 | US6352879 Semiconductor device and method of manufacturing the same |
| 02/28/2002 | WO2002017690A1 Flexible substrate mounted solid-state light sources for use in line current lamp sockets |
| 02/28/2002 | WO2002017502A1 Radio transmitting/receiving device |
| 02/28/2002 | WO2002017405A1 Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| 02/28/2002 | WO2002017401A1 Component comprising a large number of light-emitting-diode chips |
| 02/28/2002 | WO2002017400A1 Power module |
| 02/28/2002 | WO2002017364A2 Micromechanical multichip module and method of making same |
| 02/28/2002 | WO2001043109A3 Light-emitting diode display systems and methods with enhanced light intensity |
| 02/28/2002 | US20020025794 High frequency module |
| 02/28/2002 | US20020025608 Memory module, method of manufacturing the memory module, and test connector using the memory module |
| 02/28/2002 | US20020025587 Semiconductor device and method for manufacturing the same |
| 02/28/2002 | US20020024798 Heat sink with alignment and retaining features |
| 02/28/2002 | US20020024299 Chip-type light-emitting device |
| 02/28/2002 | US20020024151 Multi-chip module with extension |
| 02/28/2002 | US20020024146 Semiconductor device |
| 02/28/2002 | US20020024135 Semiconductor device |
| 02/28/2002 | US20020024134 Semiconductor device |
| 02/28/2002 | US20020024129 Semiconductor device having at least three power terminals superposed on each other |
| 02/28/2002 | US20020024125 Semiconductor device and method for assembling the same |
| 02/28/2002 | US20020024124 Electronic component and semiconductor device, method for manufacturing the same, circuit board have the same mounted thereon, and electronic equipment having the circuit board |
| 02/28/2002 | US20020024120 Power module |
| 02/28/2002 | US20020023773 Method for manufacturing raised electrical contact patten of controlled geometry |
| 02/28/2002 | US20020023675 Solar battery assembly and method of forming a solar battery assembly |
| 02/28/2002 | US20020023674 Photoelectric conversion device |
| 02/28/2002 | US20020023342 Electronic device and a method of manufacturing the same |
| 02/28/2002 | US20020023341 Method for producing a microelectronic component of sandwich construction |
| 02/27/2002 | EP1182704A2 High frequency module |
| 02/27/2002 | EP1182396A1 Lamp based on LEDs' light emission |
| 02/27/2002 | CN1338119A Apparatus and method for an integrated circuit having high Q reactive components |
| 02/27/2002 | CN1337743A Package uith for semiconductor device and its manufacture |
| 02/26/2002 | US6351144 Programmable logic device with unified cell structure including signal interface bumps |
| 02/26/2002 | US6351033 Multifunction lead frame and integrated circuit package incorporating the same |
| 02/26/2002 | US6351029 Stackable flex circuit chip package and method of making same |
| 02/26/2002 | US6351028 Multiple die stack apparatus employing T-shaped interposer elements |
| 02/21/2002 | WO2002015567A1 Hand-held computers incorporating reduced area imaging devices |
| 02/21/2002 | WO2002015423A1 Transmitter and receiver module |
| 02/21/2002 | WO2002015281A2 Glass-to-metal hermetically sealed led array |
| 02/21/2002 | WO2002015272A1 Tuner device |
| 02/21/2002 | WO2002015264A2 Encapsulated organic-electronic component, method for producing the same and use thereof |
| 02/21/2002 | WO2001029881A3 Method of making an optoelectronic device using multiple etch stop layers |
| 02/21/2002 | US20020022405 Memory modules having conductors at edges thereof and configured to conduct signals to and from the memory modules via the respective edges |
| 02/21/2002 | US20020022312 Method of fabricating semiconductor device |
| 02/21/2002 | US20020022303 Three-dimensional semiconductor device and method of manufacturing the same |
| 02/21/2002 | US20020022300 Method for fabricating a stacked semiconductor chip package |
| 02/21/2002 | US20020021573 Lighting devices using LEDs |
| 02/21/2002 | US20020021560 Gate driver multi-chip module |
| 02/21/2002 | US20020021113 Load drive circuit having parallel-connected switch circuits |
| 02/21/2002 | US20020021048 Vehicle power distributor and method of producing the same |
| 02/21/2002 | US20020020924 Novel organic opto-electronic devices and method for making the same |
| 02/21/2002 | US20020020915 Semiconductor integrated circuit device with EMI prevention structure |
| 02/21/2002 | US20020020910 Semiconductor device including bonding wire bonded to electronic part and method for manufacturing the same |
| 02/21/2002 | US20020020906 Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device |
| 02/21/2002 | US20020020904 Semiconductor device |
| 02/21/2002 | US20020020901 Semiconductor device and method for production thereof |
| 02/21/2002 | US20020020440 Solar cell module |
| 02/20/2002 | CN2478254Y Packing structure for conforming image sensor to scan control chip |
| 02/20/2002 | CN1336689A Circuit structure of small inductor |
| 02/20/2002 | CN1336687A Semiconductor chip, semiconductor device and mfg. method therefor |
| 02/19/2002 | US6348728 Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer |
| 02/19/2002 | US6348672 Electric heater for a motor vehicle with individually switched branch circuits |
| 02/19/2002 | US6347735 Method of manufacture for embedded processing subsystem module |
| 02/14/2002 | WO2002013342A2 Silicon wafer with embedded optoelectronic material for monolithic oeic |
| 02/14/2002 | WO2002013269A1 Method for electrically connecting a semiconductor component to an electrical subassembly |
| 02/14/2002 | WO2002013260A2 Circuit comprising at least two semiconductor bodies and a cooling body |
| 02/14/2002 | WO2002013231A2 Radiation source and method for producing a lens mould |
| 02/14/2002 | US20020018911 Electroluminescent or photocell device having protective packaging |
| 02/14/2002 | US20020018353 Low-inductance circuit arrangement |
| 02/14/2002 | US20020017727 Method for manufacturing semiconductor device using group III nitride compound |
| 02/14/2002 | US20020017722 Semiconductor device and a method of manufacturing the same |
| 02/14/2002 | US20020017721 Array structure of solder balls able to control collapse |
| 02/14/2002 | US20020017720 Semiconductor device |
| 02/14/2002 | US20020017719 Semiconductor device having bonding wires serving as external connection terminals |
| 02/14/2002 | US20020017718 Semiconductor device and semiconductor chip for use therein |
| 02/14/2002 | US20020017717 Semiconductor clamped-stack assembly |
| 02/14/2002 | US20020017713 Microcap wafer-level package |
| 02/14/2002 | US20020017710 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 02/14/2002 | US20020017709 Assembly jig and manufacturing method of multilayer semiconductor device |
| 02/14/2002 | US20020017707 Multi-layered integrated semiconductor device incorporating electrically connected integrated circuit chips and monitoring pads |
| 02/14/2002 | US20020017702 Methods for manufacturing resistors using a sacrificial layer |
| 02/14/2002 | US20020017667 Ferroelectric memory and method of fabricating the same |
| 02/14/2002 | DE10113967A1 Leistungsmodul Power module |
| 02/14/2002 | DE10038092A1 Verfahren zur elektrischen Verbindung eines Halbleiterbauelements mit einer elektrischen Baugruppe A method for electrically connecting a semiconductor device having an electrical module |
| 02/13/2002 | EP1179219A1 Led module for signaling devices |
| 02/13/2002 | CN1336027A Laser diode device and method for producing the same |
| 02/13/2002 | CN1336021A A method and a device for manufacturing a roll of items |
| 02/13/2002 | CN1335646A Surface adhered diode array and its manufacture |
| 02/12/2002 | US6347039 Memory module and memory module socket |
| 02/12/2002 | US6346771 High power led lamp |
| 02/07/2002 | WO2002010809A1 Flexible flat color display |
| 02/07/2002 | WO2001067511A3 Method of forming a stacked-die integrated circuit chip package on a wafer level |
| 02/07/2002 | WO2001052184A3 Chipcard arrangement |
| 02/07/2002 | US20020016021 Face to face chip |
| 02/07/2002 | US20020016020 Method of manufacturing an electronic device |
| 02/07/2002 | US20020015293 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board |