H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2001
11/27/2001	US6323415 Light concentrator photovoltaic module method of manufacturing same and light concentrator photovoltaic system
11/27/2001	US6323096 Method for fabricating a flexible interconnect film with resistor and capacitor layers
11/27/2001	US6323061 Method for manufacturing a semiconductor device
11/27/2001	US6323060 Stackable flex circuit IC package and method of making same
11/27/2001	US6323058 Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device
11/27/2001	US6322903 Package of integrated circuits and vertical integration
11/27/2001	US6321994 Contactless communication data carrier with fully enclosed holding means for holding a chip and a passive component
11/27/2001	US6321443 Connection substrate
11/27/2001	CA2171458C Multi-chip module
11/22/2001	WO2001088983A2 Power semiconductor module
11/22/2001	WO2001088982A2 Housing device and contact element used therein
11/22/2001	US20010042925 Wire bonding method and apparatus, and semiconductor device
11/22/2001	US20010042911 Semiconductor device and semiconductor assembly apparatus for semiconductor device
11/22/2001	US20010042910 Vertical ball grid array integrated circuit package
11/22/2001	US20010042863 Semiconductor device and manufacturing method thereof
11/22/2001	DE10111998A1 Schaltungsmodul Circuit module
11/21/2001	EP1156529A2 Arrangement of a plurality of circuit modules
11/21/2001	EP1155455A1 Hybrid white light source comprising led and phosphor-led
11/21/2001	EP1155454A1 Light source with light-emitting diodes
11/21/2001	EP1155450A1 Functionally symmetric integrated circuit die
11/21/2001	EP1155445A1 Method for producing electrically conductive connections
11/21/2001	CN2461150Y Transistor assembling device to surface sticked type
11/21/2001	CN2461149Y Stack integrated circuit
11/21/2001	CN1323094A Novel IGBT drag current transformer module
11/21/2001	CN1323064A Method for producing plate shape body and semiconductor device
11/20/2001	US6320747 Method for manufacturing electric modules, and the electric module
11/20/2001	US6320568 Control system for display panels
11/20/2001	US6320268 Power semiconductor module
11/20/2001	US6320257 Chip packaging technique
11/20/2001	US6320255 Rerouted semiconductor device and method of fabrication
11/20/2001	US6320251 Stackable package for an integrated circuit
11/20/2001	US6320250 Semiconductor package and process for manufacturing the same
11/20/2001	US6320249 Multiple line grids incorporating therein circuit elements
11/20/2001	US6320126 Vertical ball grid array integrated circuit package
11/20/2001	US6319827 Integrated electronic micromodule and method for making same
11/20/2001	US6319065 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
11/20/2001	US6318886 High flux led assembly
11/15/2001	WO2001086722A2 Semiconductor component
11/15/2001	US20010041410 Method for production and formation of semiconductor light emitting diodes
11/15/2001	US20010040793 Electronic device and method of producing the same
11/15/2001	US20010040792 Multi-chip module having interconnect dies
11/15/2001	US20010040644 Bonded layer semiconductor device
11/15/2001	US20010040286 Semiconductor device and method for the fabrication thereof
11/15/2001	US20010040285 Semiconductor device and method of manufacturing same
11/15/2001	US20010040282 Stackable ball grid array package
11/15/2001	US20010040281 Multi-chip memory apparatus and associated method
11/15/2001	US20010040279 Apparatus and methods of packaging and testing die
11/15/2001	US20010040278 Ultra high density integrated circuit BLP stack and method for fabricating the same
11/15/2001	DE10115207A1 Active semiconductor module with plastic frame
11/15/2001	DE10052191C1 Cooling assembly for electronic components includes spring clamps holding them against cooling plate and away from PCB connections
11/14/2001	EP1154474A1 Semiconductor device and method of manufacture thereof
11/14/2001	EP1154473A2 Sheet-like board member and method of manufacturing a semiconductor device
11/14/2001	EP1153433A1 High density electronic package
11/14/2001	EP1153419A2 Multiple chip module with integrated rf capabilities
11/14/2001	EP0928486B1 Device and method for testing integrated circuit dice in an integrated circuit module
11/14/2001	CN1321898A Three-D installed element, its mfg. method and optical transmission device
11/13/2001	US6317175 Single crystal silicon arrayed devices with optical shield between transistor and substrate
11/13/2001	US6316838 Semiconductor device
11/13/2001	US6316832 Moldless semiconductor device and photovoltaic device module making use of the same
11/13/2001	US6316786 Organic opto-electronic devices
11/08/2001	US20010039075 Method for Capacitively Coupling Electronic Devices
11/08/2001	US20010039074 Micro-flex technology in semiconductor packages
11/08/2001	US20010038530 Imbedded die-scale interconnect for ultra-high speed digital communications
11/08/2001	US20010038310 Power transistor module, power amplifier and methods in the fabrication thereof
11/08/2001	US20010038151 Semiconductor device and the method for manufacturing the same
11/08/2001	US20010038148 Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material, composite structure using the electric connection structure, and manufacturing process thereof
11/08/2001	US20010038143 Power semiconductor module
11/07/2001	EP1152464A2 Chip size package semiconductor device and method of manufacturing the same
11/07/2001	EP1151962A1 Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material, composite structure using the electric connection structure, and manufacturing process thereof
11/07/2001	EP1151472A1 Method for vertically integrating active circuit planes and vertically integrated circuit produced using said method
11/07/2001	EP0757846B1 Electronic component comprising a thin-film structure with passive elements
11/07/2001	CN2458485Y LED lighting module
11/07/2001	CN1321411A Printed wiring board and method of producing same
11/07/2001	CN1321410A Printed wiring board and method of producing same
11/07/2001	CN1321409A Soldering of semiconductor chip to substrate
11/07/2001	CN1320964A Semiconductor device and mfg. method thereof
11/06/2001	US6314013 Stacked integrated circuits
11/06/2001	US6313998 Circuit board assembly having a three dimensional array of integrated circuit packages
11/06/2001	US6313598 Power semiconductor module and motor drive system
11/06/2001	US6313529 Bump bonding and sealing a semiconductor device with solder
11/06/2001	US6313528 Compliant multichip package
11/06/2001	US6313522 Semiconductor structure having stacked semiconductor devices
11/06/2001	US6313520 Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereon
11/06/2001	US6313517 With connecting layer of homopolymerized benzocyclobutene
11/01/2001	WO2001082378A1 Carrier substrate for electronic components
11/01/2001	WO2001082377A2 Circuit
11/01/2001	WO2001082376A1 Semiconductor device
11/01/2001	WO2001082370A1 Method for adjusting structures on a semiconductor substrate
11/01/2001	WO2001080635A1 Threatening device
11/01/2001	US20010036771 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
11/01/2001	US20010036718 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
11/01/2001	US20010036711 Semiconductor device and manufacturing method of the same
11/01/2001	US20010036684 Electronic component and manufacturing method therefor
11/01/2001	US20010036083 Green phosphor converted light emitting diode
11/01/2001	US20010036063 Electronic part module mounted on
11/01/2001	US20010035587 Resin-sealed chip stack type semiconductor device
11/01/2001	US20010035572 Stackable flex circuit chip package and method of making same
11/01/2001	US20010035568 Lead frame for a semiconductor chip package, semiconductor chip package incorporating multiple integrated circuit chips, and method of fabricating a semiconductor chip package with multiple integrated circuit chips
11/01/2001	US20010035566 Semiconductor device and process for producing the same
11/01/2001	US20010035562 Semiconductor device

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