| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 07/23/2002 | US6424030 Semiconductor memory module having double-sided stacked memory chip layout |
| 07/23/2002 | US6424029 Chip card |
| 07/23/2002 | US6424020 High Density electronic circuit modules |
| 07/23/2002 | US6423895 Solar array for satellite vehicles |
| 07/23/2002 | US6423573 Integrated electronic circuit comprising at least an electronic power component |
| 07/23/2002 | US6423560 Method of making an optoelectronic device using multiple etch stop layers |
| 07/23/2002 | US6422716 Modular led assembly |
| 07/18/2002 | WO2002056390A1 Light-emitting diode and method for the production thereof |
| 07/18/2002 | WO2002056361A1 Light emitting semiconductor package |
| 07/18/2002 | WO2002055431A2 Wafer level interconnection |
| 07/18/2002 | US20020094701 Stretchable interconnects using stress gradient films |
| 07/18/2002 | US20020094609 Semiconductor assembly without adhesive fillets |
| 07/18/2002 | US20020094608 Semiconductor assembly without adhesive fillets |
| 07/18/2002 | US20020094607 Electronic component with stacked semiconductor chips and method of producing the component |
| 07/18/2002 | US20020094605 Method for fabricating a stacked chip package |
| 07/18/2002 | US20020094603 Three-dimensional memory stacking using anisotropic epoxy interconnections |
| 07/18/2002 | US20020094602 DCA memory module and a fabrication method thereof |
| 07/18/2002 | US20020093793 Light source comprising a large number of light-emitting diodes |
| 07/18/2002 | US20020093094 Semiconductor device |
| 07/18/2002 | US20020093093 Semiconductor package with stacked dies |
| 07/18/2002 | US20020093092 Power semiconductor module and cooling element for holding the power semiconductor module |
| 07/18/2002 | US20020093088 High density integrated circuits and the method of packaging the same |
| 07/18/2002 | US20020093014 Semiconductor chip, semiconductor device, and process for producing a semiconductor device |
| 07/18/2002 | DE10151928A1 Current rectifier has internal noise filter and sealed radiation substrate and fins |
| 07/18/2002 | DE10100460A1 Power semiconductor module with housing and connections aligns connecting elements parallel to base plate |
| 07/17/2002 | EP1223617A2 Multichip module with a plurality of semiconductor chips mounted on a semiconductor substrate |
| 07/17/2002 | EP0823133B1 Fabrication of organic light-emitting devices |
| 07/17/2002 | CN1359535A Method and device for interconnect radio frequency power sic filed effect transistors |
| 07/17/2002 | CN1359476A Optomodule |
| 07/17/2002 | CN1359154A Semiconductor device |
| 07/16/2002 | US6421254 Multi-chip module having interconnect dies |
| 07/16/2002 | US6421250 Multi in-line memory module and matching electronic component socket |
| 07/16/2002 | US6421248 Chip card module |
| 07/16/2002 | US6421244 Power module |
| 07/16/2002 | US6421241 Heat exchanging chassis |
| 07/16/2002 | US6420789 Ball grid array chip packages having improved testing and stacking characteristics |
| 07/16/2002 | US6420787 Semiconductor device and process of producing same |
| 07/16/2002 | US6420783 Semiconductor device and a method of manufacturing the same |
| 07/16/2002 | US6420782 Vertical ball grid array integrated circuit package |
| 07/16/2002 | US6420781 Method for producing emulation circuit configuration, and configuration with two integrated circuits |
| 07/16/2002 | US6420209 Integrated circuits and methods for their fabrication |
| 07/16/2002 | US6419406 Optomodule |
| 07/11/2002 | WO2002054596A1 Method and apparatus for a failure-free synchronizer |
| 07/11/2002 | WO2002054451A2 Method for stacking integrated circuits |
| 07/11/2002 | WO2002028148B1 Enhanced trim resolution voltage-controlled dimming led driver |
| 07/11/2002 | WO2001050525A3 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size |
| 07/11/2002 | US20020091980 Single-pass methods for generating test patterns for commbinational circuits |
| 07/11/2002 | US20020090753 Method for fabricating stacked chip package |
| 07/11/2002 | US20020089849 Led lamp assembly |
| 07/11/2002 | US20020089831 Module with one side stacked memory |
| 07/11/2002 | US20020089589 Communication devices incorporating reduced area imaging devices |
| 07/11/2002 | US20020089068 Microwave semiconductor device and the manufacturing method thereof for improve heat discharge and electric property |
| 07/11/2002 | US20020089055 Chip packaging system and method using deposited diamond film |
| 07/11/2002 | US20020089052 Semiconductor device and a method of manufacturing the same |
| 07/11/2002 | US20020089051 Semiconductor device |
| 07/11/2002 | US20020089050 Semiconductor device |
| 07/11/2002 | US20020089046 Low-inductance semiconductor components |
| 07/11/2002 | US20020089033 Semiconductor device and semiconductor assembly apparatus for semiconductor device |
| 07/11/2002 | US20020088988 Light emitting semiconductor package |
| 07/11/2002 | US20020088987 Optical device and method for manufacturing the same, and electronic apparatus |
| 07/11/2002 | US20020088983 Multichip module |
| 07/11/2002 | US20020088633 Multi-chip memory devices, modules and control methods including independent control of memory chips |
| 07/11/2002 | DE10064194A1 Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls Power semiconductor module and the cooling body for receiving the power semiconductor module |
| 07/10/2002 | CN1358315A Semiconductor memory chip module |
| 07/09/2002 | US6418490 Electronic circuit interconnection system using a virtual mirror cross over package |
| 07/09/2002 | US6418033 Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles |
| 07/09/2002 | US6418030 Multi-chip module |
| 07/09/2002 | US6417693 Hybrid product term and look-up table-based programmable logic device with improved speed and area efficiency |
| 07/09/2002 | US6417692 Programmable I/O cells with multiple drivers |
| 07/09/2002 | US6417691 Communication device with configurable module interface |
| 07/09/2002 | US6417652 Load drive circuit for an electric load |
| 07/09/2002 | US6417442 Solar battery assembly and method of forming a solar battery assembly |
| 07/09/2002 | US6417024 Back-to-back semiconductor device module, assemblies including the same and methods |
| 07/04/2002 | WO2002052589A1 Semiconductor device, and method and apparatus for manufacturing semiconductor device |
| 07/04/2002 | WO2002052588A1 Semiconductor device, and method and apparatus for manufacturing semiconductor device |
| 07/04/2002 | WO2002052190A1 The led lamp with a reflecting cavity |
| 07/04/2002 | WO2000070676A9 High-density electronic package, and method for making same |
| 07/04/2002 | US20020086459 Circuit mounting method, circuit mounted board, and semiconductor device |
| 07/04/2002 | US20020085379 Surface light source generator |
| 07/04/2002 | US20020084868 High-frequency switching module and high-frequency apparatus equipped with the same |
| 07/04/2002 | US20020084520 Low profile multi-IC chip package connector |
| 07/04/2002 | US20020084515 Known good die using existing process infrastructure |
| 07/04/2002 | US20020084513 Integrated circuits and methods for their fabrication |
| 07/04/2002 | US20020084462 Light emission device |
| 07/04/2002 | DE10162966A1 Power semiconductor modules for transformers has multilayer ceramic between heat sink and chip |
| 07/04/2002 | DE10161936A1 Elektroniksteuereinheit Electronic control unit |
| 07/04/2002 | DE10152533A1 Hochfrequenz-Schaltungsplatineneinheit, Hochfrequenz-Modul, bei dem die Einheit verwendet ist, elektronische Vorrichtung, bei der das Modul verwendet ist, und Verfahren zur Herstellung der Hochfrequenz-Schaltungsplatineneinheit High-frequency circuit board unit, high-frequency module in which the unit is used, electronic device in which the module is used, and processes for making the high-frequency circuit board unit |
| 07/04/2002 | DE10063876A1 Aus einer Vielzahl von Leuchtdioden bestehende Lichtquelle For a variety of light-emitting diodes existing light source |
| 07/03/2002 | EP1220316A2 High-frequency switching module and high-frequency apparatus equipped with the same |
| 07/03/2002 | EP1219994A2 Semiconductor device, optoelectronic board, and production methods therefor |
| 07/03/2002 | CN2498745Y Thyrister series device |
| 07/03/2002 | CN1356764A Process for preparing integrated electric and electronic module based on discrete elements |
| 07/02/2002 | US6414783 Method of transferring semiconductors |
| 07/02/2002 | US6414543 Rectifying charge storage element |
| 07/02/2002 | US6414391 Module assembly for stacked BGA packages with a common bus bar in the assembly |
| 07/02/2002 | US6414388 Light emitting/receiving element for optical pickup apparatus |
| 07/02/2002 | US6414387 Semiconductor device including a chip having high-frequency circuit blocks |
| 07/02/2002 | US6414384 Package structure stacking chips on front surface and back surface of substrate |
| 07/02/2002 | US6414381 Interposer for separating stacked semiconductor chips mounted on a multi-layer printed circuit board |
| 07/02/2002 | US6413798 Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same |