| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/12/2002 | US20020126465 EMI reduction in power modules through the use of integrated capacitors on the substrate level |
| 09/12/2002 | US20020126459 Stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same |
| 09/12/2002 | US20020126455 Tiled microelectromechanical device modules and fabrication methods |
| 09/12/2002 | US20020126452 Heat sink chip package |
| 09/12/2002 | US20020125580 Stacked semiconductor chip package |
| 09/12/2002 | US20020125571 Module assembly for stacked BGA packages |
| 09/12/2002 | US20020125567 Die support structure |
| 09/12/2002 | US20020125565 Semiconductor device |
| 09/12/2002 | US20020125558 Semiconductor package with stacked substrates and multiple semiconductor dice |
| 09/12/2002 | US20020125557 Package of a chip with beveled edges |
| 09/12/2002 | US20020125556 Stacking structure of semiconductor chips and semiconductor package using it |
| 09/12/2002 | US20020125555 Semiconductor device and communication terminal using thereof |
| 09/12/2002 | US20020125546 Semiconductor device, production method therefor, and electrophotographic apparatus |
| 09/12/2002 | US20020125545 Spherical semiconductor device containing two or more spherical semiconductors combined together |
| 09/12/2002 | US20020125504 Fabrication and assembly structures and methods for memory devices |
| 09/12/2002 | US20020125484 Sealed organic optoelectronic structures |
| 09/12/2002 | DE10109548A1 Schaltungsaufbau für eine Schaltung zum Schalten von Strömen Circuit structure of a circuit for switching currents |
| 09/12/2002 | DE10107405A1 Semiconductor film which can be directly processed on conveyor belt production line comprises semiconductor tape formed by ion implantation |
| 09/11/2002 | EP1239520A2 Fabrication of memory devices |
| 09/11/2002 | EP1239519A2 Image pickup model and image pickup device |
| 09/11/2002 | EP1239518A2 Light-emitting device |
| 09/11/2002 | EP1239514A2 Low fabrication cost, fine pitch and high reliability solder bump |
| 09/11/2002 | EP1238430A2 Dual-die integrated circuit package |
| 09/11/2002 | CN1368761A Semiconductor device |
| 09/11/2002 | CN1368760A 半导体设备 Semiconductor Equipment |
| 09/11/2002 | CN1090832C Electric power conversion means |
| 09/10/2002 | US6449159 Semiconductor module with imbedded heat spreader |
| 09/10/2002 | US6449156 Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof |
| 09/10/2002 | US6448808 Interconnect structure for a programmable logic device |
| 09/10/2002 | US6448664 Ball grid array chip packages having improved testing and stacking characteristics |
| 09/10/2002 | US6448661 Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof |
| 09/10/2002 | US6448659 Stacked die design with supporting O-ring |
| 09/10/2002 | US6448645 Semiconductor device |
| 09/10/2002 | US6448636 Multi-layered integrated semiconductor device incorporating electrically connected integrated circuit chips and monitoring pads |
| 09/10/2002 | US6448506 Semiconductor package and circuit board for making the package |
| 09/10/2002 | US6448174 Wiring method for producing a vertical, integrated circuit structure and vertical, integrated circuit structure |
| 09/10/2002 | US6448153 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
| 09/10/2002 | US6448106 Modules with pins and methods for making modules with pins |
| 09/06/2002 | WO2002069482A1 Circuit design for a circuit for switching currents |
| 09/06/2002 | WO2002069476A2 Vehicular modular design multiple application rectifier assembly |
| 09/06/2002 | WO2002069409A1 High power led |
| 09/06/2002 | WO2002069405A2 Circuit arrangement |
| 09/06/2002 | WO2002069404A2 Circuit arrangement |
| 09/06/2002 | WO2002069399A1 Super-thin high speed flip chip package |
| 09/06/2002 | WO2002069396A2 Vehicular modular design multiple application rectifier assembly having outer lead integument |
| 09/06/2002 | WO2002034021A3 Carrier-based electronic module |
| 09/06/2002 | WO2002025704A3 Leadframe-based module dc bus design to reduce module inductance |
| 09/06/2002 | WO2002025703A3 Substrate-level dc bus design to reduce module inductance |
| 09/05/2002 | US20020123233 Method for stacking semiconductor die within an implanted medical device |
| 09/05/2002 | US20020123213 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 09/05/2002 | US20020123172 Methods for forming a die package |
| 09/05/2002 | US20020123160 Integrated semiconductor device including high-voltage interconnections passing through low-voltage regions |
| 09/05/2002 | US20020121707 Super-thin high speed flip chip package |
| 09/05/2002 | US20020121706 Semiconductor-chip mounting substrate and method of manufacturing the same |
| 09/05/2002 | US20020121693 Stacked die package |
| 09/05/2002 | US20020121692 Low fabrication cost, fine pitch and high reliability solder bump |
| 09/05/2002 | US20020121690 Semiconductor memory module having double-sided stacked memory chip layout |
| 09/05/2002 | US20020121687 Electronic component with stacked semiconductor chips |
| 09/05/2002 | US20020121686 Rearrangement sheet, semiconductor device and method of manufacturing thereof |
| 09/05/2002 | US20020121680 Ultra-thin semiconductor package device and method for manufacturing the same |
| 09/05/2002 | US20020121679 Mixed analog and digital integrated circuits |
| 09/05/2002 | DE10142585A1 Halbleiteranordnung und Verfahren zu deren Herstellung A semiconductor device and process for their preparation |
| 09/05/2002 | DE10109997A1 Reading light for motor vehicle, has row of light emitting semiconductor elements and reflector |
| 09/05/2002 | DE10107839A1 Anordnung mit einem auf einem Träger montierten integrierten Schaltkreis und einer Stromversorgungsbaugruppenanordnung Arrangement with a mounted on a support integrated circuit and a power supply assembly arrangement |
| 09/05/2002 | DE10105872A1 Arrangement used in the manufacture of matrix displays comprises a substrate having a recess, and a chip provided in the recess with a layer formed on the peripheral surface of the recess and/or chip |
| 09/04/2002 | EP1237397A2 Insulating substrate boards for semiconductor and power modules |
| 09/04/2002 | EP1237272A2 Semiconductor power module and compound power module |
| 09/04/2002 | EP1237191A2 High-Density Electronic Circuit Modules |
| 09/04/2002 | EP0976155B1 High-voltage, high-current multilayer circuit board, method for the production thereof |
| 09/04/2002 | CN2509720Y Lamp bulb using with luminous diode |
| 09/04/2002 | CN1367541A Luminous unit, luminous unit assembly and illuminator produced by said unit |
| 09/04/2002 | CN1367532A Press-contacting type semiconductor device |
| 09/04/2002 | CN1367529A Inverse-fastening process of miniature chip |
| 09/03/2002 | US6445594 Semiconductor device having stacked semiconductor elements |
| 09/03/2002 | US6445591 Multilayer circuit board |
| 09/03/2002 | US6445068 Semiconductor module |
| 09/03/2002 | US6445064 Semiconductor device |
| 09/03/2002 | US6445063 Method of forming a stack of packaged memory die and resulting apparatus |
| 09/03/2002 | US6445008 Photo sensing device and the manufacturing method thereof |
| 09/03/2002 | US6444983 Microbolometer focal plane array with controlled bias |
| 09/03/2002 | US6444921 Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like |
| 09/03/2002 | US6444576 Three dimensional IC package module |
| 09/03/2002 | US6444493 Method for vertically integrating active circuit planes and vertically integrated circuit produced using said method |
| 09/03/2002 | US6444491 Composites and metals with stacks for integrated circuits |
| 09/03/2002 | US6444490 Micro-flex technology in semiconductor packages |
| 09/03/2002 | US6443597 Plane display unit and plane display device |
| 08/29/2002 | WO2002067646A1 Arrangement with an integrated circuit mounted on a bearing means and a power supply module arrangement |
| 08/29/2002 | WO2002067640A1 Electronic device and method of manufacturing the same |
| 08/29/2002 | WO2002067639A1 An electronic device and a circuit arrangement |
| 08/29/2002 | US20020119640 Methods of forming semiconductor circuitry, methods of forming logic circuitry, and semiconductor circuit constructions |
| 08/29/2002 | US20020118560 Substrate-level DC bus design to reduce module inductance |
| 08/29/2002 | US20020118523 Electronic circuit equipment using multilayer circuit board |
| 08/29/2002 | US20020117753 Three dimensional packaging |
| 08/29/2002 | US20020117748 Integrated circuit power supply |
| 08/29/2002 | US20020117742 Semiconductor device |
| 08/29/2002 | US20020117741 High bandwidth 3d memory packaging technique |
| 08/29/2002 | US20020117330 Resilient contact structures formed and then attached to a substrate |
| 08/29/2002 | DE10149093A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 08/28/2002 | EP1235471A1 A stackable module |
| 08/28/2002 | EP1235357A1 High-frequency composite switch module |