| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 10/03/2002 | US20020140347 Methods and structures for reducing lateral diffusion through cooperative barrier layers |
| 10/03/2002 | US20020140107 Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate |
| 10/03/2002 | US20020140085 Semiconductor package including passive elements and method of manufacture |
| 10/03/2002 | US20020140084 Semiconductor device |
| 10/03/2002 | US20020140078 Power semiconductor device |
| 10/03/2002 | US20020140077 Multichip semiconductor package |
| 10/03/2002 | US20020140074 Contact member stacking system and method |
| 10/03/2002 | US20020140073 Multichip module |
| 10/03/2002 | US20020140066 Semiconductor device having flat electrodes of a first semiconductor pellet and protruded electrodes of a second semiconductor pellet directly contacted with the flat electrodes |
| 10/03/2002 | US20020139985 Light-emitting device |
| 10/03/2002 | US20020139577 In-street integrated circuit wafer via |
| 10/03/2002 | US20020139414 Non-imaging system for radiant energy flux transformation |
| 10/02/2002 | EP1245047A2 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size |
| 10/02/2002 | DE10113526A1 Lamp for fixing in a low-voltage halogen lamp holder has an integrated standard reflector casing with a high-power LED in/near its focal point. |
| 10/02/2002 | CN1372322A Stacking type video image sensor and making method thereof |
| 10/02/2002 | CN1372310A Stacket semiconductor with film and film making method thereof |
| 10/01/2002 | US6459593 Electronic circuit board |
| 10/01/2002 | US6459161 Semiconductor device with connection terminals in the form of a grid array |
| 10/01/2002 | US6459157 Semiconductor device and double-sided multi-chip package |
| 10/01/2002 | US6459152 Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface |
| 10/01/2002 | US6459148 QFN semiconductor package |
| 10/01/2002 | US6459146 Semiconductor apparatus |
| 10/01/2002 | US6459034 Multi-junction solar cell |
| 10/01/2002 | US6458625 Multi chip semiconductor package and method of construction |
| 10/01/2002 | US6458609 Semiconductor device and method for manufacturing thereof |
| 10/01/2002 | CA2273356C Bump-bonded semiconductor imaging device |
| 09/26/2002 | WO2002075774A1 Integrated led/photodiode collimator array |
| 09/26/2002 | WO2002049109B1 Stacked die package |
| 09/26/2002 | US20020137399 Electronic power circuit of several power modules |
| 09/26/2002 | US20020137327 Semiconductor device and manufacturing method thereof. |
| 09/26/2002 | US20020137258 Die stacking scheme |
| 09/26/2002 | US20020137255 One-step semiconductor stack packaging method |
| 09/26/2002 | US20020137252 Folded interposer |
| 09/26/2002 | US20020136041 Vehicular modular design multiple application rectifier assembly having outer lead integument |
| 09/26/2002 | US20020135986 Electronic device and a method of manufacturing the same |
| 09/26/2002 | US20020135982 Electronic module having a three dimensional array of integrated circuit packages |
| 09/26/2002 | US20020135298 Light extractor apparatus |
| 09/26/2002 | US20020135079 Chip-scale package |
| 09/26/2002 | US20020135066 Stackable ball grid array package |
| 09/26/2002 | US20020135062 Process of manufacturing a composite structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material |
| 09/26/2002 | US20020135061 Composite material, and manufacturing method and uses of same |
| 09/26/2002 | US20020135060 Transistor and power amplifier with improved bandwidth |
| 09/26/2002 | US20020135059 Chip packaging structure |
| 09/26/2002 | US20020135057 Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same |
| 09/26/2002 | US20020135050 Semiconductor device |
| 09/26/2002 | US20020134424 Photon power cell |
| 09/26/2002 | US20020134040 Concrete construction block and method for forming the same |
| 09/26/2002 | US20020133943 Method for manufacturing circuit device |
| 09/26/2002 | DE10114125A1 Aus mehreren Leistungsmodulen bestehende elektronische Leistungsschaltung Consisting of multiple power modules, electronic power circuit |
| 09/25/2002 | EP1244340A2 Electronic power circuit comprising several power modules |
| 09/25/2002 | EP1244146A2 A method of making a tiled emissive display |
| 09/25/2002 | EP1243843A2 LED signal module |
| 09/25/2002 | CN1370949A Cold light source lamp |
| 09/24/2002 | US6455928 Stackable ball grid array package |
| 09/24/2002 | US6455864 Methods and compositions for ionizing radiation shielding |
| 09/24/2002 | US6455778 Micro-flex technology in semiconductor packages |
| 09/24/2002 | US6453550 Method for forming modular sockets using flexible interconnects and resulting structures |
| 09/19/2002 | WO2002074024A2 A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 09/19/2002 | WO2002073706A1 Display apparatus and its manufacturing method |
| 09/19/2002 | WO2002073693A1 Semiconductor device |
| 09/19/2002 | WO2001082370A9 Method for adjusting structures on a semiconductor substrate |
| 09/19/2002 | US20020132463 Semiconductor device and manufacturing method of the same |
| 09/19/2002 | US20020132462 Spherical semiconductor device and method for fabricating the same |
| 09/19/2002 | US20020131318 Semiconductor device including multi-chip |
| 09/19/2002 | US20020131245 Modular PC Card which receives add-in PC Card modules |
| 09/19/2002 | US20020130422 Semiconductor/printed circuit board assembly, and computer system |
| 09/19/2002 | US20020130413 Ball grid array chip packages having improved testing and stacking characteristics |
| 09/19/2002 | US20020130404 Semiconductor module in which plural semiconductor chips are enclosed in one package |
| 09/19/2002 | US20020130326 Lighting device |
| 09/19/2002 | DE10210903A1 Halbleiterpackungsbauelement geringer Dicke, Verfahren zu seiner Herstellung und zugehörige Elektronikkomponente Semiconductor package device of small thickness, process for its preparation and its associated electronics component |
| 09/19/2002 | DE10134983A1 Arrangement for cooling integrated semiconducting components has cooling body extending from components on top of module board over end of board to components on bottom of board |
| 09/19/2002 | DE10110203A1 Elektronisches Bauteil mit gestapelten Halbleiterchips An electronic part having stacked semiconductor chips |
| 09/18/2002 | EP1241481A2 Contact structure for interconnections, interposer, semiconductor assembly and method |
| 09/18/2002 | EP1240810A1 A module including one or more chips |
| 09/18/2002 | EP1240808A2 Encapsulation for organic led device |
| 09/18/2002 | EP1240674A1 Light output enhancement using light emitting diodes |
| 09/18/2002 | CN1369854A Semiconductor device and its mfg. method and electronic camera installation |
| 09/17/2002 | US6452799 Integrated circuit cooling system |
| 09/17/2002 | US6452626 Communication devices incorporating reduced area imaging devices |
| 09/17/2002 | US6452279 Semiconductor device |
| 09/17/2002 | US6452278 Low profile package for plural semiconductor dies |
| 09/17/2002 | US6452266 Semiconductor device |
| 09/17/2002 | US6452261 Flat semiconductor device and power converter employing the same |
| 09/17/2002 | US6452260 Electrical interface to integrated circuit device having high density I/O count |
| 09/17/2002 | US6452259 Stacked substrate and semiconductor device |
| 09/17/2002 | US6452217 High power LED lamp structure using phase change cooling enhancements for LED lighting products |
| 09/17/2002 | US6452185 Method to correct energy determination in pixellated scinillation detectors |
| 09/17/2002 | US6451626 Three-dimensional stacked semiconductor package |
| 09/17/2002 | US6451624 Stackable semiconductor package having conductive layer and insulating layers and method of fabrication |
| 09/17/2002 | US6451150 Method of mass producing and packaging integrated optical subsystems |
| 09/17/2002 | US6450663 Light-emitting-diode arrangement |
| 09/12/2002 | WO2002071486A2 Mixed analog and digital integrated circuits |
| 09/12/2002 | WO2002047310A3 Display tile structure using organic light emitting materials |
| 09/12/2002 | US20020127868 Integrated circuits and methods for their fabrication |
| 09/12/2002 | US20020127839 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument |
| 09/12/2002 | US20020127837 Methods for forming a die package |
| 09/12/2002 | US20020127777 Semiconductor device and manufacturing method thereof |
| 09/12/2002 | US20020127775 Redistributed bond pads in stacked integrated circuit die package |
| 09/12/2002 | US20020127771 Multiple die package |
| 09/12/2002 | US20020127770 Die support structure |