| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/08/2002 | US20020106893 Structure and process for multi-chip chip attach with reduced risk of electrostatic discharge damage |
| 08/08/2002 | US20020106831 Method for laminating and mounting semiconductor chip |
| 08/08/2002 | US20020105789 Semiconductor package for multi-chip stacks |
| 08/08/2002 | US20020105096 Semiconductor device with connection terminals in the form of a grid array |
| 08/08/2002 | US20020105091 Dual package semiconductor device |
| 08/08/2002 | US20020105068 Stacked semiconductor device structure |
| 08/08/2002 | US20020105067 Semiconductor chip package |
| 08/08/2002 | US20020105061 Semiconductor device and manufacturing method thereof |
| 08/08/2002 | US20020105056 Arrangement of stacked, spherically-shaped semiconductors |
| 08/08/2002 | US20020104519 Resin sealed electronic device |
| 08/08/2002 | CA2435964A1 Method of manufacturing optical devices and related improvements |
| 08/07/2002 | EP1229583A1 Semiconductor device and its manufacturing method |
| 08/07/2002 | EP1229582A2 Thin-film semiconductor device and method of manufacturing the same |
| 08/07/2002 | EP1228535A1 Face-to-face chips |
| 08/07/2002 | EP1149417B1 Method for producing three-dimensional circuits |
| 08/07/2002 | CN1362785A High-frequency switch assembly and high-frequency instrument mounting said high-frequency switch assembly |
| 08/07/2002 | CN1362733A Semiconductor device and manufacture method thereof, circuit board and electronic apparatus |
| 08/07/2002 | CN1362459A Adhesive for connecting anisotropic circuit, circuit board connection method and connector |
| 08/06/2002 | US6429528 Multichip semiconductor package |
| 08/06/2002 | US6429511 Microcap wafer-level package |
| 08/06/2002 | US6429509 Integrated circuit with improved interconnect structure and process for making same |
| 08/06/2002 | US6429507 Electrical device including a leaded cell assembly |
| 08/06/2002 | US6429432 Gamma radiation isolation shield and method of use |
| 08/06/2002 | US6429386 Imbedded die-scale interconnect for ultra-high speed digital communications |
| 08/06/2002 | US6429381 High density interconnect multichip module stack and fabrication method |
| 08/06/2002 | US6429096 Method of making thinned, stackable semiconductor device |
| 08/06/2002 | US6429045 Structure and process for multi-chip chip attach with reduced risk of electrostatic discharge damage |
| 08/01/2002 | WO2002059969A1 Semiconductor device |
| 08/01/2002 | WO2002059952A2 Method of manufacturing optical devices and related improvements |
| 08/01/2002 | WO2001028003A9 Face-to-face chips |
| 08/01/2002 | US20020102870 Flexible circuit connector for stacked chip module |
| 08/01/2002 | US20020102829 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 08/01/2002 | US20020102769 Semiconductor device and fabrication method thereof |
| 08/01/2002 | US20020102763 Stacked semiconductor device including improved lead frame arrangement |
| 08/01/2002 | US20020101755 Memory module |
| 08/01/2002 | US20020100965 Semiconductor module and electronic component |
| 08/01/2002 | US20020100963 Semiconductor package and semiconductor device |
| 08/01/2002 | US20020100962 Unmolded package for a semiconductor device |
| 08/01/2002 | US20020100941 Thin-film semiconductor device and method of manufacturing the same |
| 08/01/2002 | US20020100600 Stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same |
| 08/01/2002 | DE10160638A1 Halbleiterbauelement Semiconductor device |
| 08/01/2002 | DE10156272A1 Multi-chip memory device for notebook computer, has several IC chips in common package whose control signal pads are connected to external terminals individually |
| 08/01/2002 | DE10136655C1 Multichipmodul in COB Bauweise, insbesondere CompactFlash Card mit hoher Speicherkapazität und Verfahren zur Herstellung desselben The same multi-chip module in COB construction, in particular CompactFlash card with high storage capacity and methods of making |
| 08/01/2002 | DE10102750A1 Schaltungsanordnung Circuitry |
| 08/01/2002 | DE10102359A1 Schaltungsanordnung mit in Chips angeordneten Halbleiterbauelementen Circuitry with chips arranged in semiconductor devices |
| 08/01/2002 | DE10102353A1 LED signal module has dust-tight thermally conducting leadthroughs providing thermally conducting connection from conducting tracks on first main board surface to second main surface |
| 08/01/2002 | DE10101875A1 Elektronisches Bauteil mit aufeinander gestapelten Halbleiterchips An electronic part having successive stacked semiconductor chips |
| 08/01/2002 | DE10101554A1 Lumineszenzdiode Light-emitting diode |
| 08/01/2002 | CA2434088A1 Method of manufacturing optical devices and related improvements |
| 07/31/2002 | EP1226611A1 Optical semiconductor housing and method for making same |
| 07/31/2002 | EP1226610A1 Optical semiconductor housing and method for making same |
| 07/31/2002 | EP1226609A1 Optical semiconductor housing and method for making same |
| 07/31/2002 | EP1050077A4 High-density computer modules with stacked parallel-plane packaging |
| 07/31/2002 | EP0809292B1 Power transistor module |
| 07/31/2002 | CN1361553A Optical device and its producing method and electronic device |
| 07/30/2002 | US6426877 Semiconductor device incorporating module structure |
| 07/30/2002 | US6426875 Heat sink chip package |
| 07/30/2002 | US6426561 Short-circuit-resistant IGBT module |
| 07/30/2002 | US6426560 Semiconductor device and memory module |
| 07/30/2002 | US6426549 Stackable flex circuit IC package and method of making same |
| 07/30/2002 | US6426240 Stackable flex circuit chip package and method of making same |
| 07/30/2002 | US6425678 Led obstruction lamp |
| 07/25/2002 | WO2002058152A2 Electronic circuit device and method for manufacturing the same |
| 07/25/2002 | WO2002058151A1 Circuit arrangement |
| 07/25/2002 | WO2002058150A1 Circuit arrangement with semiconductor elements arranged in chips |
| 07/25/2002 | WO2002058149A1 Power transistor with internally combined low-pass and band-pass matching stages |
| 07/25/2002 | US20020098619 Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing |
| 07/25/2002 | US20020097962 Single and multilayer waveguides and fabrication process |
| 07/25/2002 | US20020097566 Semiconductor module |
| 07/25/2002 | US20020096994 Image display unit and method of producing image display unit |
| 07/25/2002 | US20020096785 Semiconductor device having stacked multi chip module structure |
| 07/25/2002 | US20020096784 Semiconductor device and semiconductor device structure |
| 07/25/2002 | US20020096781 Semiconductor device and liquid crystal module using the same |
| 07/25/2002 | US20020096780 Structure of stacked integrated circuits and method for manufacturing the same |
| 07/25/2002 | US20020096762 Structure of stacked integrated circuits and method for manufacturing the same |
| 07/25/2002 | US20020096761 Structure of stacked integrated circuits and method for manufacturing the same |
| 07/25/2002 | US20020096755 Semiconductor device |
| 07/25/2002 | US20020096754 Stacked structure of integrated circuits |
| 07/25/2002 | US20020096752 Intercrossedly-stacked dual-chip semiconductor package and method of fabricating the same |
| 07/25/2002 | US20020096751 Integrated circuit structure having an adhesive agent and method for manufacturing the same |
| 07/25/2002 | US20020096730 Stacked package structure of image sensor |
| 07/25/2002 | US20020095786 Vertically mountable interposer, assembly and method |
| 07/25/2002 | DE10163799A1 Semiconductor chip substrate, used as an IC chip, has semiconductor chip arranged on substrate in such way that first hump is in contact with second hump |
| 07/24/2002 | EP1225635A2 Stacked multichip integrated semiconductor device including feed-through connections |
| 07/24/2002 | EP1225634A2 Press-contact type semiconductor device |
| 07/24/2002 | EP1225630A1 Method for making hybrid electronic circuits for active implantable medical devices |
| 07/24/2002 | EP1224698A1 Method for producing a microfunctional composite device |
| 07/24/2002 | EP0892987B1 Method for manufacturing multi-chip modules utilizing direct lead attach |
| 07/24/2002 | EP0878026B1 Led matrix |
| 07/23/2002 | US6424550 Compact half-bridge module in inert cooling fluid |
| 07/23/2002 | US6424532 Heat sink and memory module with heat sink |
| 07/23/2002 | US6424369 Hand-held computers incorporating reduced area imaging devices |
| 07/23/2002 | US6424224 Auxiliary circuitry for monolithic microwave integrated circuit |
| 07/23/2002 | US6424050 Semiconductor device |
| 07/23/2002 | US6424049 Semiconductor device having chip-on-chip structure and semiconductor chip used therefor |
| 07/23/2002 | US6424048 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them |
| 07/23/2002 | US6424035 Semiconductor bilateral switch |
| 07/23/2002 | US6424034 High performance packaging for microprocessors and DRAM chips which minimizes timing skews |
| 07/23/2002 | US6424033 Chip package with grease heat sink and method of making |
| 07/23/2002 | US6424031 Stackable package with heat sink |