| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 08/28/2002 | EP1235275A1 Semiconductor device |
| 08/28/2002 | EP1234344A2 Enhanced light extraction in leds through the use of internal and external optical elements |
| 08/28/2002 | EP1234339A1 Optical semiconductor housing and method for making same |
| 08/28/2002 | EP1234334A1 Micro-led arrays with enhanced light extraction |
| 08/28/2002 | EP1234331A1 Planar hybrid diode rectifier bridge |
| 08/28/2002 | CN1366352A Method and device for making LED generate white light |
| 08/28/2002 | CN1366207A Self luminescence display equipment |
| 08/27/2002 | US6442040 Embedded memory assembly |
| 08/27/2002 | US6442023 Electronic power device |
| 08/27/2002 | US6441520 Power module |
| 08/27/2002 | US6441497 Semiconductor device fabricated on multiple substrates and method for fabricating the same |
| 08/27/2002 | US6441496 Structure of stacked integrated circuits |
| 08/27/2002 | US6441484 Semiconductor device having switching elements around a central control circuit |
| 08/27/2002 | US6441483 Die stacking scheme |
| 08/27/2002 | US6441475 Chip scale surface mount package for semiconductor device and process of fabricating the same |
| 08/27/2002 | US6441474 Semiconductor device and liquid crystal module adopting the same |
| 08/27/2002 | US6441472 Semiconductor device and method of manufacturing the same |
| 08/27/2002 | US6441404 Multichip module |
| 08/27/2002 | US6441317 Semiconductor module and inverter device |
| 08/27/2002 | US6440775 Method and apparatus for edge connection between elements of an integrated circuit |
| 08/27/2002 | US6438825 Method to prevent intrusions into electronic circuitry |
| 08/22/2002 | WO2002023674A3 Thick film millimeter wave transceiver module |
| 08/22/2002 | WO2002017364A3 Micromechanical multichip module and method of making same |
| 08/22/2002 | US20020115414 RF oscillator apparatus and transceiver apparatus |
| 08/22/2002 | US20020115265 Method of transferring a device, a method of producing a device holding substrate, and a device holding substrate |
| 08/22/2002 | US20020115233 Semiconductor device and method for fabricating the same |
| 08/22/2002 | US20020114177 Vehicular modular design multiple application rectifier assembly |
| 08/22/2002 | US20020114143 Chip-scale packages stacked on folded interconnector for vertical assembly on substrates |
| 08/22/2002 | US20020114135 Heat sink chip package |
| 08/22/2002 | US20020113325 Semiconductor package and mounting structure on substrate thereof and stack structure thereof |
| 08/22/2002 | US20020113323 Integrated semiconductor circuit |
| 08/22/2002 | US20020113313 Semiconductor device bonding pad resistant to stress and method of fabricating the same |
| 08/22/2002 | US20020113303 Mounting structure for semiconductor devices |
| 08/22/2002 | US20020113247 Electronic device integrating an insulated gate bipolar transistor power device and a diode into a protective package |
| 08/22/2002 | US20020113246 Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units |
| 08/22/2002 | US20020113244 High power LED |
| 08/22/2002 | DE10203353A1 Halbleitermodul und elektronische Komponente Semiconductor and electronic component module |
| 08/22/2002 | DE10154556A1 Gestapelte Halbleiterbauelementestruktur Stacked semiconductor device structure |
| 08/22/2002 | DE10147955A1 Halbleitervorrichtung Semiconductor device |
| 08/22/2002 | DE10136283A1 Halbleiteranordnung Semiconductor device |
| 08/22/2002 | DE10103472A1 Halbleitermodul Semiconductor module |
| 08/22/2002 | DE10103339A1 Optokoppler, Lichtemittierende Anordnung, Lichterfassende Anordnung Optocouplers, light-emitting device, light barrel end arrangement |
| 08/21/2002 | EP1233528A1 High-frequency composite switch module |
| 08/21/2002 | EP1233444A2 Membrane dielectric isolation ic fabrication |
| 08/21/2002 | CN1365521A Semiconductor device, method of manufacturing electronic device, electronic device and portable information terminal |
| 08/21/2002 | CN1365144A Power source semiconductor module and cooling element for holding semiconductor module |
| 08/21/2002 | CN1365140A Method for producing semiconductor device and semiconductor device |
| 08/21/2002 | CN1089493C Power semiconductor module and its producing method |
| 08/21/2002 | CN1089492C Power semiconductor module |
| 08/20/2002 | US6438014 High speed access compatible memory module |
| 08/20/2002 | US6437990 Multi-chip ball grid array IC packages |
| 08/20/2002 | US6437984 Thermally enhanced chip scale package |
| 08/20/2002 | US6437446 Semiconductor device having first and second chips |
| 08/20/2002 | US6437435 Vertically mountable interposer, assembly and method |
| 08/20/2002 | US6437433 CSP stacking technology using rigid/flex construction |
| 08/20/2002 | US6436803 Manufacturing computer systems with fine line circuitized substrates |
| 08/20/2002 | US6436735 Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact |
| 08/15/2002 | WO2002063695A1 Insulated-gate bipolar transistor, semiconductor device, method of manufacturing insulated-gate bipolar transistor, and method of manufacturing semiconductor device |
| 08/15/2002 | WO2002063688A1 Hybrid integrated circuit device and method for fabricating the same and electronic device |
| 08/15/2002 | WO2002063678A1 Chip transfer method and apparatus |
| 08/15/2002 | WO2002062588A1 Electronic device and method of manufacturing the same |
| 08/15/2002 | WO2002025777A3 Press (non-soldered) contacts for high current electrical connections in power modules |
| 08/15/2002 | US20020111050 Press (non-soldered) contacts for high current electrical connections in power modules |
| 08/15/2002 | US20020111003 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 08/15/2002 | US20020110953 Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing |
| 08/15/2002 | US20020110952 Multiple-function electronic chip |
| 08/15/2002 | US20020109236 Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof |
| 08/15/2002 | US20020109235 Enhanced barrier liner formation for vias |
| 08/15/2002 | US20020109221 Method of forming a stack of packaged memory die and resulting apparatus |
| 08/15/2002 | US20020109216 Integrated electronic device and integration method |
| 08/15/2002 | US20020109211 Semiconductor device and method of manufacturing same |
| 08/15/2002 | US20020109203 Power transistor with internally combined low-pass and band-pass matching stages |
| 08/15/2002 | US20020109152 Power semiconductor module |
| 08/15/2002 | US20020109133 Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip |
| 08/15/2002 | US20020109109 Photo-conductive relay and method of making same |
| 08/15/2002 | US20020109074 Semiconductor device, optoelectronic board, and production methods therefor |
| 08/15/2002 | US20020108775 Electric circuit interconnection system using a virtual mirror cross over package |
| 08/15/2002 | US20020108768 I/C chip assembly and method of forming same |
| 08/14/2002 | EP1231639A1 Power module |
| 08/14/2002 | EP1231636A2 Semiconductor device, production method therefor, and electrophotographic apparatus |
| 08/14/2002 | EP1231635A1 Method for manufacturing an electronic power device and a diode in a same package |
| 08/14/2002 | EP1230711A1 Arrangement for electrically connecting chips in a circuit that is embodied in a three-dimensional manner |
| 08/14/2002 | EP1230686A1 Multi color solid state led/laser |
| 08/14/2002 | EP1088386B1 Half bridge module |
| 08/14/2002 | CN2505985Y New structure of image sense and detect module set |
| 08/14/2002 | CN1364319A Light-emitting semiconductor device and surface-emitting device |
| 08/14/2002 | CA2371413A1 Tiled microelectromechanical device modules and fabrication methods |
| 08/13/2002 | US6434008 Semiconductor device |
| 08/13/2002 | US6433424 Semiconductor device package and lead frame with die overhanging lead frame pad |
| 08/13/2002 | US6433422 Semiconductor integrated circuit having semiconductor packages for mounting integrated circuit chips on both sides of a substrate |
| 08/13/2002 | US6433421 Semiconductor device |
| 08/13/2002 | US6433419 Face-up semiconductor chip assemblies |
| 08/13/2002 | US6433418 Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism |
| 08/13/2002 | US6433415 Assembly of plurality of semiconductor devices |
| 08/13/2002 | US6433413 Three-dimensional multichip module |
| 08/13/2002 | US6433412 Semiconductor device and a method of manufacturing the same |
| 08/13/2002 | US6432741 Organic opto-electronic devices and method for making the same |
| 08/08/2002 | WO2002062118A1 A stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same |
| 08/08/2002 | WO2002061832A1 Unmolded package for a semiconductor device |
| 08/08/2002 | WO2002061814A2 Method of manufacturing optical devices and related improvements |