Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2002
10/22/2002US6469371 Non-contact type IC card and process for manufacturing same
10/22/2002US6469370 Semiconductor device and method of production of the semiconductor device
10/22/2002US6469358 Three color quantum well focal plane arrays
10/22/2002US6468891 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
10/22/2002US6468831 Method of fabricating thin integrated circuit units
10/22/2002US6468821 Method for fabricating semiconductor light-emitting unit
10/17/2002WO2002082543A1 Semiconductor device
10/17/2002WO2002082542A1 Power semiconductor device
10/17/2002WO2002082541A1 Power semiconductor device
10/17/2002WO2002082540A1 Semiconductor device, method of manufacture thereof, and semiconductor substrate
10/17/2002US20020152055 Design support system and design support method for multi-chip package
10/17/2002US20020151171 Semiconductor device and manufacturing method therefor, circuit substrate, and electronic apparatus
10/17/2002US20020151169 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them
10/17/2002US20020151103 Semiconductor device and method of manufacturing the same
10/17/2002US20020151102 Stacked semiconductor package structure having films and method for manufacturing the films
10/17/2002US20020149920 Semiconductor device incorporating module structure
10/17/2002US20020149919 Multi-chip module and fabricating method thereof
10/17/2002US20020149314 Led lamp
10/17/2002US20020149298 Electronic component and method of production thereof
10/17/2002US20020149119 Semiconductor device
10/17/2002US20020149117 Semiconductor device and its manufacturing method
10/17/2002US20020149116 Integrated circuit device and method for forming the same
10/17/2002US20020149102 Structure and method for fabrication of a leadless multi-die carrier
10/17/2002US20020149100 Vertically mountable interposer, assembly and method
10/17/2002US20020149098 Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate
10/17/2002US20020149097 Method and apparatus for package reduction in stacked chip and board assemblies
10/17/2002US20020149095 Stacked semiconductor device assembly with microelectronic spring contacts
10/17/2002US20020149094 Semiconductor device
10/17/2002US20020149086 Semiconductor device
10/17/2002US20020149055 Semiconductor device including insulating substrate formed of single-crystal silicon chip
10/17/2002US20020149034 Semiconductor chip and multi-chip module
10/17/2002US20020149009 Organic EL light emitting device and electronic apparatus
10/17/2002US20020148979 Methods and compositions for ionizing radiation shielding
10/17/2002US20020148946 Stacked structure of an image sensor and method for manufacturing the same
10/17/2002DE10205408A1 Semiconductor module comprises a housing closed on one side by a metallic heat conducting base which is connected to a metallic coated, electrically insulating heat conducting ceramic layer via a solder layer
10/17/2002DE10156769A1 Leistungshalbleitereinrichtung Power semiconductor device
10/17/2002DE10127947C1 Circuit device for power semiconductor module has intermediate circuit board with DC and AC terminals coupled to conductor paths of substrate incorporated in base body
10/16/2002EP1249876A2 Light emitting device
10/16/2002EP1249874A2 Light emitting device
10/16/2002EP1249870A2 Semiconductor device
10/16/2002EP1249869A2 Arrangement for cooling a power semiconductor device
10/16/2002EP0729652B1 Method for fabricating a contact structure for interconnections, interposer, semiconductor assembly
10/16/2002CN1374822A Illuminating device
10/16/2002CN1374694A Insulation substrate for semi-conductor and power modular
10/16/2002CN1374666A Formation of embedded capacitor polar plate sing thin dielectric
10/15/2002US6465961 Semiconductor light source using a heat sink with a plurality of panels
10/15/2002US6465953 Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices
10/15/2002US6465893 Stacked chip assembly
10/15/2002US6465790 Micro gamma camera with semiconducting detectors
10/15/2002US6465728 Spring clip for electronic device and heat sink assembly
10/15/2002US6465726 Protective sheet for solar battery module, method of fabricating the same and solar battery module
10/15/2002US6465336 Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module
10/15/2002US6465275 Method of forming a stack of packaged memory die and resulting apparatus
10/15/2002US6464373 Light emitting diode lighting with frustoconical reflector
10/10/2002WO2002080641A1 Power module
10/10/2002WO2002080309A1 High density packaging of electronic components
10/10/2002WO2002054451A3 Method for stacking integrated circuits
10/10/2002WO2001073241A9 Solar cell module and roof equipped with power generating function using it
10/10/2002US20020147478 Method for manufacturing hybrid electronic circuits for active implantable medical devices
10/10/2002US20020146862 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
10/10/2002US20020146860 Back-to-back semiconductor device module, assemblies including the same and methods
10/10/2002US20020146859 Semiconductor device and manufacturing method therefor
10/10/2002US20020145384 Led lamp
10/10/2002US20020145204 Semiconductor device
10/10/2002US20020145202 Semiconductor device fabricated on multiple substrates and method for fabricating the same
10/10/2002US20020145195 Composite material, and manufacturing method and uses of same
10/10/2002US20020145191 Semiconductor element, connection structure thereof, semiconductor device using a plurality of such elements and processes for making the same
10/10/2002DE10213701A1 Light emitting device comprises an inverted aluminum indium gallium nitride arrangement with a hetero-junction having an emission layer arranged between an n-conducting layer and a p-conducting layer, and electrodes
10/10/2002DE10134648A1 Stacked electronic component device has perpendicular pins providing mechanical and electrical connections between stacked electronic components
10/10/2002DE10109344C1 Schaltungsanordnung mit Halbbrücken Circuitry with half-bridge
10/09/2002EP1248296A1 Semiconductor laser element
10/09/2002EP1248295A2 Semiconductor element, connection structure thereof, semiconductor device using a plurality of such elements and processes for making the same
10/09/2002EP1247294A1 Packaging of integrated circuits and vertical integration
10/09/2002EP1247250A2 Chipcard arrangement
10/09/2002CN1373907A Light-emitting or light-receiving semiconductor device and method for fabricating same
10/09/2002CN1373906A Light-emitting or light-detecting semicondctor module and method of manufacture therefor
10/09/2002CN1373516A Memory device mfg. and assembling strcture and method
10/09/2002CN1092397C High-performance low-cost multi-chip module package
10/08/2002US6462950 Stacked power amplifier module
10/08/2002US6462475 Power saving environment protection bulb
10/08/2002US6462427 Semiconductor chip, set of semiconductor chips and multichip module
10/08/2002US6462422 Intercrossedly-stacked dual-chip semiconductor package
10/08/2002US6462421 Multichip module
10/08/2002US6462420 Semiconductor chip and semiconductor device having a chip-on-chip structure
10/08/2002US6462412 Foldable, flexible laminate type semiconductor apparatus with reinforcing and heat-radiating plates
10/08/2002US6462408 Contact member stacking system and method
10/08/2002US6462398 Semiconductor device and semiconductor assembly apparatus for semiconductor device
10/08/2002US6462382 MOS type semiconductor apparatus
10/08/2002US6461897 Multichip module having a stacked chip arrangement
10/08/2002US6461896 Process for mounting electronic device and semiconductor device
10/08/2002US6461895 Process for making active interposer for high performance packaging applications
10/08/2002US6461883 Method for manufacturing led array head and led array head prepared by using the same
10/03/2002WO2002078089A1 Ldmos transistor and power amplifier having a shared earth plane
10/03/2002WO2002078088A1 Method for assembling components of different thicknesses
10/03/2002WO2002078083A2 In-street integrated circuit wafer via
10/03/2002WO2002078055A2 Light extractor apparatus
10/03/2002WO2002051224A3 Multilayered hybrid electronic module
10/03/2002US20020142661 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
10/03/2002US20020142515 Contact member stacking system and method
10/03/2002US20020140500 Rectifying charge storage element
1 ... 319 320 321 322 323 324 325 326 327 328 329 330 331 332 333 334 335 336 337 338 339 ... 409