H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2002
12/26/2002	US20020197769 Semiconductor package with semiconductor chips stacked therein and method of making the package
12/26/2002	US20020196609 Power module
12/26/2002	US20020196440 Structure for aligning chips in stacked arrangement
12/26/2002	US20020195718 Process for mounting electronic device and semiconductor device
12/26/2002	US20020195717 Intercrossedly-stacked dual-chip semiconductor package and method of fabricating the same
12/26/2002	US20020195704 Multi-die module and method thereof
12/26/2002	US20020195698 Semiconductor device
12/26/2002	US20020195697 Stacked mass storage flash memory package
12/26/2002	US20020195696 Packaging substrate for electronic elements and electronic device having packaged structure
12/26/2002	US20020195676 Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system
12/26/2002	US20020195624 Method of making a semiconductor package including stacked semiconductor dies
12/26/2002	US20020195614 Ball grid array chip packages having improved testing and stacking characteristics
12/26/2002	US20020195563 Infrared sensor
12/26/2002	US20020195286 Power conversion apparatus and mobile object incorporating thereof
12/26/2002	US20020195270 High frequency module device and method for its preparation
12/26/2002	US20020195260 Extendible drain members for grounding RFI/EMI shielding
12/26/2002	US20020195138 Solar-cell-installed structure, and photovoltaic power generation system
12/25/2002	CN2528114Y Lamp string device
12/25/2002	CN2528113Y Multi-chip packaging assembly
12/25/2002	CN2528109Y Packaged memory body for packaging multiple memory body chip
12/25/2002	CN1387746A Printed circuit board assembly
12/25/2002	CN1387259A Elastic combined slot for programmable multi-chip module
12/25/2002	CN1387240A Method for mfg. stacked semiconductor device
12/25/2002	CN1387239A Circuit board, semiconductor device mfg. method, and electroplating system
12/25/2002	CN1387003A Luminous electronic tube
12/25/2002	CN1386609A Weld ball structure for electronic package
12/24/2002	US6498592 Display tile structure using organic light emitting materials
12/24/2002	US6498393 Semiconductor device and method for the fabrication thereof
12/24/2002	US6498392 Semiconductor devices having different package sizes made by using common parts
12/24/2002	US6498388 Semiconductor module with improved solder joint reliability
12/24/2002	US6498355 High flux LED array
12/24/2002	US6498308 Semiconductor module
12/24/2002	US6498074 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners
12/24/2002	US6498053 Process of manufacturing a composite structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material
12/19/2002	WO2002101831A1 Semiconductor device and its manufacturing method
12/19/2002	WO2002101642A1 Ic card
12/19/2002	US20020192895 Fabrication techniques for addressing cross-point diode memory arrays
12/19/2002	US20020192869 Semiconductor package and fabrication method of the same
12/19/2002	US20020192867 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof
12/19/2002	US20020192866 Semiconductor device and semiconductor chip for use therein
12/19/2002	US20020192865 Process for mounting electronic device and semiconductor device
12/19/2002	US20020192863 Multimedia chip package
12/19/2002	US20020192855 Semiconductor device and method for manufacturing the same
12/19/2002	US20020191835 Capacitive alignment structure and method for chip stacking
12/19/2002	US20020191403 High intensity light source arrangement
12/19/2002	US20020191393 Safe light emitting device
12/19/2002	US20020191383 Stackable ball grid array package
12/19/2002	US20020190758 Trading off gate delay versus leakage current using device stack effect
12/19/2002	US20020190396 Method and apparatus for removing encapsulating material from a packaged microelectronic device
12/19/2002	US20020190392 Semiconductor device and manufacturing method thereof
12/19/2002	US20020190391 Semiconductor device
12/19/2002	US20020190375 Semiconductor device and method of production of same
12/19/2002	US20020190374 Semiconductor device
12/19/2002	US20020190371 Semiconductor device and method of production of same
12/19/2002	US20020190368 Semiconductor laminated module
12/19/2002	US20020190367 Slice interconnect structure
12/19/2002	US20020190365 Non-contact type IC card and process for manufacturing-same
12/19/2002	US20020190354 Semiconductor package and fabrication method of the same
12/19/2002	US20020190317 Semiconductor module having multiple semiconductor chips
12/19/2002	US20020190285 Power supply apparatus using power semiconductor switching element
12/19/2002	US20020190262 Light emitting device
12/19/2002	US20020189093 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
12/19/2002	US20020189092 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
12/19/2002	DE10161593A1 Flacher Halbleiterstapel Flat semiconductor stack
12/19/2002	DE10127351A1 Electronic chip comprises several external contacts of which at least two are provided with a plurality of nano-tubes for purposes of contacting an external contact of another electronic chip
12/19/2002	DE10123198A1 Housing with circuit-board arrangement, has part of heat-sink extending through opening in circuit-board
12/18/2002	EP1267408A2 Composite integrated circuit and its fabrication method
12/18/2002	EP1267403A2 Flexible substrate, semiconductor device, imaging device, radiation imaging device and radiation imaging system
12/18/2002	EP1267402A2 Semiconductor device and method of production of same
12/18/2002	EP1267401A2 Semiconductor device and method of production of same
12/18/2002	EP1267399A2 Electronic device having a cap body sealed to a substrate and method for manufacturing the same
12/18/2002	EP1266863A2 Multi-level integrated circuit for wide-gap substrate bonding
12/18/2002	EP1266412A1 Method and device for transferring spin-polarized charge carriers
12/17/2002	US6496375 Cooling arrangement for high density packaging of electronic components
12/17/2002	US6496040 Trading off gate delay versus leakage current using device stack effect
12/17/2002	US6495913 Semiconductor clamped-stack assembly
12/17/2002	US6495895 Bi-level multilayered microelectronic device package with an integral window
12/17/2002	US6495814 Photo sensor with signal processing circuit
12/17/2002	US6495396 Method of coupling and aligning semiconductor devices including multi-chip semiconductor devices
12/17/2002	CA2204124C Trichromatic sensor
12/12/2002	WO2002099883A2 Electronic device and relative fabrication method
12/12/2002	WO2002099878A1 Power semiconductor module
12/12/2002	WO2002099845A2 Electronic chip and electronic chip assembly
12/12/2002	WO2002099399A1 Method and apparatus for infrared-spectrum imaging
12/12/2002	WO2002099395A1 Article comprising ir-reflective multi-well plates
12/12/2002	US20020187588 Stacked semiconductor device manufacturing method
12/12/2002	US20020187587 Method of manufacturing a semiconductor structure having stacked semiconductor devices
12/12/2002	US20020187586 Multi chip semiconductor package and method of construction
12/12/2002	US20020187570 Method for manufacturing light emitting diode devices
12/12/2002	US20020186552 Module component and method of manufacturing the same
12/12/2002	US20020186545 Power module
12/12/2002	US20020186543 Circuit arrangement
12/12/2002	US20020185968 Light source device
12/12/2002	US20020185744 Semiconductor device and a method of manufacturing the same
12/12/2002	US20020185737 Multi-level integrated circuit for wide-gap substrate bonding
12/12/2002	US20020185729 Thermally enhanced high density semiconductor package
12/12/2002	US20020185725 Low profile multi-IC chip package connector
12/12/2002	US20020185724 Mechanically registered and interconnected chip
12/12/2002	US20020185723 Flat-type semiconductor stack
12/12/2002	US20020185650 Photocoupler, method for fabricating the same and photocoupler fabrication apparatus

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