| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/16/2002 | US20020056911 Semiconductor device |
| 05/16/2002 | US20020056899 Semiconductor chip and semiconductor device having a chip-on-chip structure |
| 05/16/2002 | DE10141701A1 Compact, multidirectional LED light set for replacing conventional light sources |
| 05/16/2002 | DE10122931A1 Halbleitermodul Semiconductor module |
| 05/16/2002 | DE10030144A1 Halbleitervorrichtung und zugehörige Einbaustruktur Semiconductor device and associated mounting structure |
| 05/15/2002 | CN2491922Y Traffic signal lamp device |
| 05/15/2002 | CN1349660A Security method and device for a chip stack with a multidimensional structure |
| 05/15/2002 | CN1349257A Embedded IC module |
| 05/15/2002 | CN1349205A Method for assembling components |
| 05/14/2002 | US6388333 Semiconductor device having protruding electrodes higher than a sealed portion |
| 05/14/2002 | US6388320 Vertically integrated semiconductor configuration |
| 05/14/2002 | US6388319 Three commonly housed diverse semiconductor dice |
| 05/14/2002 | US6388318 Surface mount-type package of ball grid array with multi-chip mounting |
| 05/14/2002 | US6388316 Semiconductor module |
| 05/14/2002 | US6388313 Multi-chip module |
| 05/14/2002 | US6388312 Repairable multi-chip package |
| 05/14/2002 | US6388264 Optocoupler package being hermetically sealed |
| 05/14/2002 | US6388200 Electronic interconnection medium having offset electrical mesh plane |
| 05/14/2002 | US6387730 Hybrid S.C. devices and method of manufacture thereof |
| 05/14/2002 | US6387728 Method for fabricating a stacked chip package |
| 05/10/2002 | WO2001082377A3 Circuit |
| 05/09/2002 | US20020055200 Process of mounting elements and optical transmission apparatus |
| 05/09/2002 | US20020053743 Multichip semiconductor package |
| 05/09/2002 | US20020053742 IC package and its assembly method |
| 05/09/2002 | US20020053734 Probe card assembly and kit, and methods of making same |
| 05/09/2002 | US20020053732 Semiconductor device |
| 05/09/2002 | US20020053730 Semiconductor device and production process thereof |
| 05/09/2002 | US20020053728 Panel stacking of BGA devices to form three-dimensional modules |
| 05/09/2002 | US20020053727 Semiconductor device |
| 05/09/2002 | US20020053726 Semiconductor device attaining both high speed processing and sufficient cooling capacity |
| 05/09/2002 | US20020053723 Semiconductor module |
| 05/09/2002 | US20020053722 Semiconductor device, semiconductor module and hard disk |
| 05/09/2002 | US20020053450 Wafer-level package |
| 05/09/2002 | US20020053127 Method for manufacturing radio frequency module components with surface acoustic wave element |
| 05/08/2002 | EP1204305A2 Device comprising an electrical circuit carried by a carrier element and method for the manufacture of such a device |
| 05/08/2002 | EP1204144A1 Led lamp apparatus |
| 05/08/2002 | DE10102619A1 Power module for supplying electric motors has corrugated heat sink attached to underside of thick thermally conductive base |
| 05/08/2002 | DE10102440C1 Interference suppression circuit for integrated circuit |
| 05/08/2002 | CN1348609A Flexible organic electronic device with improved resistance to oxygen and moisture degradation |
| 05/08/2002 | CN1348216A Stacked semiconductor device |
| 05/08/2002 | CN1348213A 半导体装置和半导体模块 Semiconductor device and semiconductor module |
| 05/08/2002 | CN1348114A Method for producing surface illuminating back light apparatus and surface illuminating back light apparatus |
| 05/07/2002 | US6384701 Microwave and millimeter wave device mounted on a semiconductive substrate and comprised of different kinds of functional blocks |
| 05/07/2002 | US6384492 Power semiconductor packaging |
| 05/07/2002 | US6384473 Microelectronic device package with an integral window |
| 05/07/2002 | US6384313 Solar cell module and method of producing the same |
| 05/07/2002 | US6383845 Stacked semiconductor device including improved lead frame arrangement |
| 05/07/2002 | US6383844 Multi-chip bonding method and apparatus |
| 05/07/2002 | US6383840 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 05/07/2002 | US6383839 Vertically mountable semiconductor device and methods |
| 05/07/2002 | US6383837 Method of manufacturing a multi-chip semiconductor device effective to improve alignment |
| 05/07/2002 | US6383835 IC package having a conductive material at least partially filling a recess |
| 05/07/2002 | US6383664 Multilayer; covering having raised edge |
| 05/07/2002 | US6383576 High frequency generation of plasma to decompose film forming gas; applying self-bias and direct current voltage; controlling incidence of postive ions generated; photovoltaic element with plurality of pin junctions |
| 05/02/2002 | WO2002035613A1 Light-emitting or light-detecting semiconductor module and method of manufacture thereof |
| 05/02/2002 | WO2002035612A1 Light-emitting or light-receiving semiconductor device and method for fabricating the same |
| 05/02/2002 | WO2001099194A3 Semiconductor arrangement |
| 05/02/2002 | WO2000045420A9 Multiple chip module with integrated rf capabilities |
| 05/02/2002 | US20020053040 Semiconductor integrated device |
| 05/02/2002 | US20020052633 Stackable microelectronic components with self-addressing scheme |
| 05/02/2002 | US20020052105 Chip package with grease heat sink and method of making |
| 05/02/2002 | US20020052061 Silicon wafer with embedded optoelectronic material for monolithic OEIC |
| 05/02/2002 | US20020051352 Stackable ball grid array package |
| 05/02/2002 | US20020051348 Electronic components mounting structure |
| 05/02/2002 | US20020050958 Contrast enhancement for an electronic display device by using a black matrix and lens array on outer surface of display |
| 05/02/2002 | US20020050639 Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer |
| 05/02/2002 | US20020050638 Condensed memory matrix |
| 05/02/2002 | US20020050635 Integrated circuit device |
| 05/02/2002 | US20020050634 Semiconductor device with stacked memory and logic substrates and method for fabricating the same |
| 05/02/2002 | US20020050633 Semiconductor module |
| 05/02/2002 | US20020050510 Metal-ceramic circuit board and manufacturing method thereof |
| 05/02/2002 | US20020050398 Stress resistant land grid array (LGA) module and method of forming the same |
| 05/02/2002 | US20020050378 Double-layered multiple chip module package |
| 05/02/2002 | US20020050376 Configuration of a plurality of circuit modules |
| 05/02/2002 | US20020050371 Radiation shielding of three dimensional multi-chip modules |
| 05/02/2002 | US20020050287 Protective sheet for solar battery module, method of fabricating the same and solar battery module |
| 05/02/2002 | DE10109329C1 Circuit has power stage with heat generating components mounted around component(s) that generates less heat mounted in inner region, conducting metal body mounted on cooling body |
| 05/02/2002 | DE10052398A1 Holder for semiconducting lamp has LED pivotably clamped between two sprung metal current carrying strips whose other ends have current connection pins for soldering or plug-in |
| 05/02/2002 | DE10051159A1 LED-Modul, zB Weißlichtquelle LED module, eg white light source |
| 05/02/2002 | CA2671924A1 Light-emitting or light-receiving semiconductor module and method for making the same |
| 05/01/2002 | CN1347154A Semiconductor device and semiconductor assembly |
| 05/01/2002 | CN1347146A Semiconductor device with silicon structure on insulator, and method for mfg. same |
| 05/01/2002 | CN1084050C Electronic component comprising thin-film structure with passive elements |
| 04/30/2002 | US6381161 Low-inductance circuit arrangement |
| 04/30/2002 | US6381141 Integrated device and method for routing a signal through the device |
| 04/30/2002 | US6380681 Video Display and manufacturing method therefor |
| 04/30/2002 | US6380631 Apparatus and methods of packaging and testing die |
| 04/30/2002 | US6380630 Vertical surface mount package utilizing a back-to-back semiconductor device module |
| 04/30/2002 | US6380629 Wafer level stack package and method of fabricating the same |
| 04/30/2002 | US6380624 Stacked integrated circuit structure |
| 04/30/2002 | US6380617 Electrode terminal connection structure of semiconductor module |
| 04/30/2002 | US6380616 Semiconductor component with a number of substrate layers and at least one semiconductor chip, and method of producing the semiconductor component |
| 04/30/2002 | US6380615 Chip size stack package, memory module having the same, and method of fabricating the module |
| 04/30/2002 | US6380613 Semiconductor device |
| 04/30/2002 | US6380563 Opto-electric mounting apparatus |
| 04/30/2002 | US6380492 Contact film used for devices having ball grid array structure and device mounting structure |
| 04/30/2002 | US6380479 Photovoltaic element and method for manufacture thereof |
| 04/30/2002 | US6379998 Semiconductor device and method for fabricating the same |
| 04/30/2002 | US6379982 Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing |
| 04/30/2002 | CA2253989C Light emitting diode jig |